Abstract: A method of manufacturing a sealed electronic component, which can seal a housing in a high-vacuum state while preventing enclosure of a gas within the housing, as well as achieving the improvement in manufacturing efficiency. According to the method, after forming an unwelded section by a primary welding process step, including a first beam irradiation process step and a second beam irradiation process step, annealing treatment is performed in an annealing process step by irradiating an electron beam to a predetermined portion on a locus of the electron beam formed in the first beam irradiation process step. The locus may be on a housing or a lid.

Abstract: There is provided a sealing board (30) for sealing a container containing an electronic component, constituted of a base which is made of a material exhibiting a low wettability to a brazing filler metal (31) and on a surface of which a metal layer exhibiting a high wettability to the brazing filler metal (31) is formed, a brazing filler metal portion formed on the metal layer to form a closed region, and an exposed portion in which a surface of the base is exposed in at least a part of the closed region. By making at least a part of the sealing board as the exposed portion, it is possible to produce the sealing board with the brazing filler metal for a package stable in quality and inexpensively.

Abstract: There is provided a sealing board (30) for sealing a container containing an electronic component, constituted of a base which is made of a material exhibiting a low wettability to a brazing filler metal (31) and on a surface of which a metal layer exhibiting a high wettability to the brazing filler metal (31) is formed, a brazing filler metal portion formed on the metal layer to form a closed region, and an exposed portion in which a surface of the base is exposed in at least a part of the closed region. By making at least a part of the sealing board as the exposed portion, it is possible to produce the sealing board with the brazing filler metal for a package stable in quality and inexpensively.

Abstract: After forming an unwelded section by a primary welding process step (S203) including a first beam irradiation process step (S203a) and a second beam irradiation process step (S203b), annealing treatment is performed in an annealing process step (S204) by irradiating an electron beam to a predetermined portion on a locus of the electron beam formed in the first beam irradiation process step (S203a). Thereby, there is provided a manufacturing method of a sealed electronic component, which can seal a housing in a high-vacuum state while preventing enclosure of a gas within the housing, as well as achieving the improvement in manufacturing efficiency.