Abstract: A precision cutting process machine aligns a workpiece to be subjected to a precision cutting process by a continuously rotating cutting tool relative to the cutting tool, and cuts the work into a predetermined pattern so as to form fine grooves at a predetermined pitch by a continuous cutting processes. The machine includes a main body base portion and an up-and-down moving table driven in the up-and-down direction with respect to the main body base portion.

Abstract: A stage device usable, e.g., in an X-ray exposure apparatus, for moving a semiconductor wafer placed in a vacuum ambience and held by a wafer chuck, is disclosed. In the stage device, the wafer chuck holds the wafer so that the surface of the wafer onto which a circuit pattern is to be transferred is placed in a vertical plane, and the wafer chuck is moved vertically and horizontally for step-and-repeat exposure of the wafer. The device includes a guide mechanism, locking mechanism and a constant-tension spring mechanism, to thereby ensure high-accuracy movement of the wafer chuck in the vertical direction as well as high-precision positioning of the wafer. Further, in the stage device, a drive source producing a drive to move the wafer chuck is disposed in a vacuum ambience while, on the other hand, the supply of operating fluids to air bearing assemblies, for guiding the movement of the wafer chuck, is achieved by use of metal pipes coupled by rotary joints.