Patents by Inventor Hau-chung Man

Hau-chung Man has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210282477
    Abstract: The present disclosure provides a face shield including one or more airstream-deflecting protrusions for deflecting airstream away from the wearer so as to avoid bacteria, virus or any other hazardous materials in the airstream from depositing on the head and/or hair of a wearer. The present disclosure further provides a full face shield including a flexible sheet, and the flexible sheet has a top portion comprising two folding structures located adjacent to lateral edges of the flexible sheet respectively for bending the top portion towards a forehead of a wearer. As the top portion of the full face shield is bent towards a forehead of the wearer through the folding structure, the face, forehead and a large portion of the front skull of the wearer can be protected.
    Type: Application
    Filed: January 21, 2021
    Publication date: September 16, 2021
    Inventors: Hau-chung MAN, Ki-fung CHENG, Kin-man HO, Ping-kong WAI, Lok Ting LAU, Yifan ZHANG, Wing-fai WONG
  • Patent number: 6528184
    Abstract: Techniques are provided for electrolessly depositing and electrodepositing a CoMoP barrier coating onto copper or copper alloys to prevent copper diffusion when forming gold layers on articles such as watch bracelets, watch cases, imitation jewellery, spectacle frames, and metal buttons.
    Type: Grant
    Filed: February 28, 2001
    Date of Patent: March 4, 2003
    Assignees: Hong Kong Polytechnic University, Hong Kong Productivity Council
    Inventors: Hau-chung Man, Wing-yan Ng, Chi-hung Yeung, Chi-yung Lee, Cho-lung Siu, Rick Y. C. Tsui, Kinny L. K. Yeung
  • Patent number: 6528185
    Abstract: Techniques are provided for electrolessly depositing and electrodepositing CoWP barrier coating onto copper or copper alloys to prevent copper diffusion when forming layers on articles such as watch bracelets, watch cases, imitation jewelry, spectacle frames and metal buttons.
    Type: Grant
    Filed: February 28, 2001
    Date of Patent: March 4, 2003
    Assignees: Hong Kong Polytechnic University, Hong Kong Productivity Council
    Inventors: Hau-chung Man, Wing-yan Ng, Chi-hung Yeung, Chi-yung Lee, Cho-lung Siu, Rick Y. C. Tsui, Kinny L. K. Yeung
  • Publication number: 20020160222
    Abstract: Techniques are provided for electrolessly depositing and electrodepositing CoWP barrier coating onto copper or copper alloys to prevent copper diffusion when forming layers on articles such as watch bracelets, watch cases, imitation jewellery, spectacle frames and metal buttons.
    Type: Application
    Filed: February 28, 2001
    Publication date: October 31, 2002
    Inventors: Hau-chung Man, Wing-yan Ng, Chi-hung Yeung, Chi-yung Lee, Cho-lung Siu, Ricky Y. C. Tsui, Kinny L. K. Yeung
  • Publication number: 20020155315
    Abstract: Techniques are provided for electrolessly depositing and electrodepositing CoMoP barrier coating onto copper or copper alloys to prevent copper diffusion when forming layers on articles such as watch bracelets, watch cases, imitation jewellery, spectacle frames and metal buttons.
    Type: Application
    Filed: February 28, 2001
    Publication date: October 24, 2002
    Inventors: Hau-Chung Man, Wing-Yan Ng, Chi-Hung Yeung, Chi-Yung Lee, Cho-Lung Siu, Rick Y. C. Tsui, Kinny L. K. Yeung