Patents by Inventor Haruo Ohya

Haruo Ohya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5164905
    Abstract: The present invention provides a carrier jig for use in processing, transporting and stocking a wafer-like material used in manufacture processes of semiconductor products, and a semiconductor production system using the carrier jig. The carrier jig of the present invention comprises a holder for holding and storing therein one wafer, for example, and a container box for loading therein the holder. A mechanism for transferring wafers by the use of the carrier jig is provided in each process, with the result the period of production time can be shortened and the production speed can be enhanced.
    Type: Grant
    Filed: December 12, 1991
    Date of Patent: November 17, 1992
    Assignee: Hitachi, Ltd.
    Inventors: Takemasa Iwasaki, Sadao Shimoyashiro, Haruo Ohya, Hiroshi Kikuchi, Tsutomu Takahashi, Masahiro Watanabe
  • Patent number: 5100276
    Abstract: The present invention provides a carrier jig for use in processing, transporting and stocking a wafer-like material used in manufacture processes of semiconductor products, and a semiconductor production system using the carrier jig. The carrier jig of the present invention comprises a holder for holding and storing therein one wafer, for example, and a container box for loading therein the holder. A mechanism for transferring wafers by the use of the carrier jig is provided in each process, with the result the period of production time can be shortened and the production speed can be enhanced.
    Type: Grant
    Filed: August 11, 1988
    Date of Patent: March 31, 1992
    Assignee: Hitachi, Ltd.
    Inventors: Takemasa Iwasaki, Sadao Shimoyashiro, Haruo Ohya, Hiroshi Kikuchi, Tsutomu Takahashi, Masahiro Watanabe