Patents by Inventor Harvey H. White, Jr.

Harvey H. White, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5185882
    Abstract: Test data is incorporated within the microcode of a bit-slice microprocessor to be used during development of the program to verify program performance and during operation of the program as a built-in test. Little additional hardware is required and there is minimal impact on the structure of the program. The program is allowed to operate with the same data that it would have when integrated with the system. During development, the embedded data is used as a substitute for the rest of the system, allowing program development to continue until system integration, using only power supplies and some test equipment. When implemented and used with a commercially available microprocessor ROM emulator, the test data may be varied to highlight difficulties in algorithm design and program development. The operating program cannot tell the difference between live system data and embedded test data. Thus, the program will behave identically during development and system operation.
    Type: Grant
    Filed: April 27, 1990
    Date of Patent: February 9, 1993
    Assignee: Westinghouse Electric Corp.
    Inventors: Harvey H. White, Jr., Harry Boler
  • Patent number: 4988949
    Abstract: An apparatus for detecting excessive chafing of a cable arrangement against an electrically grounded structure includes a layer of semiconductive material positioned in surrounding relation with an elongated member such as an electrical cable, tube or hose. A layer of electrically insulating material surrounds the layer of semiconductive material. A detector circuit is electrically connected with a reference end portion of the semiconductive layer. The detector circuit is operable to detect at least momentary contact between the layer of semiconductive material and an electrically grounded structure due to erosion of the layer of electrically insulating material surrounding the semiconductive layer caused by excessive chafing of the layer of electrically insulating material against the ground structure.
    Type: Grant
    Filed: May 15, 1989
    Date of Patent: January 29, 1991
    Assignee: Westinghouse Electric Corp.
    Inventors: Robert A. Boenning, Harvey H. White, Jr.