Patents by Inventor Haruyuki NAKAJO

Haruyuki NAKAJO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220143692
    Abstract: A metal paste for low temperature bonding at temperatures 600° C. or lower, the metal paste comprising: a metal particle with an average particle size of 1 to 100 ?m; a metal nanoparticle with an average particle size of 1 to 500 nm; a stress relieving material; and a dispersion medium to disperse the metal particle, metal nanoparticle, and the stress relieving material.
    Type: Application
    Filed: March 19, 2020
    Publication date: May 12, 2022
    Applicant: Harima Chemicals, Inc.
    Inventors: Haruyuki NAKAJO, Mizuki YOSHIMOTO