Abstract: A rapid curing adhesive for wood finger jointing and laminating and a method of its use are disclosed. The adhesive consists of two parts that are used as a honeymoon system. One part is used on one side of the joint being formed and the other part on the other side. When the parts are joined under pressure a very rapid reaction occurs resulting in a durable weather resistant joint. Wood finger joints bonded with the adhesive can be handled for further processing within as little time as 15 seconds. The first part of the adhesive is a conventional resorcinol-formaldehyde or phenol-resorcinol formaldehyde resin containing a hardener such as an alkylene group donor. The second part is a similar resin lacking any hardener but containing a modifier which is a heterocyclic oxygen and nitrogen containing compound. Morpholine has proved to serve well as the modifier. The hardener in the first part is used in a sufficient amount to effect a thermosetting cure for the resin used in both parts.