Patents by Inventor Harvey Hum

Harvey Hum has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10170979
    Abstract: An electronic system includes a multiple POL regulators that supply a regulated voltage to a component within the electronic system. A phase spreading scheme may be implemented so that the POL regulators operate under various phases to reduce voltage noise, high input capacitance, and high radiated emissions. One phase spreading scheme includes a single POL regulator controlling phase spreading so that the other POL regulators operate under different phases. Another phase spreading scheme includes an upstream POL regulator determining a phase offset that may be passed to a downstream POL regulator so that the downstream POL regulator may operate under a different phase relative to the upstream POL regulator.
    Type: Grant
    Filed: January 3, 2017
    Date of Patent: January 1, 2019
    Assignee: International Business Machines Corporation
    Inventors: Anthony E. Baker, Don R. Dignam, Harvey Hum, Jian Meng
  • Patent number: 9964297
    Abstract: An assembly for use with a heat producing electronic device is disclosed. The assembly may include a heat sink in thermally conductive contact with a shell containing the electronic device, and a light pipe having a first thermal conductivity and configured to transmit light from a light-emitting diode (LED) to a front side of the heat sink. The light pipe may include at least a portion having a thermally conductive layer with a second thermal conductivity greater than the first thermal conductivity. The thermally conductive layer may cover at least a portion of an outer surface of the light pipe, and be positioned between, and in thermally conductive contact with a portion of the heat sink protrusions. The thermally conductive layer may be designed to conduct and radiate heat away from at least a portion of the heat sink protrusions.
    Type: Grant
    Filed: January 7, 2016
    Date of Patent: May 8, 2018
    Assignee: Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
    Inventors: Andrew S. Auyeung, Michael J. Craven, Huu Dang, Harvey Hum
  • Publication number: 20170117800
    Abstract: An electronic system includes a multiple POL regulators that supply a regulated voltage to a component within the electronic system. A phase spreading scheme may be implemented so that the POL regulators operate under various phases to reduce voltage noise, high input capacitance, and high radiated emissions. One phase spreading scheme includes a single POL regulator controlling phase spreading so that the other POL regulators operate under different phases. Another phase spreading scheme includes an upstream POL regulator determining a phase offset that may be passed to a downstream POL regulator so that the downstream POL regulator may operate under a different phase relative to the upstream POL regulator.
    Type: Application
    Filed: January 3, 2017
    Publication date: April 27, 2017
    Inventors: Anthony E. Baker, Don R. Dignam, Harvey Hum, Jian Meng
  • Patent number: 9570983
    Abstract: An electronic system includes a multiple POL regulators that supply a regulated voltage to a component within the electronic system. A phase spreading scheme may be implemented so that the POL regulators operate under various phases to reduce voltage noise, high input capacitance, and high radiated emissions. One phase spreading scheme includes a single POL regulator controlling phase spreading so that the other POL regulators operate under different phases. Another phase spreading scheme includes an upstream POL regulator determining a phase offset that may be passed to a downstream POL regulator so that the downstream POL regulator may operate under a different phase relative to the upstream POL regulator.
    Type: Grant
    Filed: April 22, 2014
    Date of Patent: February 14, 2017
    Assignee: International Business Machines Corporation
    Inventors: Anthony E. Baker, Don R. Dignam, Harvey Hum, Jian Meng
  • Publication number: 20160116149
    Abstract: An assembly for use with a heat producing electronic device is disclosed. The assembly may include a heat sink in thermally conductive contact with a shell containing the electronic device, and a light pipe having a first thermal conductivity and configured to transmit light from a light-emitting diode (LED) to a front side of the heat sink. The light pipe may include at least a portion having a thermally conductive layer with a second thermal conductivity greater than the first thermal conductivity. The thermally conductive layer may cover at least a portion of an outer surface of the light pipe, and be positioned between, and in thermally conductive contact with a portion of the heat sink protrusions. The thermally conductive layer may be designed to conduct and radiate heat away from at least a portion of the heat sink protrusions.
    Type: Application
    Filed: January 7, 2016
    Publication date: April 28, 2016
    Inventors: Andrew S. Auyeung, Michael J. Craven, Huu Dang, Harvey Hum
  • Patent number: 9255703
    Abstract: An assembly for use with a heat producing electronic device is disclosed. The assembly may include a heat sink in thermally conductive contact with a shell containing the electronic device, and a light pipe having a first thermal conductivity and configured to transmit light from a light-emitting diode (LED) to a front side of the heat sink. The light pipe may include at least a portion having a thermally conductive layer with a second thermal conductivity greater than the first thermal conductivity. The thermally conductive layer may cover at least a portion of an outer surface of the light pipe, and be positioned between, and in thermally conductive contact with a portion of the heat sink protrusions. The thermally conductive layer may be designed to conduct and radiate heat away from at least a portion of the heat sink protrusions.
    Type: Grant
    Filed: June 13, 2014
    Date of Patent: February 9, 2016
    Assignee: Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
    Inventors: Andrew S. Auyeung, Michael J. Craven, Huu Dang, Harvey Hum
  • Publication number: 20150362167
    Abstract: An assembly for use with a heat producing electronic device is disclosed. The assembly may include a heat sink in thermally conductive contact with a shell containing the electronic device, and a light pipe having a first thermal conductivity and configured to transmit light from a light-emitting diode (LED) to a front side of the heat sink. The light pipe may include at least a portion having a thermally conductive layer with a second thermal conductivity greater than the first thermal conductivity. The thermally conductive layer may cover at least a portion of an outer surface of the light pipe, and be positioned between, and in thermally conductive contact with a portion of the heat sink protrusions. The thermally conductive layer may be designed to conduct and radiate heat away from at least a portion of the heat sink protrusions.
    Type: Application
    Filed: June 13, 2014
    Publication date: December 17, 2015
    Inventors: Andrew S. Auyeung, Michael J. Craven, Huu Dang, Harvey Hum
  • Publication number: 20150303793
    Abstract: An electronic system includes a multiple POL regulators that supply a regulated voltage to a component within the electronic system. A phase spreading scheme may be implemented so that the POL regulators operate under various phases to reduce voltage noise, high input capacitance, and high radiated emissions. One phase spreading scheme includes a single POL regulator controlling phase spreading so that the other POL regulators operate under different phases. Another phase spreading scheme includes an upstream POL regulator determining a phase offset that may be passed to a downstream POL regulator so that the downstream POL regulator may operate under a different phase relative to the upstream POL regulator.
    Type: Application
    Filed: April 22, 2014
    Publication date: October 22, 2015
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Anthony E. Baker, Don R. Dignam, Harvey Hum, Jian Meng
  • Patent number: 4742934
    Abstract: A substantially spill proof container for foodstuffs and the like and particularly for comestibles of the liquid or semi-liquid variety wherein the container lid is provided with an improved anti-spillage interior wall which operates in conjunction with an improved snap locking of the lid to the container tray only at spaced points along the lid's periphery to inhibit spillage of the container's contents during lid closure and opening and without interfering with any such opening.
    Type: Grant
    Filed: July 1, 1986
    Date of Patent: May 10, 1988
    Assignee: Packaging Corporation of America
    Inventors: John T. Michaud, Harvey Hum
  • Patent number: D305409
    Type: Grant
    Filed: August 26, 1986
    Date of Patent: January 9, 1990
    Assignee: Packaging Corporation of America
    Inventors: John T. Michaud, Harvey Hum