Abstract: The present invention relates to a mounting structure for electronic apparatus mounting electronic parts with a high mounting density. The present invention is capable of supplying power to a printed wiring board from a power supply without a voltage drop through a very short wiring distance. Both the power supply and printed wiring board are cooled with a common air cooling fan, and the power supply, bus plate and printed wiring board are integrally assembled and connected.

Abstract: A flexible current feeding post for electronic modular assemblies interconnects parallel oriented substrates such as printed circuit boards having electrical circuits mounted thereon and bus plates for power supply, for both mechanical assembly and current distribution. The flexible current feeding post comprises a solid, cylindrical stud for connection to a contact surface of one substrate, a conductive bellows connected to the stud and means connecting the conductive bellows to a contact surface of a second substrate, spaced from the first substrate by a desired distance and generally parallel thereto.