Patents by Inventor Haruyuki Takano
Haruyuki Takano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10560797Abstract: To propose an information processing device and method capable of planning an effective scheme, such as distributing information appropriate to a user. Time-series positional data composed of time-series positional information of a mobile communication body are collected, and a regular behavior of a user of the mobile communication body is estimated on the basis of the collected time-series positional data of the mobile communication body.Type: GrantFiled: April 27, 2016Date of Patent: February 11, 2020Assignee: Hitachi, Ltd.Inventors: Yu Ikemoto, Tohru Watanabe, Masato Utsumi, Yoshihisa Okamoto, Kengo Ogawa, Yuko Yonekura, Haruyuki Takano, Hironobu Bandoh
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Publication number: 20180302741Abstract: To propose an information processing device and method capable of planning an effective scheme, such as distributing information appropriate to a user. Time-series positional data composed of time-series positional information of a mobile communication body are collected, and a regular behavior of a user of the mobile communication body is estimated on the basis of the collected time-series positional data of the mobile communication body.Type: ApplicationFiled: April 27, 2016Publication date: October 18, 2018Inventors: Yu IKEMOTO, Tohru WATANABE, Masato UTSUMI, Yoshihisa OKAMOTO, Kengo OGAWA, Yuko YONEKURA, Haruyuki TAKANO, Hironobu BANDOH
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Patent number: 8114245Abstract: A plasma etching device which has an auxiliary electrode enabling realization of a uniform plasma density of generated plasma on the surface of a base and which enables uniform etching with respect to the base without depending upon pressure and without rotating a magnetic field applying means. The plasma etching device has magnetic field applying means which has two parallel plate electrodes I and II and RF power applying means, with the base set on the electrode I, and which is horizontal and unidirectional with respect to the surface of the base where plasma etching is carried out. In this plasma etching device, an auxiliary electrode is provided at least on the upstream side of the base in a flow of electron current generated by the magnetic field applying means. The auxiliary electrode includes a local electrode arranged on the side facing the electrode II and means for adjusting impedance provided at a part of the local electrode to be electrically connected with the electrode I.Type: GrantFiled: November 26, 2002Date of Patent: February 14, 2012Assignees: Tokyo Electron LimitedInventors: Tadahiro Ohmi, Masaki Hirayama, Haruyuki Takano, Yusuke Hirayama
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Patent number: 7312415Abstract: A plasma device which is provided with a container, a gas supply system, and an exhaust system. The container is composed of a first dielectric plate made of a material capable of transmitting microwaves. An antenna for radiating microwaves is located on the outside of the container, and an electrode for holding an object to be treated is located inside the container. The microwave radiating surface of the antenna and the surface of the object to be treated with plasma are positioned in parallel and opposite to each other. A wall section of the container other than that constituting the first dielectric plate is composed of a member of a material having electrical conductivity higher than that of aluminum, or the internal surface of the wall section is covered with the member.Type: GrantFiled: November 10, 2003Date of Patent: December 25, 2007Assignee: Foundation for Advancement of International ScienceInventors: Tadahiro Ohmi, Takahisa Nitta, Masaki Hirayama, Haruyuki Takano, Ryu Kaiwara
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Publication number: 20050250338Abstract: A plasma device which is provided with a container, a gas supply system, and an exhaust system. The container is composed of a first dielectric plate made of a material capable of transmitting microwaves. An antenna for radiating microwaves is located on the outside of the container, and an electrode for holding an object to be treated is located inside the container. The microwave radiating surface of the antenna and the surface of the object to be treated with plasma are positioned in parallel and opposite to each other. A wall section of the container other than that constituting the first dielectric plate is composed of a member of a material having electrical conductivity higher than that of aluminum, or the internal surface of the wall section is covered with the member.Type: ApplicationFiled: November 10, 2003Publication date: November 10, 2005Inventors: Tadahiro Ohmi, Takahisa Nitta, Masaki Hirayama, Haruyuki Takano, Ryu Kaiwara
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Publication number: 20030121609Abstract: A plasma etching device which has an auxiliary electrode enabling realization of a uniform plasma density of generated plasma on the surface of a base and which enables uniform etching with respect to the base without depending upon pressure and without rotating a magnetic field applying means. The plasma etching device has magnetic field applying means which has two parallel plate electrodes I and II and RF power applying means, with the base set on the electrode I, and which is horizontal and unidirectional with respect to the surface of the base where plasma etching is carried out. In this plasma etching device, an auxiliary electrode is provided at least on the upstream side of the base in a flow of electron current generated by the magnetic field applying means. The auxiliary electrode includes a local electrode arranged on the side facing the electrode II and means for adjusting impedance provided at a part of the local electrode to be electrically connected with the electrode I.Type: ApplicationFiled: November 26, 2002Publication date: July 3, 2003Inventors: Tadahiro Ohmi, Masaki Hirayama, Haruyuki Takano, Yusuke Hirayama
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Patent number: 6585851Abstract: A plasma etching device which has an auxiliary electrode enabling realization of a uniform plasma density of generated plasma on the surface of a base and which enables uniform etching with respect to the base without depending upon pressure and without rotating a magnetic field applying means. The plasma etching device has magnetic field applying means which has two parallel plate electrodes I and II and RF power applying means, with the base set on the electrode I, and which is horizontal and unidirectional with respect to the surface of the base where plasma etching is carried out. In this plasma etching device, an auxiliary electrode is provided at least on the upstream side of the base in a flow of electron current generated by the magnetic field applying means. The auxiliary electrode includes a local electrode arranged on the side facing the electrode II and means for adjusting impedance provided at a part of the local electrode to be electrically connected with the electrode I.Type: GrantFiled: November 26, 1999Date of Patent: July 1, 2003Assignees: Tokyo Electron LimitedInventors: Tadahiro Ohmi, Masaki Hirayama, Haruyuki Takano, Yusuke Hirayama
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Publication number: 20020164883Abstract: A plasma device which is provided with a container (100), a gas supply system, and an exhaust system. The container (100) is composed of a first dielectric plate (102) made of a material capable of transmitting microwaves. An antenna (201) for radiating microwaves is located on the outside of the container (100), and an electrode (109) for holding an object (104) to be treated is located inside the container (100). The microwave radiating surface of the antenna (201) and the surface of the object (104) to be treated with plasma are positioned in parallel and opposite to each other. A wall section of the container (100) other than that constituting the first dielectric plate (102) is composed of a member of a material having electrical conductivity higher than that of aluminium, or the internal surface of the wall section is covered with the member.Type: ApplicationFiled: March 18, 2002Publication date: November 7, 2002Inventors: Tadahiro Ohmi, Takahisa Nitta, Masaki Hirayama, Haruyuki Takano, Ryu Kaiwara
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Patent number: 6357385Abstract: A plasma device which is provided with a container, a gas supply system, and an exhaust system. The container is composed of a first dielectric plate made of a material capable of transmitting microwaves. An antenna for radiating microwaves is located on the outside of the container, and an electrode for holding an object to be treated is located inside the container. The microwave radiating surface of the antenna and the surface of the object to be treated with plasma are positioned in parallel and opposite to each other. A wall section of the container other than that constituting the first dielectric plate is composed of a member of a material having electrical conductivity higher than that of aluminum, or the internal surface of the wall section is covered with the member.Type: GrantFiled: October 5, 1999Date of Patent: March 19, 2002Inventors: Tadahiro Ohmi, Takahisa Nitta, Masaki Hirayama, Haruyuki Takano, Ryu Kaiwara
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Patent number: 6153068Abstract: The present invention provides a sputtering device provided with two electrodes I and II of parallel plate type within a vessel inside which pressure can be reduced, wherein: a target to be sputtered is placed on said electrode I, and a base body on which a film is to be deposited is placed on said electrode II, with the target and the base body being opposed to each other; a process gas is introduced into said vessel from a gas supply system; radio frequency power is applied to said target through at least said electrode I so as to excite plasma between the electrode I and the electrode II; characterized in that: outside said vessel, is provided a means for introducing magnetic field horizontal at least to a surface to be sputtered of said target.Type: GrantFiled: March 5, 1998Date of Patent: November 28, 2000Assignee: Tadahiro OhmiInventors: Tadahiro Ohmi, Masaki Hirayama, Haruyuki Takano, Yusuke Hirayama