Abstract: A cutter wheel for scribing a brittle material substrate having excellent biting in the surface of the brittle material substrate when the brittle material substrate used for a liquid crystal display panel or the like is cut and a method for manufacturing the cutter wheel with high productivity are provided. The cutter wheel made of a hard metal or sintered diamond is formed in such a manner that a V-shaped ridge line part is formed as an edge along the circumferential part of a disk-like wheel, and at least one notch is engraved in the above described ridge line part and notches as that described above are formed in the entirety of the periphery of the above described ridge line part at a pitch of more than 200 ?m.

Abstract: A cutter wheel for scribing a brittle material substrate having excellent biting in the surface of the brittle material substrate when the brittle material substrate used for a liquid crystal display panel or the like is cut and a method for manufacturing the cutter wheel with high productivity are provided. The cutter wheel made of a hard metal or sintered diamond is formed in such a manner that a V-shaped ridge line part is formed as an edge along the circumferential part of a disk-like wheel, and at least one notch is engraved in the above described ridge line part and notches as that described above are formed in the entirety of the periphery of the above described ridge line part at a pitch of more than 200 ?m.

Abstract: A vertical crack is generated at a desired position on a brittle material substrate S by making a wheel tip 5a of a glass cutter 5 move while being in contact with the substrate surface by a load which does not allow the wheel tip 5a to damage the surface, using an armature 6 applying an abrupt impact force for generating the vertical crack having a predetermined depth, to the glass cutter 5 moving on the substrate. A scribe line is formed as the vertical crack is urged to extend along a planned scribe line, due to a stress gradient exerted onto the vertical crack and occurring between a compressive stress in an irradiation area on the substrate at which a laser beam is irradiated from a laser beam oscillator 8 and a tensile stress in a cooling area made by a cooling medium released from a cooling nozzle 7.

Abstract: A scribing wheel for a brittle material includes a circumferential ridgeline in which two truncated cones have connected bottoms so as to share a rotational axis. Alternating notches and protrusions are formed along the circumference ridgeline. The protrusion are portions of the ridgeline remaining after the ridgeline is notched. The length of the notches is less than that of the protrusions so that a catch on the surface is improved while lowering the high penetrability.

Abstract: A scribing wheel for a brittle material includes a circumferential ridgeline in which two truncated cones have connected bottoms so as to share a rotational axis. Alternating notches and protrusions are formed along the circumference ridgeline. The protrusion are portions of the ridgeline remaining after the ridgeline is notched. The length of the notches is less than that of the protrusions so that a catch on the surface is improved while lowering the high penetrability.

Abstract: A cutter wheel for scribing a brittle material substrate having excellent biting in the surface of the brittle material substrate when the brittle material substrate used for a liquid crystal display panel or the like is cut and a method for manufacturing the cutter wheel with high productivity are provided. The cutter wheel made of a hard metal or sintered diamond is formed in such a manner that a V-shaped ridge line part is formed as an edge along the circumferential part of a disk-like wheel, and at least one notch is engraved in the above described ridge line part and notches as that described above are formed in the entirety of the periphery of the above described ridge line part at a pitch of more than 200 ?m.

Abstract: A scribing wheel for a brittle material includes a circumferential ridge line in which two truncated cones have connected bottoms so as to share a rotational axis. Alternating notches and protrusions are formed along the circumference ridge line. The protrusion are portions of the ridge line remaining after the ridge line is notched. The length of the notches is less than that of the protrusions so that a catch on the surface is improved while lowering the high penetrability.

Abstract: A scribing wheel for a brittle material, comprising: an outer peripheral portion around which a circumference ridgeline is formed, where two truncated cones have connected bottoms so as to share the same rotational axis; and a number of alternating notches and protrusions which are formed in the direction of the circumference along the above described circumference ridgeline, wherein the above described protrusions are formed of portions of the above described circumference ridgeline which remain after the above described circumference ridge line is notched and have a length in the direction of the circumference so that a scribe line is drawn on the above described brittle material substrate and a vertical crack extending from the scribe line in the direction of the thickness of a brittle material substrate is formed when the scribing wheel is rotated in such a state as to be pressed against the above described brittle material substrate, wherein the length of the notches in the direction of the circumference

Abstract: In a flat display panel wherein two plates made of a brittle material are adhered to each other, at least one of the two plates has a plane on which a scribing line is formed, and the plane of the at least one of the plates on which a scribing line is formed is opposed to a plane of the other of the at least one of the two plates on which no scribing line is formed. In one case, the two plates have planes on which scribing is performed, while in another case, only one of the two plates has a plane on which scribing is performed. In the latter case, scribing may be performed on the other of the two plates after the two plates are adhered.

Abstract: A cutter wheel for scribing a brittle material substrate having excellent biting in the surface of the brittle material substrate when the brittle material substrate used for a liquid crystal display panel or the like is cut and a method for manufacturing the cutter wheel with high productivity are provided. The cutter wheel made of a hard metal or sintered diamond is formed in such a manner that a V-shaped ridge line part is formed as an edge along the circumferential part of a disk-like wheel, and at least one notch is engraved in the above described ridge line part and notches as that described above are formed in the entirety of the periphery of the above described ridge line part at a pitch of more than 200 ?m.

Abstract: A vertical crack is generated at a desired position on a brittle material substrate S by making a wheel tip 5a of a glass cutter 5 move while being in contact with the substrate surface by a load which does not allow the wheel tip 5a to damage the surface, using an armature 6 applying an abrupt impact force for generating the vertical crack having a predetermined depth, to the glass cutter 5 moving on the substrate. A scribe line is formed as the vertical crack is urged to extend along a planned scribe line, due to a stress gradient exerted onto the vertical crack and occurring between a compressive stress in an irradiation area on the substrate at which a laser beam is irradiated from a laser beam oscillator 8 and a tensile stress in a cooling area made by a cooling medium released from a cooling nozzle 7.

Abstract: A silicon wafer 50 including a plurality of semiconductor devices patterned on a top surface thereof as a result of a wafer production process is prepared. A transparent film is applied on the top surface of the semiconductor wafer 50 so as to cover all the plurality of semiconductor devices. The semiconductor wafer with the transparent film is placed on a rotatable table 26 such that a rear surface of the semiconductor wafer not covered with the transparent film is facing up away from the rotatable table 26. The rear surface of the semiconductor wafer 50 is heated with a laser beam to form a laser spot, along a scribe line formation line for dividing the semiconductor wafer into a plurality of semiconductor chips, to a temperature lower than a softening point of the semiconductor wafer, while an area close to the laser spot is continuously cooled along the scribe line formation line.

Abstract: A scribing head 1 of this invention raises and lowers a scribing cutter by rotation of a servomotor 3. As a scribe pressure, a rotational torque of the servomotor 3 is transmitted to the scribing cutter. To form a scribe line across another scribe line which is formed earlier, the scribe pressure is raised temporarily when the scribing head passes the scribe line which is formed earlier. The rotational torque of the servomotor 3 is controlled at any of preset limits while the position of a cutter 6 of the scribing head shifts on the brittle substrate. The servomotor 3 is driven under position-control mode.

Abstract: In a flat display panel wherein two plates made of a brittle material are adhered to each other, at least one of the two plates has a plane on which a scribing line is formed, and the plane of the at least one of the plates on which a scribing line is formed is opposed to a plane of the other of the at least one of the two plates on which no scribing line is formed. In a case, the two plates have planes on which scribing is performed, while in another case, only one of the two plates has a plane on which scribing is performed. In the latter case, scribing may be performed on the other of the two plates after the two plates are adhered.

Abstract: A silicon wafer 50 including a plurality of semiconductor devices patterned on a top surface thereof as a result of a wafer production process is prepared. A transparent film is applied on the top surface of the semiconductor wafer 50 so as to cover all the plurality of semiconductor devices. The semiconductor wafer with the transparent film is placed on a rotatable table 26 such that a rear surface of the semiconductor wafer not covered with the transparent film is facing up away from the rotatable table 26. The rear surface of the semiconductor wafer 50 is heated with a laser beam to form a laser spot, along a scribe line formation line for dividing the semiconductor wafer into a plurality of semiconductor chips, to a temperature lower than a softening point of the semiconductor wafer, while an area close to the laser spot is continuously cooled along the scribe line formation line.

Abstract: A cutter wheel for brittle materials includes a disk with two side planes and an outer peripheral portion between the planes. The outer peripheral portion includes two bevel portions and a ridge portion between the bevel portions. The ridge portion has a plurality of peaks aligned along a circumferential line. For example, the ridge portion includes a straight line connecting two adjacent peaks in the plurality of peaks. Alternatively, the ridge portion is a depression between two adjacent peaks in the plurality of peaks, and the depth of the depression is deeper than the straight line connecting the two adjacent peaks. Preferably, the peaks are spaced apart at an equal distance.

Abstract: A scribing head 1 of this invention raises and lowers a scribing cutter by rotation of a servomotor 3. As a scribe pressure, a rotational torque of the servomotor 3 is transmitted to the scribing cutter. To form a scribe line across another scribe line which is formed earlier, the scribe pressure is raised temporarily when the scribing head passes the scribe line which is formed earlier. The rotational torque of the servomotor 3 is controlled at any of preset limits while the position of a cutter 6 of the scribing head shifts on the brittle substrate. The servomotor 3 is driven under position-control mode.

Abstract: It is possible by use of a disclosed cutter wheel to obtain deep vertical cracks inside brittle materials while suppressing generation of horizontal cracks. Such a cutter wheel for brittle materials comprises a disk with two side planes and an outer periphery between them, outer periphery comprising two bevel portions and a ridge portion between them. The ridge portion comprises a plurality of peaks aligned along a circumferential line. For example, the ridge portion comprises a straight line connecting two adjacent peaks in the plurality of peaks. Alternatively, the ridge portion comprises a depression between two adjacent peaks in the plurality of peaks, and the depth of the depression is deeper than the straight line connecting between the two adjacent peaks. Preferably, the peaks are arranged at an equal distance between them.

Abstract: A glass cutting disc forms a scribed line on a surface of a glass product along which the glass product can be broken when an external force is applied thereto. The glass cutting disc includes an outer peripheral portion radially outwardly beveled to define a peripheral ridge. The peripheral ridge has surface features formed thereon so as to alternate in a direction circumferentially of the cutting disc. The surface features may be in the form of protrusions and grooves that alternate with each other over the peripheral ridge.

Abstract: A scribing head 1 of this invention raises and lowers a scribing cutter by rotation of a servomotor 3. As a scribe pressure, a rotational torque of the servomotor 3 is transmitted to the scribing cutter. To form a scribe line across another scribe line which is formed earlier, the scribe pressure is raised temporarily when the scribing head passes the scribe line which is formed earlier. The rotational torque of the servomotor 3 is controlled at any of preset limits while the position of a cutter 6 of the scribing head shifts on the brittle substrate. The servomotor 3 is driven under position-control mode.