Patents by Inventor Hayato Hasegawa

Hayato Hasegawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240077373
    Abstract: A force sensor module according to an embodiment of the present disclosure includes a plurality of force sensors. Each of the force sensor includes a plurality of sensor sections having force detection directions different from each other, and a flexible rubber member that is provided to cover the plurality of sensor sections. The rubber member is configured to transmit a force inputted from outside to the plurality of force sensors by deformation corresponding to the force.
    Type: Application
    Filed: December 16, 2021
    Publication date: March 7, 2024
    Inventors: TOMOKO KATSUHARA, HIDETOSHI MIYASHITA, RUI KAMADA, KIYOKAZU MIYAZAWA, TOSHIMITSU TSUBOI, HAYATO HASEGAWA
  • Patent number: 11867580
    Abstract: An electronic apparatus includes: an exterior body; a pressure-sensitive sensor having a sensing face; and a support supporting the pressure-sensitive sensor such that inner faces the exterior body is opposed to the sensing face.
    Type: Grant
    Filed: June 10, 2022
    Date of Patent: January 9, 2024
    Assignee: SONY GROUP CORPORATION
    Inventors: Tomoko Katsuhara, Akira Ebisui, Taizo Nishimura, Ken Kobayashi, Tetsuro Goto, Yoshiaki Sakakura, Kei Tsukamoto, Hayato Hasegawa, Manami Miyawaki
  • Patent number: 11725992
    Abstract: A sensor includes a capacitive sensor electrode layer, a reference electrode layer, and an elastic layer provided between the sensor electrode layer and the reference electrode layer. A thickness of the elastic layer is 100 ?m or less, and a weight per unit area of the elastic layer is less than 3 mg/cm2.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: August 15, 2023
    Assignee: SONY CORPORATION
    Inventors: Ken Kobayashi, Akira Ebisui, Yoshiaki Sakakura, Tomoko Katsuhara, Hayato Hasegawa, Manami Miyawaki
  • Patent number: 11592941
    Abstract: Electronic equipment includes a pressed body as either a housing or a display, a pressure-sensitive sensor, a support configured to support the pressure-sensitive sensor such that the pressure-sensitive sensor is opposed to the pressed body, and a filler provided between the pressed body and the pressure-sensitive sensor. The filler has a thickness that changes with distance between the pressed body and the pressure-sensitive sensor.
    Type: Grant
    Filed: March 6, 2019
    Date of Patent: February 28, 2023
    Assignee: SONY CORPORATION
    Inventors: Akira Ebisui, Ken Kobayashi, Hayato Hasegawa, Yoshiaki Sakakura, Manami Miyawaki
  • Publication number: 20220390303
    Abstract: An electronic apparatus includes: an exterior body; a pressure-sensitive sensor having a sensing face; and a support supporting the pressure-sensitive sensor such that inner faces the exterior body is opposed to the sensing face.
    Type: Application
    Filed: June 10, 2022
    Publication date: December 8, 2022
    Applicant: SONY GROUP CORPORATION
    Inventors: Tomoko KATSUHARA, Akira EBISUI, Taizo NISHIMURA, Ken KOBAYASHI, Tetsuro GOTO, Yoshiaki SAKAKURA, Kei TSUKAMOTO, Hayato HASEGAWA, Manami MIYAWAKI
  • Patent number: 11402283
    Abstract: An electronic apparatus includes: an exterior body; a pressure-sensitive sensor having a sensing face; and a support supporting the pressure-sensitive sensor such that inner faces the exterior body is opposed to the sensing face.
    Type: Grant
    Filed: September 14, 2017
    Date of Patent: August 2, 2022
    Assignee: SONY CORPORATION
    Inventors: Tomoko Katsuhara, Akira Ebisui, Taizo Nishimura, Ken Kobayashi, Tetsuro Goto, Yoshiaki Sakakura, Kei Tsukamoto, Hayato Hasegawa, Manami Miyawaki
  • Patent number: 11397499
    Abstract: [Object] To provide a technology such as a pressure-sensitive sensor that can sufficiently ensure tolerances. [Solving Means] A pressure-sensitive sensor according to the present technology includes a sensor section, a clearance layer, and a push-in layer. The sensor section includes a sensor electrode layer, a first reference electrode layer, and a first deformable layer that is situated between the sensor electrode layer and the first reference electrode layer. The clearance layer is situated outside of the sensor section to face the first reference electrode layer. The push-in layer is situated between the first reference electrode layer and the clearance layer, and pushes the first reference electrode layer toward the sensor electrode layer in response to an external force to deform the first deformable layer.
    Type: Grant
    Filed: November 28, 2019
    Date of Patent: July 26, 2022
    Assignee: SONY GROUP CORPORATION
    Inventors: Akira Ebisui, Ken Kobayashi, Yoshiaki Sakakura, Hayato Hasegawa, Manami Miyawaki
  • Publication number: 20220027017
    Abstract: [Object] To provide a technology such as a pressure-sensitive sensor that can sufficiently ensure tolerances. [Solving Means] A pressure-sensitive sensor according to the present technology includes a sensor section, a clearance layer, and a push-in layer. The sensor section includes a sensor electrode layer, a first reference electrode layer, and a first deformable layer that is situated between the sensor electrode layer and the first reference electrode layer. The clearance layer is situated outside of the sensor section to face the first reference electrode layer. The push-in layer is situated between the first reference electrode layer and the clearance layer, and pushes the first reference electrode layer toward the sensor electrode layer in response to an external force to deform the first deformable layer.
    Type: Application
    Filed: November 28, 2019
    Publication date: January 27, 2022
    Inventors: AKIRA EBISUI, KEN KOBAYASHI, YOSHIAKI SAKAKURA, HAYATO HASEGAWA, MANAMI MIYAWAKI
  • Publication number: 20210181897
    Abstract: An electronic apparatus includes: an exterior body; a pressure-sensitive sensor having a sensing face; and a support supporting the pressure-sensitive sensor such that inner faces the exterior body is opposed to the sensing face.
    Type: Application
    Filed: September 14, 2017
    Publication date: June 17, 2021
    Applicant: SONY CORPORATION
    Inventors: Tomoko KATSUHARA, Akira EBISUI, Taizo NISHIMURA, Ken KOBAYASHI, Tetsuro GOTO, Yoshiaki SAKAKURA, Kei TSUKAMOTO, Hayato HASEGAWA, Manami MIYAWAKI
  • Patent number: 10936128
    Abstract: The sensor device includes a first conductive layer, a second conductive layer, an electrode substrate, a first support, and a second support. The first conductive layer is formed to be deformable sheet-shaped. The second conductive layer is disposed to be opposed to the first conductive layer. The electrode substrate includes multiple first electrode wires and multiple second electrode wires and is disposed to be deformable between the first conductive layer and the second conductive layer, the multiple second electrode wires being disposed to be opposed to the multiple first electrode wires and intersecting with the multiple first electrode wires. The first support includes multiple first structures, the multiple first structures connecting the first conductive layer and the electrode substrate. The second support includes multiple second structures, the multiple second structures connecting the second conductive layer and the electrode substrate.
    Type: Grant
    Filed: August 26, 2019
    Date of Patent: March 2, 2021
    Assignee: Sony Corporation
    Inventors: Hiroto Kawaguchi, Shogo Shinkai, Kei Tsukamoto, Tomoko Katsuhara, Hayato Hasegawa, Fumihiko Iida, Takayuki Tanaka, Tomoaki Suzuki, Taizo Nishimura, Hiroshi Mizuno, Yasuyuki Abe
  • Publication number: 20210041973
    Abstract: Electronic equipment includes a pressed body as either a housing or a display, a pressure-sensitive sensor, a support configured to support the pressure-sensitive sensor such that the pressure-sensitive sensor is opposed to the pressed body, and a filler provided between the pressed body and the pressure-sensitive sensor. The filler has a thickness that changes with distance between the pressed body and the pressure-sensitive sensor.
    Type: Application
    Filed: March 6, 2019
    Publication date: February 11, 2021
    Inventors: AKIRA EBISUI, KEN KOBAYASHI, HAYATO HASEGAWA, YOSHIAKI SAKAKURA, MANAMI MIYAWAKI
  • Publication number: 20200348191
    Abstract: A sensor includes a capacitive sensor electrode layer, a reference electrode layer, and an elastic layer provided between the sensor electrode layer and the reference electrode layer. A thickness of the elastic layer is 100 ?m or less, and a weight per unit area of the elastic layer is less than 3 mg/cm2.
    Type: Application
    Filed: December 28, 2018
    Publication date: November 5, 2020
    Inventors: KEN KOBAYASHI, AKIRA EBISUI, YOSHIAKI SAKAKURA, TOMOKO KATSUHARA, HAYATO HASEGAWA, MANAMI MIYAWAKI
  • Publication number: 20200097106
    Abstract: The sensor device includes a first conductive layer, a second conductive layer, an electrode substrate, a first support, and a second support. The first conductive layer is formed to be deformable sheet-shaped. The second conductive layer is disposed to be opposed to the first conductive layer. The electrode substrate includes multiple first electrode wires and multiple second electrode wires and is disposed to be deformable between the first conductive layer and the second conductive layer, the multiple second electrode wires being disposed to be opposed to the multiple first electrode wires and intersecting with the multiple first electrode wires. The first support includes multiple first structures, the multiple first structures connecting the first conductive layer and the electrode substrate. The second support includes multiple second structures, the multiple second structures connecting the second conductive layer and the electrode substrate.
    Type: Application
    Filed: August 26, 2019
    Publication date: March 26, 2020
    Applicant: Sony Corporation
    Inventors: Hiroto Kawaguchi, Shogo Shinkai, Kei Tsukamoto, Tomoko Katsuhara, Hayato Hasegawa, Fumihiko Iida, Takayuki Tanaka, Tomoaki Suzuki, Taizo Nishimura, Hiroshi Mizuno, Yasuyuki Abe
  • Patent number: 10386971
    Abstract: A sensor device includes: a sensor layer provided at a position facing a surface, of a substrate having an operation surface, opposite to the operation surface, and configured to detect a contacted position or a pressed position on the operation surface; and a gap layer located in a gap between the substrate and the sensor layer. The gap layer includes a bonding region bonding the substrate to the sensor layer, and a relaxation region relaxing stress applied from the substrate to the sensor layer.
    Type: Grant
    Filed: July 23, 2014
    Date of Patent: August 20, 2019
    Assignee: SONY CORPORATION
    Inventors: Taizo Nishimura, Fumihiko Iida, Hiroshi Mizuno, Yasuyuki Abe, Takayuki Tanaka, Hayato Hasegawa, Shogo Shinkai
  • Patent number: 10282041
    Abstract: Provided is a sensor device, including: a deformable first surface; a second surface facing the first surface; an electrode board between the first surface and the second surface, the electrode board including a plurality of capacitive elements arranged in a matrix; a support including a first support layer and a second support layer, the first support layer including a plurality of first columns, the second support layer being layered on the first support layer, the support being deformable following deformation of the first surface, the support connecting at least one of the first surface and the second surface to the electrode board; and a conductor layer supported by the support.
    Type: Grant
    Filed: March 18, 2015
    Date of Patent: May 7, 2019
    Assignee: Sony Corporation
    Inventors: Shogo Shinkai, Hiroto Kawaguchi, Hiroshi Mizuno, Taizo Nishimura, Fumihiko Iida, Kei Tsukamoto, Hayato Hasegawa, Tomoko Katsuhara
  • Patent number: 10055067
    Abstract: [Object] To provide a sensor device capable of detecting an operation position and a pressing force with high accuracy. [Solution] A sensor device includes a first conductor layer, an electrode substrate, and a plurality of first structural bodies configured to separate the first conductor layer from the electrode substrate. At least one of the first conductor layer and the electrode substrate has flexibility. The electrode substrate includes a plurality of first electrodes and a plurality of second electrodes intersecting the plurality of first electrodes. At least one of the first and second electrodes includes a plurality of sub-electrodes.
    Type: Grant
    Filed: February 6, 2014
    Date of Patent: August 21, 2018
    Assignee: Sony Corporation
    Inventors: Shogo Shinkai, Kei Tsukamoto, Tomoko Katsuhara, Hiroto Kawaguchi, Hayato Hasegawa, Fumihiko Iida, Takayuki Tanaka, Tomoaki Suzuki, Taizo Nishimura, Hiroshi Mizuno, Yasuyuki Abe
  • Publication number: 20180088709
    Abstract: There is provided a sensor device includes a sheet-like first conductor layer and an electrode substrate. The electrode substrate includes a plurality of first electrode wires, a plurality of second electrode wires, capacity sensors being formed at paired portions of the first and second electrode wires, and a sheet substrate that supports the first and second electrode wires. The sensor device also includes a first supporting body including a plurality of first structures that connect the first conductor layer and the electrode substrate.
    Type: Application
    Filed: October 14, 2017
    Publication date: March 29, 2018
    Applicant: Sony Corporation
    Inventors: Takashi Itaya, Shogo Shinkai, Hiroto Kawaguchi, Fumihiko Iida, Hayato Hasegawa, Kei Tsukamoto, Takayuki Tanaka, Tomoko Katsuhara, Tomoaki Suzuki, Taizo Nishimura, Hiroshi Mizuno, Yasuyuki Abe
  • Publication number: 20170364182
    Abstract: The sensor device includes a first conductive layer, a second conductive layer, an electrode substrate, a first support, and a second support. The first conductive layer is formed to be deformable sheet-shaped. The second conductive layer is disposed to be opposed to the first conductive layer. The electrode substrate includes multiple first electrode wires and multiple second electrode wires and is disposed to be deformable between the first conductive layer and the second conductive layer, the multiple second electrode wires being disposed to be opposed to the multiple first electrode wires and intersecting with the multiple first electrode wires. The first support includes multiple first structures, the multiple first structures connecting the first conductive layer and the electrode substrate. The second support includes multiple second structures, the multiple second structures connecting the second conductive layer and the electrode substrate.
    Type: Application
    Filed: September 1, 2017
    Publication date: December 21, 2017
    Applicant: Sony Corporation
    Inventors: Hiroto Kawaguchi, Shogo Shinkai, Kei Tsukamoto, Tomoko Katsuhara, Hayato Hasegawa, Fumihiko Iida, Takayuki Tanaka, Tomoaki Suzuki, Taizo Nishimura, Hiroshi Mizuno, Yasuyuki Abe
  • Patent number: 9811226
    Abstract: There is provided a sensor device that includes a flexible first conductor layer and an electrode substrate. The electrode substrate includes a plurality of first electrode wires, a plurality of second electrode wires, capacity sensors being formed at capacitively coupled portions of the first and second electrode wires, and a flexible substrate that supports the first and second electrode wires. The sensor device also includes a first supporting body including a plurality of first structures that connect the first conductor layer and the electrode substrate.
    Type: Grant
    Filed: August 22, 2014
    Date of Patent: November 7, 2017
    Assignee: Sony Corporation
    Inventors: Takashi Itaya, Shogo Shinkai, Hiroto Kawaguchi, Fumihiko Iida, Hayato Hasegawa, Kei Tsukamoto, Takayuki Tanaka, Tomoko Katsuhara, Tomoaki Suzuki, Taizo Nishimura, Hiroshi Mizuno, Yasuyuki Abe
  • Patent number: 9785297
    Abstract: The sensor device includes a first conductive layer, a second conductive layer, an electrode substrate, a first support, and a second support. The first conductive layer is formed to be deformable sheet-shaped. The second conductive layer is disposed to be opposed to the first conductive layer. The electrode substrate includes multiple first electrode wires and multiple second electrode wires and is disposed to be deformable between the first conductive layer and the second conductive layer, the multiple second electrode wires being disposed to be opposed to the multiple first electrode wires and intersecting with the multiple first electrode wires. The first support includes multiple first structures, the multiple first structures connecting the first conductive layer and the electrode substrate. The second support includes multiple second structures, the multiple second structures connecting the second conductive layer and the electrode substrate.
    Type: Grant
    Filed: December 6, 2013
    Date of Patent: October 10, 2017
    Assignee: Sony Corporation
    Inventors: Hiroto Kawaguchi, Shogo Shinkai, Kei Tsukamoto, Tomoko Katsuhara, Hayato Hasegawa, Fumihiko Iida, Takayuki Tanaka, Tomoaki Suzuki, Taizo Nishimura, Hiroshi Mizuno, Yasuyuki Abe