Patents by Inventor Hasan Fiaz

Hasan Fiaz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11992894
    Abstract: A method of separating a portion of an object comprising: presenting an object having a thickness; using a laser emission at a wavelength to perforate at least a portion of the thickness of the object sequentially over a length to form a series of perforations between a first portion of the object on one side of the series of perforations and a second portion of the object on the other side of the series of perforations; and applying a stress to the object at the series of perforations to separate the first portion of the object from the second portion of the object, wherein the thickness of the object, at the series of perforations, is transparent to the wavelength of the laser emission.
    Type: Grant
    Filed: February 22, 2019
    Date of Patent: May 28, 2024
    Assignee: CORNING INCORPORATED
    Inventors: Hasan Fiaz, Jann Paul Kaminski, Raymond Miller Karam, Brian Nilsen, Marie Bernadette O'Regan, Garrett Andrew Piech, Sergio Tsuda, ChuanChe Wang, Ming Ying
  • Publication number: 20210086294
    Abstract: A method of separating a portion of an object comprising: presenting an object having a thickness; using a laser emission at a wavelength to perforate at least a portion of the thickness of the object sequentially over a length to form a series of perforations between a first portion of the object on one side of the series of perforations and a second portion of the object on the other side of the series of perforations; and applying a stress to the object at the series of perforations to separate the first portion of the object from the second portion of the object, wherein the thickness of the object, at the series of perforations, is transparent to the wavelength of the laser emission.
    Type: Application
    Filed: February 22, 2019
    Publication date: March 25, 2021
    Inventors: Hasan Fiaz, Jann Paul Kaminski, Raymond Miller Karam, Brian Nilsen, Marie Bernadette O'Regan, Garrett Andrew Piech, Charles Jueilei Wang, Ming Ying