Abstract: An antenna on integrated circuit (IC) package is disclosed. In an embodiment, an IC package comprises: a substrate; a radio frequency (RF) transceiver attached to the substrate; mold compound encapsulating the substrate; a shield layer formed on the mold compound; and one or more vias extending vertically through the shield layer and the mold compound, providing a conductive path to the RF transceiver. In another embodiment, a method comprises: attaching a radio frequency (RF) transceiver to a substrate; encapsulating the substrate with mold compound; forming a shield layer on the mold compound; and forming one or more vias through the shield layer and mold compound, providing a conductive path to the RF transceiver.

Abstract: An antenna on integrated circuit (IC) package is disclosed. In an embodiment, an IC package comprises: a substrate; a radio frequency (RF) transceiver attached to the substrate; mold compound encapsulating the substrate; a shield layer formed on the mold compound; and one or more vias extending vertically through the shield layer and the mold compound, providing a conductive path to the RF transceiver. In another embodiment, a method comprises: attaching a radio frequency (RF) transceiver to a substrate; encapsulating the substrate with mold compound; forming a shield layer on the mold compound; and forming one or more vias through the shield layer and mold compound, providing a conductive path to the RF transceiver.

Abstract: A multiple chip module (MCM) for use with baseband, RF, or IF applications includes a number of active circuit chips having a plurality of different functions. The active circuit chips are mounted on a substrate that is configured to provide an integrated subsystem in a single MCM package. The MCM includes a number of features that enable it to meet electrical performance, high-volume manufacturing, and low-cost requirements. The MCM may incorporate split ground planes to achieve electronic shielding and isolation, vias configured as both thermal sinks and grounding connections, and specifically configured die attach pads and exposed ground conductor pads.

Abstract: The invention discloses an apparatus for reducing peak temperatures and thermal excursions, of semiconductor devices, particularly in pulsed power applications. The apparatus comprises thermally coupling Phase Change Material (PCM) to the dissipating semiconductor device. PCM absorbs heat and stays at a constant temperature during its phase change from solid to liquid. The PCM melting point is chosen so that it is just below the temperature the device would otherwise achieve. When the device approaches the maximum temperature, the PCM melts, drawing heat from the device and lowering the device's peak temperature. As the device stops dissipating, after its pulse period, the PCM material solidifies releasing the heat it absorbed. The apparatus lowers the peak temperature by absorbing heat when the device is dissipating.

Abstract: A multiple chip module (MCM) for use with baseband, RF, or IF applications includes a number of active circuit chips having a plurality of different functions. The active circuit chips are mounted on a substrate that is configured to provide an integrated subsystem in a single MCM package. The MCM includes a number of features that enable it to meet electrical performance, high-volume manufacturing, and low-cost requirements. The MCM may incorporate split ground planes to achieve electronic shielding and isolation, vias configured as both thermal sinks and grounding connections, and specifically configured die attach pads and exposed ground conductor pads.

Abstract: Phase Change Material (“PCM”) are used to reduce the range of temperature excursions in a semiconductor die attached to an interconnect substrate in the flip chip technology. In one embodiment a PCM underfill, which comprises PCM microspheres interspersed within a polymer, is dispensed in the interface area between the semiconductor die and the interconnect substrate. Reduction of the range of temperature excursions in the semiconductor die is achieved since the PCM underfill acts as a cushion to dampen the range of temperature excursions of the semiconductor die. During dissipation of power pulses in the semiconductor die, the PCM underfill absorbs energy from the semiconductor die by changing phase from solid to liquid without a concomitant rise in the temperature of the PCM underfill. Thus, the energy released when power pulses are being dissipated in the semiconductor die does not result in a rise in the temperature of the PCM underfill.

Abstract: Phase Change Material (“PCM”) are used to reduce the range of temperature excursions in a semiconductor die attached to an interconnect substrate in the flip chip technology. In one embodiment a PCM underfill, which comprises PCM microspheres interspersed within a polymer, is dispensed in the interface area between the semiconductor die and the interconnect substrate. Reduction of the range of temperature excursions in the semiconductor die is achieved since the PCM underfill acts as a cushion to dampen the range of temperature excursions of the semiconductor die. During dissipation of power pulses in the semiconductor die, the PCM underfill absorbs energy from the semiconductor die by changing phase from solid to liquid without a concomitant rise in the temperature of the PCM underfill. Thus, the energy released when power pulses are being dissipated in the semiconductor die does not result in a rise in the temperature of the PCM underfill.