Abstract: An integrated circuit can include a processor system configured to execute program code. The processor system can be hard-wired and include a processor hardware resource. The IC also can include a programmable circuitry configurable to implement different physical circuits. The programmable circuitry can be coupled to the processor system. The programmable circuitry can be configurable to share usage of the processor hardware resource of the processor system. The processor system further can control aspects of the programmable circuitry such as power on and/or off and also configuration of the programmable circuitry to implement one or more different physical circuits therein.

Abstract: An integrated circuit can include a processor system configured to execute program code. The processor system can be hard-wired and include a processor hardware resource. The IC also can include a programmable circuitry configurable to implement different physical circuits. The programmable circuitry can be coupled to the processor system. The programmable circuitry can be configurable to share usage of the processor hardware resource of the processor system. The processor system further can control aspects of the programmable circuitry such as power on and/or off and also configuration of the programmable circuitry to implement one or more different physical circuits therein.

Abstract: An integrated circuit can include a processor system configured to execute program code, wherein the processor system is hard-wired. The IC also can include programmable circuitry configurable to implement different physical circuits. The programmable circuitry can be coupled to the processor system and can be configured to implement a power off procedure under the control of the processor system.

Abstract: An integrated circuit can include a processor system configured to execute program code. The processor system can be hard-wired and include a processor hardware resource. The IC also can include a programmable circuitry configurable to implement different physical circuits. The programmable circuitry can be coupled to the processor system. The programmable circuitry can be configurable to share usage of the processor hardware resource of the processor system. The processor system further can control aspects of the programmable circuitry such as power on and/or off and also configuration of the programmable circuitry to implement one or more different physical circuits therein.

Abstract: An integrated circuit can include a processor system configured to execute program code, wherein the processor system is hard-wired. The IC also can include programmable circuitry configurable to implement different physical circuits. The programmable circuitry can be coupled to the processor system and can be configured to implement a power off procedure under the control of the processor system.

Abstract: A semiconductor component having test pads and a method and apparatus for testing the same is described. In an example, an un-bumped substrate is obtained having a pattern of bond pads configured to support bumped contacts and a plurality of test pads. Each of the plurality of test pads is in electrical communication with a respective one of the bond pads. The substrate is tested using the plurality of test pads. In another example, a substrate is fabricated having a pattern of bond pads configured to support bumped contacts and a plurality of test pads. Each of the plurality of test pads is in electrical communication with a respective one of the bond pads. The substrate is tested using the plurality of test pads. An insulating layer is formed over the plurality of test pads.

Abstract: A semiconductor component having test pads and a method and apparatus for testing the same is described. In an example, an un-bumped substrate is obtained having a pattern of bond pads configured to support bumped contacts and a plurality of test pads. Each of the plurality of test pads is in electrical communication with a respective one of the bond pads. The substrate is tested using the plurality of test pads. In another example, a substrate is fabricated having a pattern of bond pads configured to support bumped contacts and a plurality of test pads. Each of the plurality of test pads is in electrical communication with a respective one of the bond pads. The substrate is tested using the plurality of test pads. An insulating layer is formed over the plurality of test pads.

Abstract: A hot swap protection circuit (40) for an integrated circuit being plugged into a powered-up system includes a first circuit (10) for detecting a hot swap condition, a second circuit (20) coupled to the first circuit for preventing a pn junction diode (52) in a pull-up transistor (32) from going into a forward bias condition, and a third circuit (30) coupled to the first and second circuits for preventing the pull-up transistor from turning on during the hot swap condition.

Abstract: In a charge pump system, the frequency of an oscillator is based on the output signals from a plurality of differential amplifiers. Each differential amplifier receives a different reference voltage as well as a common input voltage derived from the pumped voltage. A predetermined logic signal output by the differential amplifiers modifies, i.e. reduces, an original frequency of the oscillator. In this manner, the charge pump system quickly compensates for any overshoot in the pumped voltage in a manner directly correlated to the magnitude of the pumped voltage. If no differential amplifiers output the predetermined logic signal, then the oscillator generates the original frequency. In this manner, the charge pump system also compensates for any undershoot in the pumped voltage by providing the fastest frequency.

Abstract: A low voltage interface circuit with a high voltage tolerance enables devices with different power supply levels to be efficiently coupled together without significant leakage current or damage to the circuits. One embodiment of the present invention comprises a tri-state control circuit, a data path, a reference voltage circuit, and an isolation circuit. The interface circuit provides a high impedance receive mode. In this mode, when a voltage is applied to the I/O pin of the interface circuit which is sufficiently greater than the interface circuit power supply voltage, the isolation circuit isolates the power supply from the I/O pin. The interface circuit also protects all of the transistors from gate to bulk, gate to source and gate to drain voltage drops of greater than a specified voltage, for example 3.6V for a nominal 3V power supply when up to 5.5V is being externally applied to the I/O pin.

Abstract: A low voltage driver circuit capable of interfacing with a high voltage node. The high voltage tolerant input/output circuit of the present invention has a first stage operating at a low voltage integrated circuit standard and a second stage capable of operating at both the low voltage and a high voltage integrated circuit standard. The second stage operates at high voltage during the tristate mode and at low voltage during an active mode. The second stage uses an output driver having a p-type pull-up transistor coupled to an input/output pad. The input/output pad interfaces with a high voltage or mixed voltage network. An isolator circuit is coupled between the first stage and the second stage for voltage isolation when the second stage is operating at high voltage. A charger circuit maintains the high voltage on a gate of the p-type pull-up transistor during the tristate mode and the low voltage during the active mode.