Abstract: A method for creating an air gap in an electronic device, for example, a passive electronic component chip (PECC) for high frequency microwave transmission is provided. Electronic circuitry of a passive electronic component, for example, a termination, an attenuator, etc., is fabricated in a predetermined configuration on a single layer of a substrate to create the PECC. An air gap of configurable dimensions is created at a configurable location on the substrate by dicing the substrate at the configurable location to create a suspended substrate-like environment in the PECC. The created air gap reduces the dielectric constant at the configurable location and reduces capacitance of the substrate along areas located directly above the air gap. The created air gap also reduces a loss tangent, high frequency attenuation, and electromagnetic fields near a ground plane of the PECC, creates a wide strip dimension, and creates less stringent tolerance in the PECC.

Abstract: A method for creating an air gap in an electronic device, for example, a passive electronic component chip (PECC) for high frequency microwave transmission is provided. Electronic circuitry of a passive electronic component, for example, a termination, an attenuator, etc., is fabricated in a predetermined configuration on a single layer of a substrate to create the PECC. An air gap of configurable dimensions is created at a configurable location on the substrate by dicing the substrate at the configurable location to create a suspended substrate-like environment in the PECC. The created air gap reduces the dielectric constant at the configurable location and reduces capacitance of the substrate along areas located directly above the air gap. The created air gap also reduces a loss tangent, high frequency attenuation, and electromagnetic fields near a ground plane of the PECC, creates a wide strip dimension, and creates less stringent tolerance in the PECC.