Patents by Inventor Haruyuki Takano

Haruyuki Takano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10330123
    Abstract: In an ejector, a substantially conical passage formation member is disposed in the interior of a body forming a space therein to define a nozzle passage functioning as a nozzle, a mixing passage in which an ejection refrigerant ejected from the nozzle passage and a suction refrigerant drawn from a suction passage are mixed together, and a diffuser passage that converts a kinetic energy of the refrigerant that has flowed out of the mixing passage into a pressure energy, between an inner peripheral surface of the body and the passage formation member. The passage formation member is configured so that a spread angle of a portion forming an outlet side of the nozzle passage is smaller than a spread angle of a portion forming an inlet side of the nozzle passage in a cross-section parallel to an axial direction of the passage formation member.
    Type: Grant
    Filed: July 25, 2014
    Date of Patent: June 25, 2019
    Assignee: DENSO CORPORATION
    Inventors: Ryota Nakashima, Etsuhisa Yamada, Haruyuki Nishijima, Yoshiaki Takano
  • Patent number: 10316865
    Abstract: An ejector has a nozzle, a body, a passage defining member and a drive portion. The body has a refrigerant suction port and a pressure increasing portion. A nozzle passage is defined between an inner surface of the nozzle and an outer surface of the passage defining member and has a minimum sectional area portion, a tapered portion, and an expansion portion. The minimum sectional area portion has a smallest passage sectional area. The tapered portion is located upstream of the minimum sectional area portion in a refrigerant flow direction and has a passage sectional area decreasing toward the minimum sectional area portion gradually. The expansion portion is located downstream of the minimum sectional area portion in the refrigerant flow direction and has a passage sectional area increasing gradually. The passage defining member has a groove that is recessed to increase the passage sectional area of the nozzle passage.
    Type: Grant
    Filed: March 2, 2016
    Date of Patent: June 11, 2019
    Assignee: DENSO CORPORATION
    Inventors: Yoshiyuki Yokoyama, Haruyuki Nishijima, Etsuhisa Yamada, Ryota Nakashima, Yoshiaki Takano, Kazunori Mizutori, Yorito Kohara, Hiroshi Shintani
  • Publication number: 20180302741
    Abstract: To propose an information processing device and method capable of planning an effective scheme, such as distributing information appropriate to a user. Time-series positional data composed of time-series positional information of a mobile communication body are collected, and a regular behavior of a user of the mobile communication body is estimated on the basis of the collected time-series positional data of the mobile communication body.
    Type: Application
    Filed: April 27, 2016
    Publication date: October 18, 2018
    Inventors: Yu IKEMOTO, Tohru WATANABE, Masato UTSUMI, Yoshihisa OKAMOTO, Kengo OGAWA, Yuko YONEKURA, Haruyuki TAKANO, Hironobu BANDOH
  • Patent number: 8114245
    Abstract: A plasma etching device which has an auxiliary electrode enabling realization of a uniform plasma density of generated plasma on the surface of a base and which enables uniform etching with respect to the base without depending upon pressure and without rotating a magnetic field applying means. The plasma etching device has magnetic field applying means which has two parallel plate electrodes I and II and RF power applying means, with the base set on the electrode I, and which is horizontal and unidirectional with respect to the surface of the base where plasma etching is carried out. In this plasma etching device, an auxiliary electrode is provided at least on the upstream side of the base in a flow of electron current generated by the magnetic field applying means. The auxiliary electrode includes a local electrode arranged on the side facing the electrode II and means for adjusting impedance provided at a part of the local electrode to be electrically connected with the electrode I.
    Type: Grant
    Filed: November 26, 2002
    Date of Patent: February 14, 2012
    Assignees: Tokyo Electron Limited
    Inventors: Tadahiro Ohmi, Masaki Hirayama, Haruyuki Takano, Yusuke Hirayama
  • Patent number: 7312415
    Abstract: A plasma device which is provided with a container, a gas supply system, and an exhaust system. The container is composed of a first dielectric plate made of a material capable of transmitting microwaves. An antenna for radiating microwaves is located on the outside of the container, and an electrode for holding an object to be treated is located inside the container. The microwave radiating surface of the antenna and the surface of the object to be treated with plasma are positioned in parallel and opposite to each other. A wall section of the container other than that constituting the first dielectric plate is composed of a member of a material having electrical conductivity higher than that of aluminum, or the internal surface of the wall section is covered with the member.
    Type: Grant
    Filed: November 10, 2003
    Date of Patent: December 25, 2007
    Assignee: Foundation for Advancement of International Science
    Inventors: Tadahiro Ohmi, Takahisa Nitta, Masaki Hirayama, Haruyuki Takano, Ryu Kaiwara
  • Publication number: 20050250338
    Abstract: A plasma device which is provided with a container, a gas supply system, and an exhaust system. The container is composed of a first dielectric plate made of a material capable of transmitting microwaves. An antenna for radiating microwaves is located on the outside of the container, and an electrode for holding an object to be treated is located inside the container. The microwave radiating surface of the antenna and the surface of the object to be treated with plasma are positioned in parallel and opposite to each other. A wall section of the container other than that constituting the first dielectric plate is composed of a member of a material having electrical conductivity higher than that of aluminum, or the internal surface of the wall section is covered with the member.
    Type: Application
    Filed: November 10, 2003
    Publication date: November 10, 2005
    Inventors: Tadahiro Ohmi, Takahisa Nitta, Masaki Hirayama, Haruyuki Takano, Ryu Kaiwara
  • Publication number: 20030121609
    Abstract: A plasma etching device which has an auxiliary electrode enabling realization of a uniform plasma density of generated plasma on the surface of a base and which enables uniform etching with respect to the base without depending upon pressure and without rotating a magnetic field applying means. The plasma etching device has magnetic field applying means which has two parallel plate electrodes I and II and RF power applying means, with the base set on the electrode I, and which is horizontal and unidirectional with respect to the surface of the base where plasma etching is carried out. In this plasma etching device, an auxiliary electrode is provided at least on the upstream side of the base in a flow of electron current generated by the magnetic field applying means. The auxiliary electrode includes a local electrode arranged on the side facing the electrode II and means for adjusting impedance provided at a part of the local electrode to be electrically connected with the electrode I.
    Type: Application
    Filed: November 26, 2002
    Publication date: July 3, 2003
    Inventors: Tadahiro Ohmi, Masaki Hirayama, Haruyuki Takano, Yusuke Hirayama
  • Patent number: 6585851
    Abstract: A plasma etching device which has an auxiliary electrode enabling realization of a uniform plasma density of generated plasma on the surface of a base and which enables uniform etching with respect to the base without depending upon pressure and without rotating a magnetic field applying means. The plasma etching device has magnetic field applying means which has two parallel plate electrodes I and II and RF power applying means, with the base set on the electrode I, and which is horizontal and unidirectional with respect to the surface of the base where plasma etching is carried out. In this plasma etching device, an auxiliary electrode is provided at least on the upstream side of the base in a flow of electron current generated by the magnetic field applying means. The auxiliary electrode includes a local electrode arranged on the side facing the electrode II and means for adjusting impedance provided at a part of the local electrode to be electrically connected with the electrode I.
    Type: Grant
    Filed: November 26, 1999
    Date of Patent: July 1, 2003
    Assignees: Tokyo Electron Limited
    Inventors: Tadahiro Ohmi, Masaki Hirayama, Haruyuki Takano, Yusuke Hirayama
  • Publication number: 20020164883
    Abstract: A plasma device which is provided with a container (100), a gas supply system, and an exhaust system. The container (100) is composed of a first dielectric plate (102) made of a material capable of transmitting microwaves. An antenna (201) for radiating microwaves is located on the outside of the container (100), and an electrode (109) for holding an object (104) to be treated is located inside the container (100). The microwave radiating surface of the antenna (201) and the surface of the object (104) to be treated with plasma are positioned in parallel and opposite to each other. A wall section of the container (100) other than that constituting the first dielectric plate (102) is composed of a member of a material having electrical conductivity higher than that of aluminium, or the internal surface of the wall section is covered with the member.
    Type: Application
    Filed: March 18, 2002
    Publication date: November 7, 2002
    Inventors: Tadahiro Ohmi, Takahisa Nitta, Masaki Hirayama, Haruyuki Takano, Ryu Kaiwara
  • Patent number: 6357385
    Abstract: A plasma device which is provided with a container, a gas supply system, and an exhaust system. The container is composed of a first dielectric plate made of a material capable of transmitting microwaves. An antenna for radiating microwaves is located on the outside of the container, and an electrode for holding an object to be treated is located inside the container. The microwave radiating surface of the antenna and the surface of the object to be treated with plasma are positioned in parallel and opposite to each other. A wall section of the container other than that constituting the first dielectric plate is composed of a member of a material having electrical conductivity higher than that of aluminum, or the internal surface of the wall section is covered with the member.
    Type: Grant
    Filed: October 5, 1999
    Date of Patent: March 19, 2002
    Inventors: Tadahiro Ohmi, Takahisa Nitta, Masaki Hirayama, Haruyuki Takano, Ryu Kaiwara
  • Patent number: 6153068
    Abstract: The present invention provides a sputtering device provided with two electrodes I and II of parallel plate type within a vessel inside which pressure can be reduced, wherein: a target to be sputtered is placed on said electrode I, and a base body on which a film is to be deposited is placed on said electrode II, with the target and the base body being opposed to each other; a process gas is introduced into said vessel from a gas supply system; radio frequency power is applied to said target through at least said electrode I so as to excite plasma between the electrode I and the electrode II; characterized in that: outside said vessel, is provided a means for introducing magnetic field horizontal at least to a surface to be sputtered of said target.
    Type: Grant
    Filed: March 5, 1998
    Date of Patent: November 28, 2000
    Assignee: Tadahiro Ohmi
    Inventors: Tadahiro Ohmi, Masaki Hirayama, Haruyuki Takano, Yusuke Hirayama