Patents by Inventor Harvey M. Phillips

Harvey M. Phillips has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming selective electroless plating on polymer surfaces
    Patent number: 6863936
    Abstract: A method of plating an aromatic polymer substrate comprises: applying a strippable coating of a non-aromatic polymer to a substrate surface to be plated; selectively illuminating the coated substrate surface with laser light to ablate a selected area of the strippable coating and to activate an underlying region of the substrate surface exposed by the ablation of the strippable coating; contacting the substrate surface with a seeding solution containing polymer-stabilised catalytic seeding particles, so that the seeding particles adhere preferentially to the activated region of the substrate; and electrolessly plating the substrate surface, whereby the seeded areas of the substrate surface are selectively plated.
    Type: Grant
    Filed: December 18, 2001
    Date of Patent: March 8, 2005
    Assignee: Agency for Science, Technology and Research
    Inventors: William T. Chen, Peter M. Moran, Harvey M. Phillips
  • Method of forming selective electroless plating on polymer surfaces
    Publication number: 20020076497
    Abstract: A method of plating an aromatic polymer substrate comprises: applying a strippable coating of a non-aromatic polymer to a substrate surface to be plated; selectively illuminating the coated substrate surface with laser light to ablate a selected area of the strippable coating and to activate an underlying region of the substrate surface exposed by the ablation of the strippable coating; contacting the substrate surface with a seeding solution containing polymer-stabilized catalytic seeding particles, so that the seeding particles adhere preferentially to the activated region of the substrate; and electrolessly plating the substrate surface, whereby the seeded areas of the substrate surface are selectively plated.
    Type: Application
    Filed: December 18, 2001
    Publication date: June 20, 2002
    Applicant: INSTITUTE OF MATERIALS RESEARCH AND ENGINEERING
    Inventors: William T. Chen, Peter M. Moran, Harvey M. Phillips