Patents by Inventor Haruyuki Matsuo

Haruyuki Matsuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10383262
    Abstract: The power conversion device of the invention includes: a cooling unit that is a prism, the interior of which is hollow, and that has a refrigerant inlet portion and a refrigerant outlet portion the cooling unit having in the interior thereof a refrigerant channel through which a refrigerant flows from the refrigerant inlet portion towards the refrigerant outlet portion; electronic devices that are respectively disposed on three or more surfaces on the outside of side surfaces of the cooling unit, excluding a refrigerant inlet surface, in which the refrigerant inlet portion is disposed, and a refrigerant outlet surface, in which the refrigerant outlet portion is disposed, the electronic devices being cooled by boiling of the refrigerant; and a hollow outer case 4 that covers the electronic devices.
    Type: Grant
    Filed: March 25, 2015
    Date of Patent: August 13, 2019
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Masaru Shinozaki, Shigetoshi Ipposhi, Hiroyuki Higashino, Yugo Asai, Hiroyuki Yano, Haruyuki Matsuo
  • Publication number: 20180027704
    Abstract: The power conversion device of the invention includes: a cooling unit that is a prism, the interior of which is hollow, and that has a refrigerant inlet portion and a refrigerant outlet portion the cooling unit having in the interior thereof a refrigerant channel through which a refrigerant flows from the refrigerant inlet portion towards the refrigerant outlet portion; electronic devices that are respectively disposed on three or more surfaces on the outside of side surfaces of the cooling unit, excluding a refrigerant inlet surface, in which the refrigerant inlet portion is disposed, and a refrigerant outlet surface, in which the refrigerant outlet portion is disposed, the electronic devices being cooled by boiling of the refrigerant; and a hollow outer case 4 that covers the electronic devices.
    Type: Application
    Filed: March 25, 2015
    Publication date: January 25, 2018
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Masaru SHINOZAKI, Shigetoshi IPPOSHI, Hiroyuki HIGASHINO, YUGO ASAI, Hiroyuki YANO, Haruyuki MATSUO
  • Patent number: 8686601
    Abstract: A power conversion apparatus for vehicle use having a small size and a light weight is obtained. The power conversion apparatus is provided with: a plurality of semiconductor modules in which semiconductor devices are molded with a resin, and each of which has a module body, an input terminal, and an output terminal; a heat sink of a rectangular parallelepiped shape which has cooling principal planes on opposite surfaces thereof, respectively, for cooling these semiconductor modules; and a plurality of control boards which control the driving of the semiconductor modules. Each of the semiconductor modules is arranged such that its module body has a principal plane in surface contact with one of the cooling principal planes of the heat sink, and each of the control boards is arranged in opposition to a surface of the module body at an opposed side of the principal plane thereof.
    Type: Grant
    Filed: August 10, 2010
    Date of Patent: April 1, 2014
    Assignee: Mitsubishi Electric Corporation
    Inventors: Takuya Michinaka, Satoshi Ishibashi, Masaru Kobayashi, Haruyuki Matsuo, Yuji Kuramoto
  • Publication number: 20110181105
    Abstract: A power conversion apparatus for vehicle use having a small size and a light weight is obtained. The power conversion apparatus is provided with: a plurality of semiconductor modules in which semiconductor devices are molded with a resin, and each of which has a module body, an input terminal, and an output terminal; a heat sink of a rectangular parallelepiped shape which has cooling principal planes on opposite surfaces thereof, respectively, for cooling these semiconductor modules; and a plurality of control boards which control the driving of the semiconductor modules. Each of the semiconductor modules is arranged such that its module body has a principal plane in surface contact with one of the cooling principal planes of the heat sink, and each of the control boards is arranged in opposition to a surface of the module body at an opposed side of the principal plane thereof.
    Type: Application
    Filed: August 10, 2010
    Publication date: July 28, 2011
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Takuya Michinaka, Satoshi Ishibashi, Masaru Kobayashi, Haruyuki Matsuo, Yuji Kuramoto
  • Patent number: 7434094
    Abstract: According to a copy instruction from a host, a session in which entire or partial data of a primary volume of a first RAID device of the copy source is transferred and copied to the same position of a secondary volume of a second RAID device of the copy destination through an inter-chassis path is established and executed based on session information. A computer of the host instructs the first RAID device of forcible stop of the session as to cause the session information to be deleted when the inter-chassis path is blocked, and causes the session information remaining in the second RAID device to be deleted by an instruction given via the first RAID device when the forcibly terminated session is tried to be started when the blocked inter-device path is connected and results in an error.
    Type: Grant
    Filed: July 18, 2005
    Date of Patent: October 7, 2008
    Assignee: Fujitsu Limited
    Inventors: Kenichi Fujita, Haruyuki Matsuo
  • Patent number: 7232958
    Abstract: A component fixing device capable of improving vibration resistance by fixing a component onto a circuit substrate without inhibiting productivity and, of accurately inserting a lead of the component into the circuit substrate. The component fixing device is provided with a circuit substrate having a printed wiring or the like, a mounting component having a package including electronic components forming an electronic circuit together with the print wiring and an external lead for connecting the electronic components to the print wiring and the like, and a holder made from an insulating material such as a synthetic resin, the holder being fixed to the circuit substrate and holding the mounting component. The holder is provided with holding members for holding and fixing the package of the mounting component and lead holes for guiding the lead to a through hole of the circuit substrate.
    Type: Grant
    Filed: December 6, 2004
    Date of Patent: June 19, 2007
    Inventor: Haruyuki Matsuo
  • Publication number: 20060248381
    Abstract: According to a copy instruction from a host, a session in which entire or partial data of a primary volume of a first RAID device of the copy source is transferred and copied to the same position of a secondary volume of a second RAID device of the copy destination through an inter-chassis path is established and executed based on session information. A computer of the host instructs the first RAID device of forcible stop of the session as to cause the session information to be deleted when the inter-chassis path is blocked, and causes the session information remaining in the second RAID device to be deleted by an instruction given via the first RAID device when the forcibly terminated session is tried to be started when the blocked inter-device path is connected and results in an error.
    Type: Application
    Filed: July 18, 2005
    Publication date: November 2, 2006
    Applicant: FUJITSU LIMITED
    Inventors: Kenichi Fujita, Haruyuki Matsuo
  • Publication number: 20050167155
    Abstract: It is intended to provide a component fixing device capable of improving vibration resistance by fixing a component onto a circuit substrate without inhibiting productivity and, of accurately inserting a lead of the component into the circuit substrate. The component fixing device is provided with a circuit substrate having a printed wiring or the like, amounting component having a package including electronic components forming an electronic circuit together with the print wiring and an external lead for connecting the electronic components to the print wiring and the like, and a holder made from an insulating material such as a synthetic resin, the holder being fixed to the circuit substrate and holding the mounting component. The holder is provided with holding members for holding and fixing the package of the mounting component and lead holes for guiding the lead to a through hole of the circuit substrate.
    Type: Application
    Filed: December 6, 2004
    Publication date: August 4, 2005
    Inventor: Haruyuki Matsuo
  • Patent number: 6791174
    Abstract: A semiconductor device, in which the air within a gel resin can be efficiently and well purged, comprising a casing, a semiconductor device electrically connected by bonding wires and a gel resin filled in the casing and serves for insulation covering of the semiconductor device and the bonding wire. The device further comprises a board-shaped vibration damper in contact with the gel resin and is provided with a plurality of perforations each having an air inlet and an air outlet for the purpose of air extraction during the filling of the gel resin. The sectional area of the perforations is tapered and larger at the inlet than at the outlet, thus causing the perforations to have the form of a substantially conical trapezoid as a whole.
    Type: Grant
    Filed: July 16, 2002
    Date of Patent: September 14, 2004
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Haruyuki Matsuo, Ryuuichi Ishii
  • Patent number: 6787893
    Abstract: A semiconductor device of the invention comprises a semiconductor element provided within a housing, a bonding wire, a sealing resin member covering the semiconductor element and bonding wire, and a sheet member. The sheet member is fixed in the housing and arranged out of contact with the bonding wire, and moreover buried in the sealing resin member. Because the sheet member restrains the sealing resin member from vibrating, the bonding wire is connected with improved reliability. In place of the sheet member, it is possible to use a pillar member fixed on an insulating substrate. The semiconductor device is suitable for use on a mobile body, such as a vehicle, which proceeds with vibrations.
    Type: Grant
    Filed: August 19, 2002
    Date of Patent: September 7, 2004
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Dai Nakajima, Naoki Yoshimatsu, Haruyuki Matsuo, Ryuuichi Ishii
  • Publication number: 20030089974
    Abstract: A semiconductor device, in which the air within a gel resin can be efficiently and well purged, comprising a casing, a semiconductor device electrically connected by bonding wires and a gel resin filled in the casing and serves for insulation covering of the semiconductor device and the bonding wire. The device further comprises a board-shaped vibration damper in contact with the gel resin and is provided with a plurality of perforations each having an air inlet and an air outlet for the purpose of air extraction during the filling of the gel resin. The sectional area of the perforations is tapered and larger at the inlet than at the outlet, thus causing the perforations to have the form of a substantially conical trapezoid as a whole.
    Type: Application
    Filed: July 16, 2002
    Publication date: May 15, 2003
    Applicant: MITSUBISHI DENKI KABUSHIKI KAISHA
    Inventors: Haruyuki Matsuo, Ryuuichi Ishii
  • Publication number: 20030011057
    Abstract: A semiconductor device of the invention comprises a semiconductor element provided within a housing, a bonding wire, a sealing resin member covering the semiconductor element and bonding wire, and a sheet member. The sheet member is fixed in the housing and arranged out of contact with the bonding wire, and moreover buried in the sealing resin member. Because the sheet member restrains the sealing resin member from vibrating, the bonding wire is connected with improved reliability. In place of the sheet member, it is possible to use a pillar member fixed on an insulating substrate. The semiconductor device is suitable for use on a mobile body, such as a vehicle, which proceeds with vibrations.
    Type: Application
    Filed: August 19, 2002
    Publication date: January 16, 2003
    Inventors: Dai Nakajima, Naoki Yoshimatsu, Haruyuki Matsuo, Ryuuichi Ishii
  • Patent number: 5497290
    Abstract: An electronic circuit equipment including a substantially box-shaped case body 30 for defining a sealed interior space therein and an electronic circuit board 11 having a plurality of electronic components 12 mounted thereon. The case body comprises a pair of cup-shaped sections 30a clamped together at their opposite ends, and sandwiching between them the circuit board, surrounded and sealingly enclosed by a gas-impermeable flexible sheet 32. A vent hole 20 is provided in one of the sections 30a such that the sheet 32 flexes to absorb pressure fluctuations, and prevents the circuit board from bending.
    Type: Grant
    Filed: March 27, 1995
    Date of Patent: March 5, 1996
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Wataru Fukui, Hideki Umemoto, Yutaka Ohashi, Haruyuki Matsuo
  • Patent number: 5434748
    Abstract: An electronic circuit equipment including a substantially box-shaped case main body (10) for defining a sealed interior space therein and an electronic circuit board (11) having a plurality of electronic components (12) thereon. The case main body (10) comprises a case body (13) and a flat plate-shaped lid (17) positioned properly with respect to the case body (13) to seal the interior space. A vent hole (20) is formed in the bottom wall of the case body (13) for communicating the interior of the case body (13) with ambient atmosphere. A cover member is attached to the case body (13) to cover the vent hole hermetically. By using a cover member, the interior space of the case body (13) is sealed for protecting electronic components (12) on the electronic circuit board (11) from moisture and rainwater and, for absorbing a pressure fluctuation therein. A mounting flange extends from the case body and surrounds the vent hole. The cover member is a flexible diaphragm with a circumferential bulge.
    Type: Grant
    Filed: July 22, 1994
    Date of Patent: July 18, 1995
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Wataru Fukui, Hideki Umemoto, Yutaka Ohashi, Haruyuki Matsuo
  • Patent number: 5139003
    Abstract: A distributor for an internal combustion engine comprising a base plate (20), a resin-molded ignition coil unit (21) and a resin-molded control unit (30) in a stacked relationship with their side circumferential surfaces exposed to define a portion of an outer surface of the distributor. A distributor cap (2), a cover (10) for covering the control unit are fastened to the base by a screw (32) extending through these components, and the ignition coil unit is attached to the base through a screw (24) extending through a bushing (23). The resin-molded ignition coil unit (21) may comprise an L-shaped external-connection connector (28, 37) integrally formed on the exposed side surface. The electrical connection between the ignition coil and the control unit may be established by a plug-in type connector (38, 39).
    Type: Grant
    Filed: September 24, 1991
    Date of Patent: August 18, 1992
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Yutaka Ohhashi, Koichi Okamura, Haruyuki Matsuo
  • Patent number: 5127387
    Abstract: A distributor for an internal combustion engine comprising a rotational signal generator (4) which includes a rotary magnetic shield (30) for generating an electrical signal indicative of the shaft rotational speed. The rotary magnetic shield (30) comprises a rotor plate (31) attached at the center thereof to the rotary shaft and a plurality of shield tabs (37) disposed around the plate and extending perpendicularly thereto. The rotor plate (31) and each shield tab (37) are integrally connected by a transition portion (33) including a round bend (36) for moderating stress concentration. The transition portion (33) also has integral fillets (35) defining a peripheral edge smoothly connecting the edge of the main plate (31) and side edges of the shield tabs (37) for moderating concentration of stress at edges of the transition portions (33). The fillets (35) of two adjacent transition portions (33) may define a continuously curved edge in a plane of the main plate (31).
    Type: Grant
    Filed: June 13, 1991
    Date of Patent: July 7, 1992
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventor: Haruyuki Matsuo
  • Patent number: 5024185
    Abstract: Leading means are disclosed for electrically connecting an electrical device contained in the housing of an ignition distributor of the internal combustion engine to the outside. A connecting section arranged in a location for contact with the terminal of the electrical device is electrically connected by means of a lead wire section to the connector section arranged in a through hole means defined by the housing. The above sections and the electrical device itself connected to the connecting section are rigidly constructed as an integral part by molding.
    Type: Grant
    Filed: March 15, 1990
    Date of Patent: June 18, 1991
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Yoshikuni Fujita, Haruyuki Matsuo
  • Patent number: 4852541
    Abstract: A distributor for an internal combustion engine includes an ignition timing reluctor provided on a centrifugal spark advance member, ignition timing signal generating means for generating an ignition timing signal by detecting approach and passage of the ignition timing reluctor, a cylinder discriminating reluctor provided on the centrifugal spark advance member, and a cylinder discriminating sensor for generating a cylinder discriminating signal by detecting approach and passage of the cylinder discriminating reluctor. The distributor has a structure for compensating for any imbalance of its rotator. The cylinder discriminating signal is centrifugally advanced in the same way as the ignition timing signal, so that it is possible to reduce the width of the cylinder discriminating signal.
    Type: Grant
    Filed: July 25, 1988
    Date of Patent: August 1, 1989
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Seiki Kodama, Shigenobu Murase, Haruyuki Matsuo, Hideki Maruhashi, Shigemi Murata, Hidetoshi Miyaji