Patents by Inventor Hatuji Shiraishi

Hatuji Shiraishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor encapsulating epoxy resin compositions
    Patent number: 5137940
    Abstract: A semiconductor encapsulating epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler is improved in melt flow and moldability when the filler comprises spherical silica having a mean particle size of 5 to 35 .mu.m and a specific surface area of up to 1.4 m.sup.2 /g. A mixture of (A) spherical silica having a mean particle size of 0.1 to 2 .mu.m, and (C) ground silica having a mean particle size of 2 to 15 .mu.m is also useful as the filler. A cured product thereof has a low coefficient of expansion and improved crack resistance upon soldering after moisture absorption.
    Type: Grant
    Filed: February 8, 1990
    Date of Patent: August 11, 1992
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Kazutoshi Tomiyoshi, Toshio Shiobara, Hatuji Shiraishi, Koji Futatsumori