Patents by Inventor Harvey Endler

Harvey Endler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5291201
    Abstract: A microwave integrated circuit for frequency translation includes a pair of mixers for receiving the input RF signal, mixing it with a pair of quadrature frequency modulation signals and by combining the output of the mixers in a quadrature coupler, suppressing all signals except for the input RF signal plus the modulation frequency. This is accomplished in an environment of high "g" forces, significant temperature variations and a need for high reliability and fast operation by a miniaturized microwave integrated circuit having microstrips on the top and bottom sides of a ceramic substrate. The mixers consist of quad diode chips which are compression welded to one side of the microstrip for good resistance to high "g" forces. Suitable balancing is provided by use of a ground plane on the opposite side with tapering. A quadrature coupler to suppress the lower sideband is in the form of a LANGE coupler which is effectively integrated on the top side of the substrate.
    Type: Grant
    Filed: February 23, 1993
    Date of Patent: March 1, 1994
    Assignee: Systron Donner Corporation
    Inventors: Harvey Endler, Farid Mesghali
  • Patent number: 5208554
    Abstract: A Class A high power amplifier having an operating frequency in the range of less than substantially 2 GHz and suitable for aircraft use, is all solid state in that gallium arsenide field effect transistors are utilized. These are mounted in a large copper heat sink which is air cooled to provide for overall cooling by conduction and convection. By the use of microstrip matching circuits, the relatively low impedance of the gallium arsenide FET units is matched to the required higher system impedance. At the same time a 40% band-width is provided due to the superior matching.
    Type: Grant
    Filed: January 24, 1992
    Date of Patent: May 4, 1993
    Assignee: Systron Donner Corporation
    Inventors: Harvey Endler, Hadi Mojaradi