Patents by Inventor Haruo Takao

Haruo Takao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6563211
    Abstract: A semiconductor device for controlling electricity including a metal base plate and at least one insulating substrate. The insulating substrate includes an insulator plate, a back-side pattern on a back face of the insulator plate and bonded to the metal base plate, and two circuit patterns located on a front face of the insulator plate and above the back-side pattern. Each of the two circuit patterns has an “L” shape and extends along two sides of the insulator plate that are continued and perpendicular to each other. The two circuit patterns are also arranged at opposed corners of the insulator plate in a centrosymmetrical relation each other. Further, in each circuit pattern, a switching element is sandwiched between a free-wheel diode and an electrode area.
    Type: Grant
    Filed: February 26, 2001
    Date of Patent: May 13, 2003
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Masakazu Fukada, Hiroshi Nishibori, Takanobu Yoshida, Naoki Yoshimatsu, Nobuyoshi Kimoto, Haruo Takao
  • Publication number: 20020060356
    Abstract: It is an object to provide a power semiconductor device having a circuit pattern and a lower pattern made of an Al alloy for cost reduction and enabling reduction in heat resistance and improvement in resistance of a soldering layer to heat cycle. A substrate of semiconductor elements is mounted on a metal base plate made of a Cu alloy. The substrate of semiconductor elements includes an insulating substrate made of ceramics or the like. The circuit pattern and the lower pattern both made of an Al alloy are formed on an upper surface and a lower surface of the insulating substrate. The lower pattern is provided on an entire surface of the insulating substrate and joined onto the metal base plate through the soldering layer. Thicknesses of the metal base plate and the insulating substrate are respectively set to be 3.5 to 5.5 mm and 0.5 to 1 mm, for example. A thickness of the circuit pattern is set to be 0.4 to 0.6 mm and thicknesses of the lower pattern and the soldering layer are respectively set to be 0.
    Type: Application
    Filed: May 1, 2001
    Publication date: May 23, 2002
    Applicant: MITSUBISHI DENKI KABUSHIKI KAISHA
    Inventors: Hiroshi Nishibori, Masakazu Fukada, Takanobu Yoshida, Naoki Yoshimatsu, Haruo Takao, Nobuyoshi Kimoto, Yasumi Uegai
  • Publication number: 20020047132
    Abstract: A semiconductor device for controlling electricity includes:
    Type: Application
    Filed: February 26, 2001
    Publication date: April 25, 2002
    Applicant: MITSUBISHI DENKI KABUSHIKI KAISHA
    Inventors: Masakazu Fukada, Hiroshi Nishibori, Takanobu Yoshida, Naoki Yoshimatsu, Nobuyoshi Kimoto, Haruo Takao
  • Patent number: 5814878
    Abstract: A semiconductor device including a plurality of grooves (21) formed on a top surface of a heat sink (51). A sealing resin (2) fills a portion between a lead frame (5) provided facing the top surface and the heat sink (51). The grooves (21) are formed on both sides of a center region (22) extending so as to divide the top surface in two. A power semiconductor element (11) is disposed above the center region (22) and a controlling semiconductor element (16) controlling the power semiconductor element (11) is disposed above the region where the grooves (21) are formed. The above construction suppresses thermal resistance interposed in a path through which heat loss in the power semiconductor element (11) is radiated to the heat sink (51) and improves heat radiating efficiency while maintaining close contact between the sealing resin (2) and the heat sink (51).
    Type: Grant
    Filed: June 17, 1996
    Date of Patent: September 29, 1998
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Satoshi Hirakawa, Haruo Takao
  • Patent number: 5698899
    Abstract: It is an object to increase a breakdown voltage of a lead frame. A primary sealing resin (41) seals the upper main surface of a lead frame (3) and elements mounted thereon. A secondary sealing resin (21) coupling the lead frame (3) and a heat sink (51) passes through gaps of the lead frame (3) having pattern configuration to project on the upper main surface side of the lead frame (3). The primary sealing resin (41) is in close contact with the projections (62). The projections (62) enlarge the creeping distance along the interface between the primary sealing resin (41) and the secondary sealing resin (21) between parts of the lead frame (3) adjacent with gaps therebetween, so that the breakdown voltage between those parts is increased.
    Type: Grant
    Filed: June 20, 1996
    Date of Patent: December 16, 1997
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Satoshi Hirakawa, Haruo Takao
  • Patent number: 3984897
    Abstract: A gilling machine having a pair or set of spirally threaded faller screws for advancing gill bars spanning the space between the screws and advancing them in a forward direction with portions of the screws held or engaged by the spiral threads of the faller screws. A first pair of axially spaced wheels which have peripheral notches thereon corresponding with the pitch of the faller screws receive the gill bars from advance or upper faller screws and transfer them to a pair of parallel spaced backward-movement or lower faller screws that move the gill bars in a direction opposite to the forward movement, namely a backward direction. A second pair of axially spaced wheels receive the gill bars from the backward-movement faller screws and transfer them to the forward or advance faller screws.
    Type: Grant
    Filed: January 8, 1975
    Date of Patent: October 12, 1976
    Inventor: Haruo Takao