Abstract: A bonding tool for ultrasonically bonding wire leads is provided with a bonding tip having a pitted bonding surface thereby providing improved tool gripping action with respect to the lead that is being bonded.

Abstract: An ultrasonic wire bonding chuck includes first and second jaws for squeezing therebetween and clamping securely thereto said state frames utilized in forming microintegrated circuit solid state devices by ultrasonic bonding techniques. A clamping finger is provided for each lead on the frame secured by the chuck. Additionally the clamping surfaces of both jaws are roughened to provide enhanced gripping action on the member to be clamped and are arranged to substantially eliminate the effects of frame burrs and distortion on the clamping of the frame.