Patents by Inventor Hay Wong

Hay Wong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Device for in-situ fabrication process monitoring and feedback control of an electron beam additive manufacturing process
    Patent number: 11532760
    Abstract: A High Energy Beam Processing (HEBP) system provides feedback signal monitoring and feedback control for the improvement of process repeatability and three-dimensional (3D) printed part quality. Signals reflecting process parameters and the quality of the fabricated parts are analyzed by monitoring feedback signals from artifact sources with a process controller which adjusts process parameters. In this manner, fabricated parts are produced more accurately and consistently from powder feedstock by compensating for process variation in response to feedback signals.
    Type: Grant
    Filed: May 21, 2018
    Date of Patent: December 20, 2022
    Assignees: Howmedica Osteonics Corp.
    Inventors: Christopher J. Sutcliffe, Rebecca Helen Garrard, Eric Jones, Lewis Mullen, Hay Wong
  • System and process for in-process electron beam profile and location analyses
    Patent number: 11117195
    Abstract: A High Energy Beam Processing (HEBP) system provides feedback signal monitoring and feedback control for the improvement of process repeatability and three-dimensional (3D) printed part quality. Electrons deflected from a substrate in the processing area impinge on a surface of a sensor. The electrons result from the deflection of an electron beam from the substrate. Either one or both of an initial profile of an electron beam and an initial location of the electron beam relative to the substrate are determined based on a feedback electron signal corresponding to the impingement of the electrons on the surface of the sensor. With an appropriate profile and location of the electron beam, the build structure is fabricated on the substrate.
    Type: Grant
    Filed: July 18, 2019
    Date of Patent: September 14, 2021
    Assignees: Howmedica Osteonics Corp.
    Inventors: Christopher J. Sutcliffe, Eric Jones, Hay Wong
  • Device For In-Situ Fabrication Process Monitoring And Feedback Control Of An Electron Beam Additive Manufacturing Process
    Publication number: 20200215810
    Abstract: A High Energy Beam Processing (HEBP) system provides feedback signal monitoring and feedback control for the improvement of process repeatability and three-dimensional (3D) printed part quality. Signals reflecting process parameters and the quality of the fabricated parts are analyzed by monitoring feedback signals from artifact sources with a process controller which adjusts process parameters. In this manner, fabricated parts are produced more accurately and consistently from powder feedstock by compensating for process variation in response to feedback signals.
    Type: Application
    Filed: May 21, 2018
    Publication date: July 9, 2020
    Inventors: Christopher J. SUTCLIFFE, Rebecca Helen GARRARD, Eric JONES, Lewis MULLEN, Hay WONG
  • System And Process For In-process Electron Beam Profile and Location Analyses
    Publication number: 20200023435
    Abstract: A High Energy Beam Processing (HEBP) system provides feedback signal monitoring and feedback control for the improvement of process repeatability and three-dimensional (3D) printed part quality. Electrons deflected from a substrate in the processing area impinge on a surface of a sensor. The electrons result from the deflection of an electron beam from the substrate. Either one or both of an initial profile of an electron beam and an initial location of the electron beam relative to the substrate are determined based on a feedback electron signal corresponding to the impingement of the electrons on the surface of the sensor. With an appropriate profile and location of the electron beam, the build structure is fabricated on the substrate.
    Type: Application
    Filed: July 18, 2019
    Publication date: January 23, 2020
    Inventors: Christopher J. Sutcliffe, Eric Jones, Hay Wong