Abstract: According to one embodiment, an electrostatic capacitance-type sensor-equipped display device includes a display panel with a display surface which displays an image. The sensor includes a plurality of detection electrodes disposed in a matrix, the detection electrodes being mutually electrically independently provided above the display surface and being configured to detect a variation in electrostatic capacitance, and a plurality of lead lines provided above the display surface, connected to the detection electrodes in a one-to-one correspondence, and formed of a metal.

Abstract: Disclosed herein is a pressure sensitive adhesive double coated sheet comprising a shrink substrate and, superimposed on one side thereof, an energy radiation curable pressure sensitive adhesive layer and, superimposed on the other side thereof, a removable pressure sensitive adhesive layer composed of an adhesive having a modulus of elasticity at 120° C. of 5×105 Pa or less. The pressure sensitive adhesive double coated sheet according to the invention enables efficiently processing a work piece with high precision. In particular the pressure sensitive adhesive double coated sheet is suitable to a process capable of producing IC chips of high thickness precision with high yield by reducing warp and minimizing carrying breakage in the grinding of extremely thin or large diameter silicon wafers and capable of performing back grinding and dicing in the same configuration.

Abstract: A method of processing a semiconductor wafer. The wafer is secured to a wafer supporting member having a data carrier. Information required for working the semiconductor wafer is input to the data carrier. The wafer is then worked according to information read from the data carrier. The data carrier is configured to permit operations such as back grinding, dicing and pickup of the wafer, and prevents wafer breakage when the wafer is carried between different operations.

Abstract: A process for producing a chip, comprising the steps of: setting an object to be diced on a pressure sensitive adhesive sheet for producing chip comprising at least one layer of shrinkable film, an expansible film and a pressure sensitive adhesive layer for setting the object; fixing edges of the pressure sensitive adhesive sheet for producing chip; dicing the object into chips, and shrinking the shrinkable film to thereby expand chip spacings. In the process for producing small chips such as semiconductor chips, chip spacings can be expanded without the need to conduct the conventional expansion step.

Abstract: A pressure sensitive adhesive double coated sheet comprising a shrink substrate and, superimposed on both sides thereof, pressure sensitive adhesive layers, at least one of the pressure sensitive adhesive layers being composed of an energy radiation curable pressure sensitive adhesive. The pressure sensitive adhesive double coated sheet enables efficient processing of a work piece with high precision. In particular, the pressure sensitive adhesive double coated sheet is suitable to a process capable of producing IC chips of high thickness precision with high yield by reducing warpage and minimizing carrying breakage in the grinding of extremely thin or large diameter silicon wafers and capable of performing back grinding and dicing in the same configuration.

Abstract: Disclosed herein is a pressure sensitive adhesive double coated sheet comprising a shrink substrate and, superimposed on one side thereof, an energy radiation curable pressure sensitive adhesive layer and, superimposed on the other side thereof, a removable pressure sensitive adhesive layer composed of an adhesive having a modulus of elasticity at 120° C. of 5×105 Pa or less.

Abstract: A process for producing semiconductor chips, comprising the following steps. A semiconductor wafer having a surface overlaid with circuits is provided. An arrangement wherein a back of the semiconductor wafer is fixed on a dicing tape and wherein a pressure sensitive adhesive double coated sheet is stuck to a circuit surface of the semiconductor wafer is formed. The pressure sensitive adhesive double coated sheet comprises a shrinkable base having its both sides overlaid with pressure sensitive adhesive layers. At least one of the layers is composed of an energy radiation curable pressure sensitive adhesive. The semiconductor wafer together with the pressure sensitive adhesive double coated sheet is diced by each circuit to thereby form semiconductor chips. The semiconductor chips are fixed on a transparent hard plate by adherence of the pressure sensitive adhesive layer of the pressure sensitive adhesive double coated sheet remote from the semiconductor chips.

Abstract: Disclosed herein is a pressure sensitive adhesive double coated sheet comprising a shrink substrate and, superimposed on both sides thereof, pressure sensitive adhesive layers, at least one of the pressure sensitive adhesive layers being composed of an energy radiation curable pressure sensitive adhesive. The pressure sensitive adhesive double coated sheet according to the invention enables efficiently processing a work piece with high precision. In particular the pressure sensitive adhesive double coated sheet is suitable to a process capable of producing IC chips of high thickness precision with high yield by reducing warpage and minimizing carrying breakage in the grinding of extremely thin or large diameter silicon wafers and capable of performing back grinding and dicing in the same configuration. Further, the invention provides a process of producing semiconductors of high reliability in which the above pressure sensitive adhesive double coated sheet is used.

Abstract: A process for producing a chip, comprising the steps of:

Abstract: A process for producing a chip, comprising the steps of: setting an object to be diced on a pressure sensitive adhesive sheet for producing chip comprising at least one layer of shrinkable film, an expansible film and a pressure sensitive adhesive layer for setting the object; fixing edges of the pressure sensitive adhesive sheet for producing chip; dicing the object into chips, and shrinking the shrinkable film to thereby expand chip spacings. In the process for producing small chips such as semiconductor chips, chip spacings can be expanded without the need to conduct the conventional expansion step.

Abstract: A process for producing semiconductor chips, comprising the following steps. A semiconductor wafer having a surface overlaid with circuits is provided. An arrangement wherein a back of the semiconductor wafer is fixed on a dicing tape and wherein a pressure sensitive adhesive double coated sheet is stuck to a circuit surface of the semiconductor wafer is formed. The pressure sensitive adhesive double coated sheet comprises a shrinkable base having its both sides overlaid with pressure sensitive adhesive layers. At least one of the layers is composed of an energy radiation curable pressure sensitive adhesive. The semiconductor wafer together with the pressure sensitive adhesive double coated sheet is diced by each circuit to thereby form semiconductor chips. The semiconductor chips are fixed on a transparent hard plate by adherence of the pressure sensitive adhesive layer of the pressure sensitive adhesive double coated sheet remote from the semiconductor chips.

Abstract: A process for producing a chip, comprising the steps of: attaching an object to be diced on a pressure sensitive adhesive sheet comprising at least one layer of shrinkable film and a pressure sensitive adhesive layer; dicing the object into chips, and shrinking the shrinkable film to thereby reduce an area in which the chips are in contact with the pressure sensitive adhesive. In this process, chips of small thickness and large area can easily be picked up without the need to use a thrust needle in the chip pickup step.

Abstract: A process for producing a chip, comprising the steps of:a attaching an object to be diced on a pressure sensitive adhesive sheet comprising at least one layer of shrinkable film and a pressure sensitive adhesive layer;dicing the object into chips, andshrinking the shrinkable film to thereby reduce an area in which the chips are in contact with the pressure sensitive adhesive. In this process, chips of small thickness and large area can easily be picked up without the need to use a thrust needle in the chip pickup step.

Abstract: An energy beam curable pressure sensitive adhesive composition is disclosed which comprises at least two energy beam curable copolymers having energy beam polymerizable groups in side chains thereof. This energy beam curable pressure sensitive adhesive composition has satisfactory adhesive strength before the irradiation with energy beam and can be cured by the irradiation with energy beam to a degree such that the amount of adhesive residue remaining on an adherend after peeling is extremely small. Further, the above composition ensures excellent expansibility at the expanding step and excellent recognition at the time of pickup. Still further, the above composition exhibits high work efficiency because of very low pickup strength at the bonding step, irrespective of the execution of the expanding step.