Abstract: An electronic device includes a circuit board, an electronic component, and an insulating member. The electronic component includes: a component main body that faces the circuit board; and a first lead terminal that is connected to the circuit board. The insulating member includes a base portion, a mounting portion, and an insulating wall. The mounting portion is disposed on the base portion, and is mounted to the circuit board. The insulating wall protrudes from the base portion, and is disposed between the first lead terminal and a conductive member that is positioned so as to be adjacent to the first lead terminal.

Abstract: An electronic device includes a circuit board, an electronic component, and an insulating member. The electronic component includes: a component main body that faces the circuit board; and a first lead terminal that is connected to the circuit board. The insulating member includes a base portion, a mounting portion, and an insulating wall. The mounting portion is disposed on the base portion, and is mounted to the circuit board. The insulating wall protrudes from the base portion, and is disposed between the first lead terminal and a conductive member that is positioned so as to be adjacent to the first lead terminal.

Abstract: The power conversion device of the invention includes: a cooling unit that is a prism, the interior of which is hollow, and that has a refrigerant inlet portion and a refrigerant outlet portion the cooling unit having in the interior thereof a refrigerant channel through which a refrigerant flows from the refrigerant inlet portion towards the refrigerant outlet portion; electronic devices that are respectively disposed on three or more surfaces on the outside of side surfaces of the cooling unit, excluding a refrigerant inlet surface, in which the refrigerant inlet portion is disposed, and a refrigerant outlet surface, in which the refrigerant outlet portion is disposed, the electronic devices being cooled by boiling of the refrigerant; and a hollow outer case 4 that covers the electronic devices.

Abstract: The power conversion device of the invention includes: a cooling unit that is a prism, the interior of which is hollow, and that has a refrigerant inlet portion and a refrigerant outlet portion the cooling unit having in the interior thereof a refrigerant channel through which a refrigerant flows from the refrigerant inlet portion towards the refrigerant outlet portion; electronic devices that are respectively disposed on three or more surfaces on the outside of side surfaces of the cooling unit, excluding a refrigerant inlet surface, in which the refrigerant inlet portion is disposed, and a refrigerant outlet surface, in which the refrigerant outlet portion is disposed, the electronic devices being cooled by boiling of the refrigerant; and a hollow outer case 4 that covers the electronic devices.

Abstract: A power conversion apparatus for vehicle use having a small size and a light weight is obtained. The power conversion apparatus is provided with: a plurality of semiconductor modules in which semiconductor devices are molded with a resin, and each of which has a module body, an input terminal, and an output terminal; a heat sink of a rectangular parallelepiped shape which has cooling principal planes on opposite surfaces thereof, respectively, for cooling these semiconductor modules; and a plurality of control boards which control the driving of the semiconductor modules. Each of the semiconductor modules is arranged such that its module body has a principal plane in surface contact with one of the cooling principal planes of the heat sink, and each of the control boards is arranged in opposition to a surface of the module body at an opposed side of the principal plane thereof.

Abstract: A power conversion apparatus for vehicle use having a small size and a light weight is obtained. The power conversion apparatus is provided with: a plurality of semiconductor modules in which semiconductor devices are molded with a resin, and each of which has a module body, an input terminal, and an output terminal; a heat sink of a rectangular parallelepiped shape which has cooling principal planes on opposite surfaces thereof, respectively, for cooling these semiconductor modules; and a plurality of control boards which control the driving of the semiconductor modules. Each of the semiconductor modules is arranged such that its module body has a principal plane in surface contact with one of the cooling principal planes of the heat sink, and each of the control boards is arranged in opposition to a surface of the module body at an opposed side of the principal plane thereof.

Abstract: According to a copy instruction from a host, a session in which entire or partial data of a primary volume of a first RAID device of the copy source is transferred and copied to the same position of a secondary volume of a second RAID device of the copy destination through an inter-chassis path is established and executed based on session information. A computer of the host instructs the first RAID device of forcible stop of the session as to cause the session information to be deleted when the inter-chassis path is blocked, and causes the session information remaining in the second RAID device to be deleted by an instruction given via the first RAID device when the forcibly terminated session is tried to be started when the blocked inter-device path is connected and results in an error.

Abstract: A component fixing device capable of improving vibration resistance by fixing a component onto a circuit substrate without inhibiting productivity and, of accurately inserting a lead of the component into the circuit substrate. The component fixing device is provided with a circuit substrate having a printed wiring or the like, a mounting component having a package including electronic components forming an electronic circuit together with the print wiring and an external lead for connecting the electronic components to the print wiring and the like, and a holder made from an insulating material such as a synthetic resin, the holder being fixed to the circuit substrate and holding the mounting component. The holder is provided with holding members for holding and fixing the package of the mounting component and lead holes for guiding the lead to a through hole of the circuit substrate.

Abstract: According to a copy instruction from a host, a session in which entire or partial data of a primary volume of a first RAID device of the copy source is transferred and copied to the same position of a secondary volume of a second RAID device of the copy destination through an inter-chassis path is established and executed based on session information. A computer of the host instructs the first RAID device of forcible stop of the session as to cause the session information to be deleted when the inter-chassis path is blocked, and causes the session information remaining in the second RAID device to be deleted by an instruction given via the first RAID device when the forcibly terminated session is tried to be started when the blocked inter-device path is connected and results in an error.

Abstract: It is intended to provide a component fixing device capable of improving vibration resistance by fixing a component onto a circuit substrate without inhibiting productivity and, of accurately inserting a lead of the component into the circuit substrate. The component fixing device is provided with a circuit substrate having a printed wiring or the like, amounting component having a package including electronic components forming an electronic circuit together with the print wiring and an external lead for connecting the electronic components to the print wiring and the like, and a holder made from an insulating material such as a synthetic resin, the holder being fixed to the circuit substrate and holding the mounting component. The holder is provided with holding members for holding and fixing the package of the mounting component and lead holes for guiding the lead to a through hole of the circuit substrate.

Abstract: A semiconductor device, in which the air within a gel resin can be efficiently and well purged, comprising a casing, a semiconductor device electrically connected by bonding wires and a gel resin filled in the casing and serves for insulation covering of the semiconductor device and the bonding wire. The device further comprises a board-shaped vibration damper in contact with the gel resin and is provided with a plurality of perforations each having an air inlet and an air outlet for the purpose of air extraction during the filling of the gel resin. The sectional area of the perforations is tapered and larger at the inlet than at the outlet, thus causing the perforations to have the form of a substantially conical trapezoid as a whole.

Abstract: A semiconductor device of the invention comprises a semiconductor element provided within a housing, a bonding wire, a sealing resin member covering the semiconductor element and bonding wire, and a sheet member. The sheet member is fixed in the housing and arranged out of contact with the bonding wire, and moreover buried in the sealing resin member. Because the sheet member restrains the sealing resin member from vibrating, the bonding wire is connected with improved reliability. In place of the sheet member, it is possible to use a pillar member fixed on an insulating substrate. The semiconductor device is suitable for use on a mobile body, such as a vehicle, which proceeds with vibrations.

Abstract: A semiconductor device, in which the air within a gel resin can be efficiently and well purged, comprising a casing, a semiconductor device electrically connected by bonding wires and a gel resin filled in the casing and serves for insulation covering of the semiconductor device and the bonding wire. The device further comprises a board-shaped vibration damper in contact with the gel resin and is provided with a plurality of perforations each having an air inlet and an air outlet for the purpose of air extraction during the filling of the gel resin. The sectional area of the perforations is tapered and larger at the inlet than at the outlet, thus causing the perforations to have the form of a substantially conical trapezoid as a whole.

Abstract: A semiconductor device of the invention comprises a semiconductor element provided within a housing, a bonding wire, a sealing resin member covering the semiconductor element and bonding wire, and a sheet member. The sheet member is fixed in the housing and arranged out of contact with the bonding wire, and moreover buried in the sealing resin member. Because the sheet member restrains the sealing resin member from vibrating, the bonding wire is connected with improved reliability. In place of the sheet member, it is possible to use a pillar member fixed on an insulating substrate. The semiconductor device is suitable for use on a mobile body, such as a vehicle, which proceeds with vibrations.

Abstract: An electronic circuit equipment including a substantially box-shaped case body 30 for defining a sealed interior space therein and an electronic circuit board 11 having a plurality of electronic components 12 mounted thereon. The case body comprises a pair of cup-shaped sections 30a clamped together at their opposite ends, and sandwiching between them the circuit board, surrounded and sealingly enclosed by a gas-impermeable flexible sheet 32. A vent hole 20 is provided in one of the sections 30a such that the sheet 32 flexes to absorb pressure fluctuations, and prevents the circuit board from bending.

Abstract: An electronic circuit equipment including a substantially box-shaped case main body (10) for defining a sealed interior space therein and an electronic circuit board (11) having a plurality of electronic components (12) thereon. The case main body (10) comprises a case body (13) and a flat plate-shaped lid (17) positioned properly with respect to the case body (13) to seal the interior space. A vent hole (20) is formed in the bottom wall of the case body (13) for communicating the interior of the case body (13) with ambient atmosphere. A cover member is attached to the case body (13) to cover the vent hole hermetically. By using a cover member, the interior space of the case body (13) is sealed for protecting electronic components (12) on the electronic circuit board (11) from moisture and rainwater and, for absorbing a pressure fluctuation therein. A mounting flange extends from the case body and surrounds the vent hole. The cover member is a flexible diaphragm with a circumferential bulge.

Abstract: A distributor for an internal combustion engine comprising a base plate (20), a resin-molded ignition coil unit (21) and a resin-molded control unit (30) in a stacked relationship with their side circumferential surfaces exposed to define a portion of an outer surface of the distributor. A distributor cap (2), a cover (10) for covering the control unit are fastened to the base by a screw (32) extending through these components, and the ignition coil unit is attached to the base through a screw (24) extending through a bushing (23). The resin-molded ignition coil unit (21) may comprise an L-shaped external-connection connector (28, 37) integrally formed on the exposed side surface. The electrical connection between the ignition coil and the control unit may be established by a plug-in type connector (38, 39).

Abstract: A distributor for an internal combustion engine comprising a rotational signal generator (4) which includes a rotary magnetic shield (30) for generating an electrical signal indicative of the shaft rotational speed. The rotary magnetic shield (30) comprises a rotor plate (31) attached at the center thereof to the rotary shaft and a plurality of shield tabs (37) disposed around the plate and extending perpendicularly thereto. The rotor plate (31) and each shield tab (37) are integrally connected by a transition portion (33) including a round bend (36) for moderating stress concentration. The transition portion (33) also has integral fillets (35) defining a peripheral edge smoothly connecting the edge of the main plate (31) and side edges of the shield tabs (37) for moderating concentration of stress at edges of the transition portions (33). The fillets (35) of two adjacent transition portions (33) may define a continuously curved edge in a plane of the main plate (31).

Abstract: Leading means are disclosed for electrically connecting an electrical device contained in the housing of an ignition distributor of the internal combustion engine to the outside. A connecting section arranged in a location for contact with the terminal of the electrical device is electrically connected by means of a lead wire section to the connector section arranged in a through hole means defined by the housing. The above sections and the electrical device itself connected to the connecting section are rigidly constructed as an integral part by molding.

Abstract: A distributor for an internal combustion engine includes an ignition timing reluctor provided on a centrifugal spark advance member, ignition timing signal generating means for generating an ignition timing signal by detecting approach and passage of the ignition timing reluctor, a cylinder discriminating reluctor provided on the centrifugal spark advance member, and a cylinder discriminating sensor for generating a cylinder discriminating signal by detecting approach and passage of the cylinder discriminating reluctor. The distributor has a structure for compensating for any imbalance of its rotator. The cylinder discriminating signal is centrifugally advanced in the same way as the ignition timing signal, so that it is possible to reduce the width of the cylinder discriminating signal.