Patents by Inventor Harvey Kong

Harvey Kong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for stacked die packaging
    Patent number: 7381593
    Abstract: A method and apparatus for stacked die packaging provide a leadframe configured for supporting a lower semiconductor die. At least one pillar is formed on the leadframe for supporting an upper semiconductor die. The pillar is formed integrally with and of the same material as the leadframe, and is sized to have a predetermined height that is higher than the height of such a lower semiconductor die plus the height of bonding wires for such a lower semiconductor die plus a predetermined spacing between such bonding wires and the bottom of an upper semiconductor die to be supported on the at least one pillar.
    Type: Grant
    Filed: August 5, 2004
    Date of Patent: June 3, 2008
    Assignee: ST Assembly Test Services Ltd.
    Inventors: Virgil Cotoco Ararao, Harvey Kong