Patents by Inventor Hayato HORIKOSHI

Hayato HORIKOSHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11267138
    Abstract: The present invention is provided to achieve smooth devanning or depalletizing of rectangular packages while managing various situations. Package identification codes 10a, 10b, 10c, 10d are displayed at a predetermined position of each of four surfaces of front, back, left and right or on each of all surfaces of a package 5A having a rectangular shape, and code data-of the identification codes is identified by a predetermined controller via a reading unit. The code data includes size information of a height size and a width size of a code display surface of the package 5A. The controller of a robot having the reading unit and a robot hand is configured to position the robot hand with the package 5A based on a code display position and the size information.
    Type: Grant
    Filed: November 6, 2018
    Date of Patent: March 8, 2022
    Inventors: Hideki Iino, Kiyoshi Aoki, Hayato Horikoshi
  • Publication number: 20210107750
    Abstract: The present invention is provided to achieve smooth devanning or depalletizing of rectangular packages while managing various situations. Package identification codes 10a, 10b, 10c, 10d are displayed at a predetermined position of each of four surfaces of front, back, left and right or on each of all surfaces of a package 5A having a rectangular shape, and code data-of the identification codes is identified by a predetermined controller via a reading unit. The code data includes size information of a height size and a width size of a code display surface of the package 5A. The controller of a robot having the reading unit and a robot hand is configured to position the robot hand with the package 5A based on a code display position and the size information.
    Type: Application
    Filed: November 6, 2018
    Publication date: April 15, 2021
    Inventors: Hideki IINO, Kiyoshi AOKI, Hayato HORIKOSHI