Abstract: The coil component includes a coil, a first core having a first magnetic permeability, and a second core having a second magnetic permeability lower than the first magnetic permeability. The first core and the second core form a magnetic path. The coil forms two or more winding windows. The first core contacts with an entirety of one side line extending in a second direction of each of the winding windows, and protrudes from both ends of one side line of at least one of the winding windows. The second core contacts with three side lines other than the one side line of each of the winding windows. A surface resistance of the first core between two points that are 20 mm away from each other is not less than 5 ? after a high-temperature storage test. A drive frequency of the coil component is not less than 20 kHz.

Abstract: A suspension board with circuit includes a conductive pattern, including a slider arranged on a surface side of the suspension board with circuit and mounted with a magnetic head, the magnetic head being electrically connected with the conductive pattern; and a light emitting device arranged on the back surface side of the suspension board with circuit and electrically connected with the conductive pattern, in which the conductive pattern includes a first terminal provided on a surface of the suspension board with circuit and electrically connected with the magnetic head; and a second terminal provided on the back surface of the suspension board with circuit and electrically connected with the light emitting device.

Abstract: A suspension board with circuit includes a conductive pattern, including a slider arranged on a surface side of the suspension board with circuit and mounted with a magnetic head, the magnetic head being electrically connected with the conductive pattern; and a light emitting device arranged on the back surface side of the suspension board with circuit and electrically connected with the conductive pattern, in which the conductive pattern includes a first terminal provided on a surface of the suspension board with circuit and electrically connected with the magnetic head; and a second terminal provided on the back surface of the suspension board with circuit and electrically connected with the light emitting device.

Abstract: A suspension board with circuit includes a conductive pattern. The conductive pattern includes a first terminal provided on the front face of the suspension board with circuit and electrically connected with a magnetic head; and a second terminal provided on the back face of the suspension board with circuit and electrically connected with an electronic device.

Abstract: A suspension board with circuit includes a conductive pattern, including a slider arranged on a surface side of the suspension board with circuit and mounted with a magnetic head, the magnetic head being electrically connected with the conductive pattern; and a light emitting device arranged on the back surface side of the suspension board with circuit and electrically connected with the conductive pattern, in which the conductive pattern includes a first terminal provided on a surface of the suspension board with circuit and electrically connected with the magnetic head; and a second terminal provided on the back surface of the suspension board with circuit and electrically connected with the light emitting device.

Abstract: A suspension board with circuit includes a conductive pattern. The conductive pattern includes a first terminal provided on the front face of the suspension board with circuit and electrically connected with a magnetic head; and a second terminal provided on the back face of the suspension board with circuit and electrically connected with an electronic device.

Abstract: A suspension board with circuit includes a conductive pattern, including a slider arranged on a surface side of the suspension board with circuit and mounted with a magnetic head, the magnetic head being electrically connected with the conductive pattern; and a light emitting device arranged on the back surface side of the suspension board with circuit and electrically connected with the conductive pattern, in which the conductive pattern includes a first terminal provided on a surface of the suspension board with circuit and electrically connected with the magnetic head; and a second terminal provided on the back surface of the suspension board with circuit and electrically connected with the light emitting device.

Abstract: A wired circuit board includes an insulating base layer, a conductive pattern formed on the insulating base layer, a tin-based thin layer formed on a surface of the conductive pattern, and containing at least tin oxide, and an insulating cover layer formed on the insulating base layer so as to cover the tin-based thin layer.

Abstract: A method for manufacturing a circuit device, which is suitable for connecting a plurality of laminated wiring layers to each other through an insulating layer, is provided. In a method for manufacturing a hybrid integrated circuit device of the present invention, a first wring layer is formed by laminating a first conductive film on a first insulating layer, and patterning the first conductive film. In the first wiring layer, a first connection part which is protruded in a thickness direction is formed. Moreover, the first wiring layer including the first connection part is covered with a second insulating layer. The second insulating layer is formed of a first resin film and a second resin film. The second resin film contains fewer inorganic fillers than the first resin film. Thus, there is an advantage that a through-hole can be easily formed.

Abstract: A wired circuit board includes an insulating layer, a conductive pattern made of copper formed on the insulating layer and a covering layer made of an alloy of copper and tin to cover the conductive pattern. An existing ratio of tin in the covering layer increases in accordance with a distance from an inner surface adjacent to the conductive pattern toward an outer surface being not adjacent to the conductive pattern. An atomic ratio of copper to tin in the outer surface of the covering layer is more than 3.

Abstract: A method for manufacturing a circuit device, which is suitable for connecting a plurality of laminated wiring layers to each other through an insulating layer, is provided. In a method for manufacturing a hybrid integrated circuit device of the present invention, a first wring layer is formed by laminating a first conductive film on a first insulating layer, and patterning the first conductive film. In the first wiring layer, a first connection part which is protruded in a thickness direction is formed. Moreover, the first wiring layer including the first connection part is covered with a second insulating layer. The second insulating layer is formed of a first resin film and a second resin film. The second resin film contains fewer inorganic fillers than the first resin film. Thus, there is an advantage that a through-hole can be easily formed.