Patents by Inventor Haruo Yoshikawa

Haruo Yoshikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5291665
    Abstract: Described herein are method and apparatus using a hot D.I. water bath for drying a wet work, for example, for draining and drying a wet work to dissipate water droplets completely from the work surface subsequent to a washing operation, permitting a high precision drying operation precluding disturbances by air bubbles of the water surface at the time of lifting the work out of the hot D.I. water bath. Prior to sending D.I. water to a heater, it is passed through a deaerator to reduce dissolved gas content to a level lower than a saturated solubility at a given temperature, and then heated to a predetermined temperature to prepare hot D.I. water for supply to the hot D.I. water bath; or alternatively D.I. water is heated to a predetermined temperature and supplied to a hot D.I. water bath through a water feed conduit via a bubble trapping chamber to remove air bubbles therefrom. A wet work is heated by immersion in the hot D.I. water bath and then lifted up to drain and dry same.
    Type: Grant
    Filed: October 4, 1991
    Date of Patent: March 8, 1994
    Assignee: Speedfam Clean Systems, Co., Ltd.
    Inventor: Haruo Yoshikawa
  • Patent number: 5252379
    Abstract: An embossed process paper for transfer, adapted to be used for forming a dry type of synthetic leather, includes a backing paper (1), a mixed resin (2) of polypropylene with polyethylene laminated on the surface of the backing paper (1) and a homopolypropylene resin (3) laminated on the surface of the mixed resin (2). Both the resins are laminated together at a total resin coat thickness of 30 to 120 .mu.m, the thickness of the mixed resin (2) accounting for 50 to 20% of the total resin coat thickness and the thickness of the resin (3) accounting for 50 to 80% of the total resin coat thickness, both the resins having thereon a given embossed pattern having a depth of 20 to 150 .mu.m, and the backing paper (1) having a smooth back side.
    Type: Grant
    Filed: November 21, 1991
    Date of Patent: October 12, 1993
    Assignees: Sanyo Kakoshi Kabushiki Kaisha, Showa Denko Kabushiki Kaisha
    Inventors: Takeshi Kuribayashi, Haruo Yoshikawa, Yoshio Matsumoto