Abstract: A substrate-integrated dielectric resonator contains a substrate layer with a first dielectric constant, a plurality of dielectric vias, and a plurality of second vias. Each dielectric via includes a first via-hole extending through the substrate layer, and a dielectric material with a second dielectric constant contained within the first via-hole. Each second via has a second via-hole extending through the substrate layer and filled with gas. A dielectric resonator antenna containing a substrate-integrated dielectric resonator and a method of fabricating the same is also disclosed. By skillfully arranging second vias inside the DRA, the resonant frequencies of different modes can be controlled, and a wide impedance band-width with stable radiation performance can be achieved.

Abstract: A substrate-integrated dielectric resonator contains a substrate layer with a first dielectric constant, a plurality of dielectric vias, and a plurality of second vias. Each dielectric via includes a first via-hole extending through the substrate layer, and a dielectric material with a second dielectric constant contained within the first via-hole. Each second via has a second via-hole extending through the substrate layer and filled with gas. A dielectric resonator antenna containing a substrate-integrated dielectric resonator and a method of fabricating the same is also disclosed. By skillfully arranging second vias inside the DRA, the resonant frequencies of different modes can be controlled, and a wide impedance band-width with stable radiation performance can be achieved.

Abstract: A substrate-integrated device includes a substrate layer with a first dielectric constant and one or more dielectric vias, the one or more dielectric vias each includes a via-hole extending through the substrate layer, and a dielectric material with a second dielectric constant contained within the via-hole. The second dielectric constant is larger than, preferably at least two times, the first dielectric constant.