Abstract: The invention relates to an aluminium OSF integrated circuit panel production method comprising surface preparation of two aluminium alloy sheets, deposition on one of the sheets of a weld-proof ink in reserved areas corresponding to the design of the circuit, connection by rolling of the sheets together, and expansion of the channels corresponding to the non-welded areas using a pressurised fluid, wherein one of the sheets is made of 1000 series alloy and the other of an alloy containing iron and manganese and such that Fe+Mn>0.8% (by weight), and preferentially >1, or 1.5%. The iron and manganese alloy is preferentially obtained by continuous casting of strips between two cooled rolls. The invention also relates to a continuous aluminium alloy integrated circuit panel production method.

Abstract: The invention relates to an aluminium OSF integrated circuit panel production method comprising surface preparation of two aluminium alloy sheets, deposition on one of the sheets of a weld-proof ink in reserved areas corresponding to the design of the circuit, connection by rolling of the sheets together, and expansion of the channels corresponding to the non-welded areas using a pressurised fluid, wherein one of the sheets is made of 1000 series alloy and the other of an alloy containing iron and manganese and such that Fe+Mn>0.8% (by weight), and preferentially >1, or 1.5%. The iron and manganese alloy is preferentially obtained by continuous casting of strips between two cooled rolls.