Patents by Inventor Hatsuo Nakamura

Hatsuo Nakamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Pattern forming system
    Patent number: 5305222
    Abstract: There is provided a pattern forming system of the present invention comprising a reticule on which a pattern is formed on one or more chips, an apparatus for preliminarily arranging a plurality of shot regions of a main surface of a wafer in a matrix manner in a case where regions where the pattern is formed by one shot are used as shot regions, an apparatus for calculating the number of the shot regions, which constitutes the matrix after sequentially moving the position of the shot regions to be a center of the matrix in a state that wafer is fixed, and the number of the chips wherein the pattern is completely formed on the main surface of the wafer, an apparatus for selecting a case in which the number of the shot regions constituting the matrix is the smallest and the number of the chips in which the pattern is completely formed on the main surface of the wafer is the largest, and an apparatus for forming the pattern, which is formed on the reticule, on each shot region constituting the matrix.
    Type: Grant
    Filed: December 16, 1991
    Date of Patent: April 19, 1994
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Hatsuo Nakamura
  • Method of dicing a semiconductor wafer
    Patent number: 4610079
    Abstract: A method of dicing a semiconductor wafer in which a physical discontinuity is formed on the surface of the wafer on both sides of a dicing line to limit the spreading of cracks and chips generated during dicing. Thereafter, the semiconductor wafer is diced to separate the pellets.
    Type: Grant
    Filed: February 26, 1985
    Date of Patent: September 9, 1986
    Assignee: Tokyo Shibaura Denki Kabushiki Kaisha
    Inventors: Masahiro Abe, Masafumi Miyagawa, Hatsuo Nakamura, Toshio Yonezawa
  • Negative-working photoresist coating composition
    Patent number: 4525523
    Abstract: There is proposed a negative-working photoresist coating composition of an improved resolution, which comprises a cyclized polyisoprene having a weight-average molecular weight of 10,000 to 100,000 and a molecular weight distribution of not more than 1.9, an organic solvent of the cyclized polyisoprene, and a bisazido compound as a crosslinking agent.
    Type: Grant
    Filed: August 26, 1983
    Date of Patent: June 25, 1985
    Assignees: Kanto Chemical Co., Inc., Tokyo Shibaura Denki Kabushiki Kaisha
    Inventors: Hatsuo Nakamura, Tiharu Kato, Toshio Yonezawa, Shigeo Koguchi, Kiyoto Mori, Masahiko Igarashi
  • Method for forming resist pattern
    Patent number: 4461825
    Abstract: An improved method of forming a photoresist pattern in the photoengraving process. In the photoengraving process, after forming a photoresist layer, a non-photosensitive organic layer containing cyclized polyisoprene rubber as the major constituent is formed thereover. The organic layer is covered with a mask. The photoresist layer is selectively exposed to light through the organic layer. After developing and removing the organic layer, or together with the organic layer, the photoresist layer is developed.
    Type: Grant
    Filed: September 26, 1983
    Date of Patent: July 24, 1984
    Assignee: Tokyo Shibaura Denki Kabushiki Kaisha
    Inventors: Tiharu Kato, Hatsuo Nakamura, Shigeo Koguchi, Toshio Yonezawa, Toshihiro Abe