Patents by Inventor Haw Sun PARK

Haw Sun PARK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LED package and fabrication method of the same
    Patent number: 8957448
    Abstract: An LED package and method thereof include an insulation plate, and a metal board disposed on the insulation plate and etched to form a cavity, wherein the metal board is etched to partially expose the insulation plate to form the cavity. The LED package and method also include an LED chip configured to be mounted inside the cavity, and an encapsulation member filling the cavity, wherein the encapsulation member comprises an epoxy resin. The LED package and method include a through-hole configured to be formed on the insulation plate where the LED chip is mounted. The through-hole enables portions of the LED chip to be exposed, and a metal configured to fill the through-hole to form an electrode to be electrically connected to the LED chip.
    Type: Grant
    Filed: March 29, 2012
    Date of Patent: February 17, 2015
    Assignee: Sungkyunkwan University Foundation for Corporate Collaboration
    Inventors: Su Jeong Suh, Haw Sun Park
  • LED PACKAGE AND FABRICATION METHOD OF THE SAME
    Publication number: 20120248486
    Abstract: An LED package and method thereof include an insulation plate, and a metal board disposed on the insulation plate and etched to form a cavity, wherein the metal board is etched to partially expose the insulation plate to form the cavity. The LED package and method also include an LED chip configured to be mounted inside the cavity, and an encapsulation member filling the cavity, wherein the encapsulation member comprises an epoxy resin. The LED package and method include a through-hole configured to be formed on the insulation plate where the LED chip is mounted. The through-hole enables portions of the LED chip to be exposed, and a metal configured to fill the through-hole to form an electrode to be electrically connected to the LED chip.
    Type: Application
    Filed: March 29, 2012
    Publication date: October 4, 2012
    Applicant: SUNGKYUNKWAN UNIVERSITY
    Inventors: Su Jeong SUH, Haw Sun PARK