Patents by Inventor Hassan A. Syed

Hassan A. Syed has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220328432
    Abstract: A packaged integrated circuit (IC) includes an IC die having first and second external contacts and a package substrate. The IC die is attached to the package substrate which includes a balun in a first metal layer. The balun is connected to the first and second external contacts of the IC die and to a first external contact of the package substrate. The first and second external contacts of the IC die communicate a differential signal with the package substrate, and the first external contact of the package substrate communicates a single-ended signal corresponding to the differential signal. Alternatively, the balun is connected to an external contact of the IC die and to first and second external contacts of the package substrate, in which the external contact of the IC die communicates a single-ended signal and the first and second external contacts of the package substrate communicate a differential signal.
    Type: Application
    Filed: April 9, 2021
    Publication date: October 13, 2022
    Inventors: Waqas Hassan Syed, Cicero Silveira Vaucher, Antonius Johannes Matheus de Graauw
  • Patent number: 11456227
    Abstract: A mechanism is provided to remove heat from an integrated circuit (IC) device die by directing heat through a waveguide to a heat sink. The waveguide is mounted on top of a package containing the IC device die. The waveguide is thermally coupled to the IC device die. The waveguide transports the heat to a heat sink coupled to the waveguide and located adjacent to the package on top of a printed circuit board on which the package is mounted. Embodiments provide both thermal dissipation of the generated heat while at the same time maintaining good radio frequency performance of the waveguide.
    Type: Grant
    Filed: December 17, 2019
    Date of Patent: September 27, 2022
    Assignee: NXP USA, INC.
    Inventors: Michael B. Vincent, Antonius Johannes Matheus de Graauw, Giorgio Carluccio, Waqas Hassan Syed, Maristella Spella
  • Patent number: 11415626
    Abstract: A method of testing a semiconductor device. An apparatus comprising a semiconductor device and a test apparatus. The semiconductor device includes an integrated circuit and a plurality of external radiating elements at a surface of the device, the radiating elements include transmit elements and receive elements. The test apparatus includes a surface for placing against the surface of the device. The test apparatus also includes at least one waveguide, which extends through the test apparatus for routing electromagnetic radiation transmitted by one of the transmit elements of the device to one of the receive elements of the device. Each waveguide comprises a plurality of waveguide openings for coupling electromagnetically to corresponding radiating elements of the plurality of radiating elements located at the surface of the device. A spacing between the waveguide openings of each waveguide is larger than, or smaller than a spacing between the corresponding radiating elements.
    Type: Grant
    Filed: December 11, 2020
    Date of Patent: August 16, 2022
    Assignee: NXP B.V.
    Inventors: Jan-Peter Schat, Abdellatif Zanati, Henrik Asendorf, Maristella Spella, Waqas Hassan Syed, Giorgio Carluccio, Antonius Johannes Matheus de Graauw
  • Publication number: 20220247196
    Abstract: In some examples, a controller includes a processing resource and a memory resource storing instructions to cause the processing resource to determine a schedule associated with a user identity, and cause, in response to an appointment included on the schedule associated with the user identity, a rechargeable battery of a computing device to charge from a first charge capacity to a second charge capacity.
    Type: Application
    Filed: July 22, 2019
    Publication date: August 4, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Hassan A. Syed, Juan Martinez, Benson C. Lim
  • Patent number: 11276654
    Abstract: A mechanism is provided to remove heat from an integrated circuit (IC) device die by directing heat through a waveguide to a heat sink. Embodiments provide the waveguide mounted on top of a package containing the IC device die. The waveguide is thermally coupled to the IC device die. The waveguide transports the heat to a heat sink coupled to the waveguide and located adjacent to the package on top of a printed circuit board on which the package is mounted. Embodiments provide both thermal dissipation of the generated heat while at the same time maintaining good radio frequency (RF) performance of the waveguide.
    Type: Grant
    Filed: December 17, 2019
    Date of Patent: March 15, 2022
    Assignee: NXP USA, INC.
    Inventors: Michael B. Vincent, Antonius Johannes Matheus de Graauw, Giorgio Carluccio, Waqas Hassan Syed, Maristella Spella
  • Publication number: 20210239754
    Abstract: A method of testing a semiconductor device. An apparatus comprising a semiconductor device and a test apparatus. The semiconductor device includes an integrated circuit and a plurality of external radiating elements at a surface of the device, the radiating elements include transmit elements and receive elements. The test apparatus includes a surface for placing against the surface of the device. The test apparatus also includes at least one waveguide, which extends through the test apparatus for routing electromagnetic radiation transmitted by one of the transmit elements of the device to one of the receive elements of the device. Each waveguide comprises a plurality of waveguide openings for coupling electromagnetically to corresponding radiating elements of the plurality of radiating elements located at the surface of the device. A spacing between the waveguide openings of each waveguide is larger than, or smaller than a spacing between the corresponding radiating elements.
    Type: Application
    Filed: December 11, 2020
    Publication date: August 5, 2021
    Inventors: Jan-Peter Schat, Abdellatif Zanati, Henrik Asendorf, Maristella Spella, Waqas Hassan Syed, Giorgio Carluccio, Antonius Johannes Matheus de Graauw
  • Publication number: 20210183797
    Abstract: A mechanism is provided to remove heat from an integrated circuit (IC) device die by directing heat through a waveguide to a heat sink. Embodiments provide the waveguide mounted on top of a package containing the IC device die. The waveguide is thermally coupled to the IC device die. The waveguide transports the heat to a heat sink coupled to the waveguide and located adjacent to the package on top of a printed circuit board on which the package is mounted. Embodiments provide both thermal dissipation of the generated heat while at the same time maintaining good radio frequency (RF) performance of the waveguide.
    Type: Application
    Filed: December 17, 2019
    Publication date: June 17, 2021
    Applicant: NXP USA, Inc.
    Inventors: Michael B. Vincent, Antonius Johannes Matheus de Graauw, Giorgio Carluccio, Waqas Hassan Syed, Maristella Spella
  • Publication number: 20210183725
    Abstract: A mechanism is provided to remove heat from an integrated circuit (IC) device die by directing heat through a waveguide to a heat sink. The waveguide is mounted on top of a package containing the IC device die. The waveguide is thermally coupled to the IC device die. The waveguide transports the heat to a heat sink coupled to the waveguide and located adjacent to the package on top of a printed circuit board on which the package is mounted. Embodiments provide both thermal dissipation of the generated heat while at the same time maintaining good radio frequency performance of the waveguide.
    Type: Application
    Filed: December 17, 2019
    Publication date: June 17, 2021
    Applicant: NXP USA, Inc.
    Inventors: Michael B. Vincent, Antonius Johannes Matheus de Graauw, Giorgio Carluccio, Waqas Hassan Syed, Maristella Spella
  • Patent number: 10615134
    Abstract: An integrated circuit package is described comprising an integrated circuit die and an antenna structure coupled to the integrated circuit die and comprising a stacked arrangement of metal and dielectric layers, wherein a first metal layer includes a planar antenna and at least one further metal layer comprises an artificial dielectric layer. The integrated circuit package may improve the directionality of the antenna and reduces the sensitivity of the antenna to the printed circuit board on which the integrated circuit package is mounted.
    Type: Grant
    Filed: January 15, 2018
    Date of Patent: April 7, 2020
    Assignee: NXP B.V.
    Inventors: Maristella Spella, Waqas Hassan Syed, Daniele Cavallo, Mingda Huang, Leo Van Gemert
  • Publication number: 20180233465
    Abstract: An integrated circuit package is described comprising an integrated circuit die and an antenna structure coupled to the integrated circuit die and comprising a stacked arrangement of metal and dielectric layers, wherein a first metal layer includes a planar antenna and at least one further metal layer comprises an artificial dielectric layer. The integrated circuit package may improve the directionality of the antenna and reduces the sensitivity of the antenna to the printed circuit board on which the integrated circuit package is mounted.
    Type: Application
    Filed: January 15, 2018
    Publication date: August 16, 2018
    Inventors: Maristella SPELLA, Waqas Hassan SYED, Daniele CAVALLO, Mingda HUANG, Leo VAN GEMERT
  • Patent number: 7643099
    Abstract: Television systems comprising tuners (1), controllers (2) for controlling tuners (1), and stages (3) for receiving tuned signals from tuners (1) and for supplying control signals to controllers (2), use time-consuming automatic fine tuning signals while high speed tuning. By using lock signals (53) from phase-locked-loops (31) in stages (3) as control signals, an indication whether a channel is active or not can now be got much quicker due to lock signals being much faster available than automatic fine tuning signals. By using synchronization signals (54) from synchronization generators (4) as further control signals, a further indication is got. In a fast tuning mode, frequencies nearby active channels are detected, and in a fine tuning mode, channel frequencies are identified.
    Type: Grant
    Filed: September 18, 2003
    Date of Patent: January 5, 2010
    Assignee: Koninklijke Philips Electronics N.V.
    Inventors: Janardhana Bhat, Akbar Hassan Syed, Teck Tem Leong
  • Publication number: 20040260188
    Abstract: The present invention provides systems and methods for performing automated auscultation and diagnosis of conditions of the cardiovascular system. The invention acquires an acoustic signal emanating from the cardiovascular system via an sensor. In addition, in certain embodiments of the invention an electrical signal, e.g., an electrocardiogram (EKG) is simultaneously acquired. The signals are digitized, and, optionally, filtered to remove noise. The invention then processes and analyses the signal(s) so as to provide a clinically relevant conclusion or recommendation such as a diagnosis or suggested additional tests or therapy.
    Type: Application
    Filed: June 17, 2003
    Publication date: December 23, 2004
    Applicants: The General Hospital Corporation, Massachusetts Institute of Technology
    Inventors: Zeeshan Hassan Syed, John Guttag, Robert A. Levine, Francesca Nesta, Dorothy Curtis