Patents by Inventor Haruo Yagami

Haruo Yagami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polyamide base binder for use in metal powder injection molding process
    Patent number: 5002988
    Abstract: A polyamide binder for use in injection molding a metal powder comprising in combination: (a) 40 to 50 wt % of a polyamide resin component having an average molecular weight of not less than 20,000 and prepared by co-polycondensation of a mixture of dimer acid, azelaic acid, ethylenediamine and xylylenediamine each being mixed in a substantially equal molecular equivalent ratio; (b) 20 to 30 wt % of ethylene-bis-laurylamide; and (c) the balance of N,N-diacetylpiperazine.
    Type: Grant
    Filed: July 13, 1989
    Date of Patent: March 26, 1991
    Assignee: Sanwa Chemical Industry Co., Ltd.
    Inventors: Hiroshi Ono, Katuyoshi Saitoh, Haruo Yagami, Takeo Saiki, Yoshimichi Masuda