Patents by Inventor Harvey Hum
Harvey Hum has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10170979Abstract: An electronic system includes a multiple POL regulators that supply a regulated voltage to a component within the electronic system. A phase spreading scheme may be implemented so that the POL regulators operate under various phases to reduce voltage noise, high input capacitance, and high radiated emissions. One phase spreading scheme includes a single POL regulator controlling phase spreading so that the other POL regulators operate under different phases. Another phase spreading scheme includes an upstream POL regulator determining a phase offset that may be passed to a downstream POL regulator so that the downstream POL regulator may operate under a different phase relative to the upstream POL regulator.Type: GrantFiled: January 3, 2017Date of Patent: January 1, 2019Assignee: International Business Machines CorporationInventors: Anthony E. Baker, Don R. Dignam, Harvey Hum, Jian Meng
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Patent number: 9964297Abstract: An assembly for use with a heat producing electronic device is disclosed. The assembly may include a heat sink in thermally conductive contact with a shell containing the electronic device, and a light pipe having a first thermal conductivity and configured to transmit light from a light-emitting diode (LED) to a front side of the heat sink. The light pipe may include at least a portion having a thermally conductive layer with a second thermal conductivity greater than the first thermal conductivity. The thermally conductive layer may cover at least a portion of an outer surface of the light pipe, and be positioned between, and in thermally conductive contact with a portion of the heat sink protrusions. The thermally conductive layer may be designed to conduct and radiate heat away from at least a portion of the heat sink protrusions.Type: GrantFiled: January 7, 2016Date of Patent: May 8, 2018Assignee: Lenovo Enterprise Solutions (Singapore) Pte. Ltd.Inventors: Andrew S. Auyeung, Michael J. Craven, Huu Dang, Harvey Hum
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Publication number: 20170117800Abstract: An electronic system includes a multiple POL regulators that supply a regulated voltage to a component within the electronic system. A phase spreading scheme may be implemented so that the POL regulators operate under various phases to reduce voltage noise, high input capacitance, and high radiated emissions. One phase spreading scheme includes a single POL regulator controlling phase spreading so that the other POL regulators operate under different phases. Another phase spreading scheme includes an upstream POL regulator determining a phase offset that may be passed to a downstream POL regulator so that the downstream POL regulator may operate under a different phase relative to the upstream POL regulator.Type: ApplicationFiled: January 3, 2017Publication date: April 27, 2017Inventors: Anthony E. Baker, Don R. Dignam, Harvey Hum, Jian Meng
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Patent number: 9570983Abstract: An electronic system includes a multiple POL regulators that supply a regulated voltage to a component within the electronic system. A phase spreading scheme may be implemented so that the POL regulators operate under various phases to reduce voltage noise, high input capacitance, and high radiated emissions. One phase spreading scheme includes a single POL regulator controlling phase spreading so that the other POL regulators operate under different phases. Another phase spreading scheme includes an upstream POL regulator determining a phase offset that may be passed to a downstream POL regulator so that the downstream POL regulator may operate under a different phase relative to the upstream POL regulator.Type: GrantFiled: April 22, 2014Date of Patent: February 14, 2017Assignee: International Business Machines CorporationInventors: Anthony E. Baker, Don R. Dignam, Harvey Hum, Jian Meng
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Publication number: 20160116149Abstract: An assembly for use with a heat producing electronic device is disclosed. The assembly may include a heat sink in thermally conductive contact with a shell containing the electronic device, and a light pipe having a first thermal conductivity and configured to transmit light from a light-emitting diode (LED) to a front side of the heat sink. The light pipe may include at least a portion having a thermally conductive layer with a second thermal conductivity greater than the first thermal conductivity. The thermally conductive layer may cover at least a portion of an outer surface of the light pipe, and be positioned between, and in thermally conductive contact with a portion of the heat sink protrusions. The thermally conductive layer may be designed to conduct and radiate heat away from at least a portion of the heat sink protrusions.Type: ApplicationFiled: January 7, 2016Publication date: April 28, 2016Inventors: Andrew S. Auyeung, Michael J. Craven, Huu Dang, Harvey Hum
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Patent number: 9255703Abstract: An assembly for use with a heat producing electronic device is disclosed. The assembly may include a heat sink in thermally conductive contact with a shell containing the electronic device, and a light pipe having a first thermal conductivity and configured to transmit light from a light-emitting diode (LED) to a front side of the heat sink. The light pipe may include at least a portion having a thermally conductive layer with a second thermal conductivity greater than the first thermal conductivity. The thermally conductive layer may cover at least a portion of an outer surface of the light pipe, and be positioned between, and in thermally conductive contact with a portion of the heat sink protrusions. The thermally conductive layer may be designed to conduct and radiate heat away from at least a portion of the heat sink protrusions.Type: GrantFiled: June 13, 2014Date of Patent: February 9, 2016Assignee: Lenovo Enterprise Solutions (Singapore) Pte. Ltd.Inventors: Andrew S. Auyeung, Michael J. Craven, Huu Dang, Harvey Hum
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Publication number: 20150362167Abstract: An assembly for use with a heat producing electronic device is disclosed. The assembly may include a heat sink in thermally conductive contact with a shell containing the electronic device, and a light pipe having a first thermal conductivity and configured to transmit light from a light-emitting diode (LED) to a front side of the heat sink. The light pipe may include at least a portion having a thermally conductive layer with a second thermal conductivity greater than the first thermal conductivity. The thermally conductive layer may cover at least a portion of an outer surface of the light pipe, and be positioned between, and in thermally conductive contact with a portion of the heat sink protrusions. The thermally conductive layer may be designed to conduct and radiate heat away from at least a portion of the heat sink protrusions.Type: ApplicationFiled: June 13, 2014Publication date: December 17, 2015Inventors: Andrew S. Auyeung, Michael J. Craven, Huu Dang, Harvey Hum
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Publication number: 20150303793Abstract: An electronic system includes a multiple POL regulators that supply a regulated voltage to a component within the electronic system. A phase spreading scheme may be implemented so that the POL regulators operate under various phases to reduce voltage noise, high input capacitance, and high radiated emissions. One phase spreading scheme includes a single POL regulator controlling phase spreading so that the other POL regulators operate under different phases. Another phase spreading scheme includes an upstream POL regulator determining a phase offset that may be passed to a downstream POL regulator so that the downstream POL regulator may operate under a different phase relative to the upstream POL regulator.Type: ApplicationFiled: April 22, 2014Publication date: October 22, 2015Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Anthony E. Baker, Don R. Dignam, Harvey Hum, Jian Meng
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Patent number: 4742934Abstract: A substantially spill proof container for foodstuffs and the like and particularly for comestibles of the liquid or semi-liquid variety wherein the container lid is provided with an improved anti-spillage interior wall which operates in conjunction with an improved snap locking of the lid to the container tray only at spaced points along the lid's periphery to inhibit spillage of the container's contents during lid closure and opening and without interfering with any such opening.Type: GrantFiled: July 1, 1986Date of Patent: May 10, 1988Assignee: Packaging Corporation of AmericaInventors: John T. Michaud, Harvey Hum
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Patent number: D305409Type: GrantFiled: August 26, 1986Date of Patent: January 9, 1990Assignee: Packaging Corporation of AmericaInventors: John T. Michaud, Harvey Hum