Patents by Inventor Harutoshi Oikawa

Harutoshi Oikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8519271
    Abstract: A flexible printed circuit includes: a flexible substrate extending from a first end section to a second end section, and having an opening or a notch in proximity to the first end section; a first wiring layer extending from the first end section to the second end section so as to avoid the opening or the notch; a second wiring layer extending from the first end section to the second end section so as to block the opening or the notch; a first conductive member being formed opposed to the flexible substrate in relation to the first wiring layer and at least in proximity to the first end section in a region opposed to the first wiring layer, and being electrically connected to the first wiring layer; and a second conductive member electrically connected to the second wiring layer via the opening or the notch.
    Type: Grant
    Filed: June 16, 2009
    Date of Patent: August 27, 2013
    Assignee: Sony Corporation
    Inventors: Harutoshi Oikawa, Kiyohiro Kimura
  • Patent number: 8274634
    Abstract: A flexible printed circuit includes: a first wiring layer and a second wiring layer being in contact with one surface of a flexible substrate, a third wiring layer and a fourth wiring layer on the other surface of the flexible substrate, a first conductive member being formed on surfaces in proximity to a through hole of the second wiring layer and the fourth wiring layer; a second conductive member being formed on surfaces in proximity to the first end section of the first wiring layer and the third wiring layer; and an insulating layer being formed in a space between the first wiring layer and the second conductive member, and the second wiring layer and the first conductive member and a space between the third wiring layer and the second conductive member, and the fourth wiring layer and the first conductive member.
    Type: Grant
    Filed: June 16, 2009
    Date of Patent: September 25, 2012
    Assignee: Sony Corporation
    Inventors: Harutoshi Oikawa, Kiyohiro Kimura
  • Patent number: 8264469
    Abstract: A touch panel capable of decreasing concavity and convexity generated on the surface and a display unit including the same are provided. The touch panel includes: a first spacer layer on both side faces of a first wiring layer provided on a first transparent substrate; and a second wiring layer on both side faces of a second wiring layer provided on a second transparent substrate. The touch panel also includes a flexible printed circuit board in a gap between the first transparent substrate and the second transparent substrate and in a region including at least part of a region not provided with the adhesion layer in the region opposed to the first wiring layer, the second wiring layer, the first spacer layer, and the second spacer layer.
    Type: Grant
    Filed: July 21, 2009
    Date of Patent: September 11, 2012
    Assignee: Sony Corporation
    Inventors: Kiyohiro Kimura, Kazuhiro Miura, Harutoshi Oikawa, Osamu Sugawara, Toshinori Kadowaki
  • Publication number: 20100026648
    Abstract: A touch panel capable of decreasing concavity and convexity generated on the surface and a display unit including the same are provided. The touch panel includes: a first spacer layer on both side faces of a first wiring layer provided on a first transparent substrate; and a second wiring layer on both side faces of a second wiring layer provided on a second transparent substrate. The touch panel also includes a flexible printed circuit board in a gap between the first transparent substrate and the second transparent substrate and in a region including at least part of a region not provided with the adhesion layer in the region opposed to the first wiring layer, the second wiring layer, the first spacer layer, and the second spacer layer.
    Type: Application
    Filed: July 21, 2009
    Publication date: February 4, 2010
    Applicant: SONY CORPORATION
    Inventors: Kiyohiro Kimura, Kazuhiro Miura, Harutoshi Oikawa, Osamu Sugawara, Toshinori Kadowaki
  • Publication number: 20090315855
    Abstract: A flexible printed circuit includes: a flexible substrate extending from a first end section to a second end section, and having an opening or a notch in proximity to the first end section; a first wiring layer extending from the first end section to the second end section so as to avoid the opening or the notch; a second wiring layer extending from the first end section to the second end section so as to block the opening or the notch; a first conductive member being formed opposed to the flexible substrate in relation to the first wiring layer and at least in proximity to the first end section in a region opposed to the first wiring layer, and being electrically connected to the first wiring layer; and a second conductive member electrically connected to the second wiring layer via the opening or the notch.
    Type: Application
    Filed: June 16, 2009
    Publication date: December 24, 2009
    Applicant: Sony Corporation
    Inventors: Harutoshi OIKAWA, Kiyohiro KIMURA
  • Publication number: 20090315856
    Abstract: A flexible printed circuit includes: a first wiring layer and a second wiring layer being in contact with one surface of a flexible substrate, a third wiring layer and a fourth wiring layer on the other surface of the flexible substrate, a first conductive member being formed on surfaces in proximity to a through hole of the second wiring layer and the fourth wiring layer; a second conductive member being formed on surfaces in proximity to the first end section of the first wiring layer and the third wiring layer; and an insulating layer being formed in a space between the first wiring layer and the second conductive member, and the second wiring layer and the first conductive member and a space between the third wiring layer and the second conductive member, and the fourth wiring layer and the first conductive member.
    Type: Application
    Filed: June 16, 2009
    Publication date: December 24, 2009
    Applicant: Sony Corporation
    Inventors: Harutoshi OIKAWA, Kiyohiro KIMURA