Patents by Inventor Hatsuo Ishida
Hatsuo Ishida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11124608Abstract: A material with significant protection properties from galactic cosmic radiation and solar energetic particles. Hydrogen-rich benzoxazines which are particularly effective for shielding against such radiation. Benzoxazine resin meets the processing requirements for use with ultra-high molecular weight polyethylene fiber as a hydrogen-rich reinforcement: cure of the resin at 120° C. This highly reactive benzoxazine resin also exhibits low viscosity and adequate shelf life.Type: GrantFiled: April 4, 2019Date of Patent: September 21, 2021Assignees: CASE WESTERN RESERVE UNIVERSITY, MATERIAL ANSWERS LLCInventors: Christopher E. Scott, Hatsuo Ishida, Scott Allen Winroth
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Publication number: 20190309129Abstract: A material with significant protection properties from galactic cosmic radiation and solar energetic particles. Hydrogen-rich benzoxazines which are particularly effective for shielding against such radiation. Benzoxazine resin meets the processing requirements for use with ultra-high molecular weight polyethylene fiber as a hydrogen-rich reinforcement: cure of the resin at 120° C. This highly reactive benzoxazine resin also exhibits low viscosity and adequate shelf life.Type: ApplicationFiled: April 4, 2019Publication date: October 10, 2019Inventors: Christopher E. Scott, Hatsuo Ishida, Scott Allen Winroth
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Patent number: 8183368Abstract: The object of the present invention is to provide a thermosetting compound having dielectric properties, in particular permittivity and dielectric loss, which are improved compared to prior art, a composition containing the same, and a molded article. The thermosetting compound according to the present invention is a dihydro benzoxazine compound represented by the following Formula (2), where, R6 to R13 represent a hydrogen atom, an alkyl group, or the like, and R14 represents a divalent saturated alicyclic hydrocarbon group having a condensed ring structure.Type: GrantFiled: August 3, 2006Date of Patent: May 22, 2012Assignee: Sekisui Chemical Co., Ltd.Inventors: Yuji Eguchi, Kazuo Doyama, Shigeki Nomura, Hatsuo Ishida
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Publication number: 20110288260Abstract: Disclosed are benzoxazine compositions where oxazine rings are part of the polymer main-chain. The benzoxazine oligomers are prepared by the reaction of a bisphenol and an aldehyde, such as formaldehyde or paraformaldehyde, with one or more diamines or polyamines, and optionally with one or more monofunctional amines or monofunctional phenols. Also disclosed are benzoxazine monomers prepared from a bisphenol, an aldehyde, such as formaldehyde or paraformaldehyde, and a monofunctional amine, which benzoxazine monomers may be optionally used as reactive diluents. Further disclosed are benzoxazine monomers are prepared from a diamine, and aldehyde, such as formaldehyde or paraformaldehyde, and a monofunctional phenol, which benzoxazine monomers may also be optionally used as reactive diluents.Type: ApplicationFiled: March 17, 2011Publication date: November 24, 2011Inventors: Hatsuo Ishida, Tarek Agag
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Patent number: 7947802Abstract: Benzoxazine monomers comprising at least one pendant group are described. (Co)Polymers comprising at least one benzoxazine monomer having at least one pendant group are also described. In a preferred embodiment, the pendant group is located in a side chain of the benzoxazine monomer or polymer. Methods for preparing the benzoxazine monomers and polymers are described. Compositions comprising the benzoxazine monomers and polymers have numerous uses including optical materials, and in electronic materials as electrically insulating materials, and as fireproof materials.Type: GrantFiled: September 6, 2007Date of Patent: May 24, 2011Assignee: Case Western Reserve UniversityInventors: Hatsuo Ishida, Pedro Velez-Herrera
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Patent number: 7872079Abstract: The present invention is intended to provide a novel naphthoxazine composition having a smaller amount of volatile components (weight reduction) upon curing, and is to provide a naphthoxazine composition characterized in that a naphthoxazine compound having a phenolic hydroxyl group in the same molecule is further added with an epoxy resin, and a molded product obtained by molding the naphthoxazine composition.Type: GrantFiled: March 24, 2008Date of Patent: January 18, 2011Assignees: Sekisui Chemical Co., Ltd., Case Western Reserve UniversityInventors: Hatsuo Ishida, Masanori Nakamura
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Patent number: 7834099Abstract: An imide-naphthoxazine copolymer comprising a repeating unit represented by General Formula (1) below: (wherein X and Y independently represent a single bond, an oxygen atom, a carbonyl group, or an organic group which may be substituted by a heteroatom; R represents CH3 or H, n represents an integer from 1 to 10; and m represents an integer from 1 to 20).Type: GrantFiled: September 6, 2007Date of Patent: November 16, 2010Assignees: Sekisui Chemical Co., Ltd., Case Western Reserve UniversityInventors: Hatsuo Ishida, Masanori Nakamura
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Patent number: 7709591Abstract: A telechelic polymer composition comprising a telechelic polymer having phenolic hydroxyl groups at both ends and having a weight average molecular weight in the range of 1,000 to 10,000, and a compound having a benzoxazine ring structure or a compound having a naphthoxazine ring structure.Type: GrantFiled: March 26, 2008Date of Patent: May 4, 2010Assignees: Sekisui Chemical Co., Ltd., Case Western Reserve UniversityInventors: Hatsuo Ishida, Masanori Nakamura
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Publication number: 20090299062Abstract: The object of the present invention is to provide a thermosetting compound having dielectric properties, in particular permittivity and dielectric loss, which are improved compared to prior art, a composition containing the same, and a molded article. The thermosetting compound according to the present invention is a dihydro benzoxazine compound represented by the following Formula (2), where, R6 to R13 represent a hydrogen atom, an alkyl group, or the like, and R14 represents a divalent saturated alicyclic hydrocarbon group having a condensed ring structure.Type: ApplicationFiled: August 3, 2006Publication date: December 3, 2009Applicant: Sekisui Chemical Co., Ltd.Inventors: Yuji Eguchi, Kazuo Doyama, Shigeki Nomura, Hatsuo Ishida
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Publication number: 20090247723Abstract: A telechelic polymer composition comprising a telechelic polymer having phenolic hydroxyl groups at both ends and having a weight average molecular weight in the range of 1,000 to 10,000, and a compound having a benzoxazine ring structure or a compound having a naphthoxazine ring structure.Type: ApplicationFiled: March 26, 2008Publication date: October 1, 2009Applicants: CASE WESTERN RESERVE UNIVERSITY, SEKISUI CHEMICAL CO., LTD.Inventors: Hatsuo ISHIDA, Masanori Nakamura
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Publication number: 20090247709Abstract: A diamine polymer comprising a repeat unit represented by the following formula (I) in which diamine is linked to form a triaza ring; wherein R represents a monoamine residue.Type: ApplicationFiled: March 27, 2008Publication date: October 1, 2009Applicants: CASE WESTERN RESERVE UNIVERSITY, SEKISUI CHEMICAL CO., LTD.Inventors: Hatsuo Ishida, Masanori Nakamura
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Publication number: 20090240006Abstract: The present invention is intended to provide a novel naphthoxazine composition having a smaller amount of volatile components (weight reduction) upon curing, and is to provide a naphthoxazine composition characterized in that a naphthoxazine compound having a phenolic hydroxyl group in the same molecule is further added with an epoxy resin, and a molded product obtained by molding the naphthoxazine composition.Type: ApplicationFiled: March 24, 2008Publication date: September 24, 2009Applicants: CASE WESTERN RESERVE UNIVERSITY, SEKISUI CHEMICAL CO., LTD.Inventors: Hatsuo ISHIDA, Masanori Nakamura
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Publication number: 20090187003Abstract: An object of the invention is to provide a thermosetting resin excellent in dielectric characteristics and heat resistance, and to provide a thermosetting composition comprising the thermosetting resin, as well as a molded product, substrate material for electronic devices and so forth obtained from the thermosetting resin. The present invention provides a thermosetting resin having a dihydrobenzoxazine ring structure represented by formula (I) in a main chain thereof, a thermosetting composition comprising the thermosetting resin, as well as a molded product, substrate material for electronic devices and so forth obtained from the thermosetting resin. (in formula (I), Ar1 represents a tetravalent aromatic group, R1 is a hydrocarbon group having a fused alicyclic structure, and n represents an integer from 2 to 500).Type: ApplicationFiled: September 25, 2006Publication date: July 23, 2009Inventors: Yuji Eguchi, Kazuo Doyama, Hatsuo Ishida
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Publication number: 20090076229Abstract: An imide-naphthoxazine copolymer comprising a repeating unit represented by General Formula (1) below: (wherein X and Y independently represent a single bond, an oxygen atom, a carbonyl group, or an organic group which may be substituted by a heteroatom; R represents CH3 or H, n represents an integer from 1 to 10; and m represents an integer from 1 to 20).Type: ApplicationFiled: September 6, 2007Publication date: March 19, 2009Applicant: Sekisui Chemical Co., Ltd.Inventors: Hatsuo Ishida, Masanori Nakamura
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Publication number: 20090069533Abstract: Benzoxazine monomers comprising at least one pendant group are described. (Co)Polymers comprising at least one benzoxazine monomer having at least one pendant group are also described. In a preferred embodiment, the pendant group is located in a side chain of the benzoxazine monomer or polymer. Methods for preparing the benzoxazine monomers and polymers are described. Compositions comprising the benzoxazine monomers and polymers have numerous uses including optical materials, and in electronic materials as electrically insulating materials, and as fireproof materials.Type: ApplicationFiled: September 6, 2007Publication date: March 12, 2009Inventors: Hatsuo Ishida, Pedro Velez-Herrera
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Publication number: 20090062502Abstract: The present invention provides a resin having both an aromatic ketone structure and a benzoxazine structure, having a repeat unit represented by following general formula (1) —[B—C(?O)—B-A]n- ??formula (1): (wherein A represents a directly coupling single bond or a diamine residue, B represents a group that contains a benzoxazine structure and is bonded by an aromatic part of the benzoxazine structure to the —C(?O)—, and n represents an Integer in a range of from 3 to 30).Type: ApplicationFiled: August 27, 2007Publication date: March 5, 2009Applicant: Sekisui Chemical Co., Ltd.Inventors: Hatsuo Ishida, Masanori Nakamura
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Publication number: 20090054614Abstract: The present invention provides a method for producing a thermosetting resin having a dihydrobenzoxazine ring structure, characterized by heating and reacting a) a multi-functional phenolic compound represented by the following general formula (I), b) a diamine compound represented by the following general formula (II) and c) an aldehyde compound: wherein X is an organic group containing an aromatic ring and having 6 or more carbon atoms, Y is an organic group having 5 or more carbon atoms, while both X and Y optionally have N, O, F as a heteroatom, and the benzene rings of both sides of X and Y are bonded to different atoms in X and Y.Type: ApplicationFiled: February 20, 2007Publication date: February 26, 2009Applicant: SEKISUI CHEMICAL CO., LTD.Inventors: Yuji Eguchi, Kazuo Doyama, Hatsuo Ishida
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Publication number: 20070191555Abstract: The invention provides a thermosetting resin composition comprising a bifunctional dihydrobenzoxazine compound and an epoxy compound, and provides a thermosetting resin molding obtained by thermally curing the thermosetting resin composition. The molding has excellent electric properties of low dielectric constant and low dielectric loss tangent. The resin composition comprises an epoxy compound and a bifunctional dihydrobenzoxazine compound of the following general formula (1), wherein the equivalent ratio of the epoxy compound to the bifunctional dihydrobenzoxazine compound is 1/(0.1 to 20): wherein R represents a linear alkylene group having at least 2 carbon atoms, or a branched alkylene group derived from it by substituting the hydrogen atom therein with an alkyl group, and the hydrogen atom of the benzene ring may be substituted with an alkyl group or an alkoxy group.Type: ApplicationFiled: March 30, 2004Publication date: August 16, 2007Inventors: Hatsuo Ishida, Koichi Shibayama, Hiroshi Abe
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Publication number: 20060122012Abstract: A method for isolating ionomers of an ionomer blend includes chemically modifying the ionomers of the ionomer blend by esterifying the carboxylic acid groups and then separating the chemically modified ionomers. The ionomers may be separated by taking advantage of the different solubilities of ionomers of different acid compositions and precipitating at least one of the ionomers from the ionomer blend. The method is particularly useful in determining the acid content of the ionomers in a golf ball layer comprising an ionomer blend.Type: ApplicationFiled: November 30, 2005Publication date: June 8, 2006Applicant: The Callaway Golf CompanyInventor: Hatsuo Ishida
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Publication number: 20060084742Abstract: Composite materials having desirable properties due at least in part to controlled filler distribution within the composite and methods for preparing the composite materials are disclosed. In one embodiment, the composite material is derived from a blend of two or more substantially immiscible polymers, a solvent component, and at least one filler. The composite materials can be obtained in one embodiment by adding the polymers and filler to the solvent component, mixing the solutions for a period of time, and plating the solution to remove the solvent component and produce the composite material. The solvent component is chosen depending on the properties desired in the composite material and can have greater affinity for a first polymer or a second polymer, or substantially the same affinity for both polymers.Type: ApplicationFiled: October 11, 2005Publication date: April 20, 2006Inventors: Hatsuo Ishida, Masuyuki Kawazoe