Patents by Inventor Havens R. John

Havens R. John has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Platinum silicide permeation layer device with microlocaions
    Patent number: 6838053
    Abstract: Electronically addressable microchips having covalently bound permeation layers and methods of making such covalently bonded permeation layers to microchips are provided. The covalent bonding is derived from combining the use of electrodes with silane derivatives. Such chemistry provides the ability to apply an electronic bias to the electrodes of the microchip while preventing permeation layer delaminating from the electrode surface.
    Type: Grant
    Filed: August 3, 2001
    Date of Patent: January 4, 2005
    Assignee: Nanogen, Inc.
    Inventors: Havens R. John, Theodore M. Winger, Jain Krotz, Smolko Dan, Thomas J. Onofrey
  • Methods for molding and grafting highly uniform polymer layers onto electronic microchips
    Patent number: 6524517
    Abstract: Microreaction molds and methods of molding very thin films onto substrate surfaces are provided. The molds and molding methods allow for consistency and uniformity in the thicknesses of the films that are applied to the substrate surfaces. The molds may be single composite, such as etched silica, or multicomposite, such as quartz/metal. The molds may further comprise an adjustable molding cavity. The molds of this invention are particularly applicable to generating thin polymeric films onto microchip substrates.
    Type: Grant
    Filed: December 15, 1999
    Date of Patent: February 25, 2003
    Assignee: Nanogen, Inc.
    Inventors: Havens R. John, Dan Smolko, Jain Krotz, John J. Scott
  • Permeation layer attachment chemistry and method
    Publication number: 20020015993
    Abstract: Electronically addressable microchips having covalently bound permeation layers and methods of making such covalently bonded permeation layers to microchips are provided. The covalent bonding is derived from combining the use of electrodes with silane derivatives. Such chemistry provides the ability to apply an electronic bias to the electrodes of the microchip while preventing permeation layer delaminating from the electrode surface.
    Type: Application
    Filed: August 3, 2001
    Publication date: February 7, 2002
    Inventors: Havens R. John, Theodore M. Winger, Jain Krotz, Smolko Dan, Thomas J. Onofrey
  • Permeation layer attachment chemistry and method
    Patent number: 6303082
    Abstract: Electronically addressable microchips having covalently bound permeation layers and methods of making such covalently bonded permeation layers to microchips are provided. The covalent bonding is derived from combining the use of electrodes with silane derivatives. Such chemistry provides the ability to apply an electronic bias to the electrodes of the microchip while preventing permeation layer delaminating from the electrode surface.
    Type: Grant
    Filed: December 15, 1999
    Date of Patent: October 16, 2001
    Assignee: Nanogen, Inc.
    Inventors: Havens R. John, Theodore M. Winger, Jain Krotz, Smolko Dan, Thomas J. Onofrey