Patents by Inventor Hau Wang Ng

Hau Wang Ng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing an enhanced thermal dissipation integrated circuit package
    Patent number: 7015072
    Abstract: In one aspect, the present invention relates to a method of manufacturing an integrated circuit package, the method including installing a carrier onto a substrate, attaching a semiconductor die to the substrate, and aligning an assembly over the semiconductor die, wherein the assembly includes a heat sink and a thermally conductive element. This aspect further includes resting the assembly on the carrier such that the thermally conductive element does not directly contact the semiconductor die, and encapsulating the thermally conductive element and the heat sink such that a portion of the heat sink is exposed to the surroundings of the package.
    Type: Grant
    Filed: March 18, 2004
    Date of Patent: March 21, 2006
    Assignee: ASAT Limited
    Inventors: Edward G. Combs, Robert P. Sheppard, Tai Wai Pun, Hau Wang Ng, Chun Ho Fan, Neil Robert McLellen