Patents by Inventor Hayato Takagi

Hayato Takagi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Gripping mechanism, assembly apparatus and component
    Patent number: 11969884
    Abstract: A gripping mechanism (3) includes a gripping roller (32) and a holder (31) that houses the gripping roller (32). A gripped portion (42) of a first component (4) is gripped between an outer surface of the gripping roller (32) and an inner surface of the holder (31) through action of gravity acting on the gripping roller (32). Preferably, the gripping roller (32) includes a core (321) that is cylindrical or columnar in shape and a covering section (322) that is an elastic body covering a circumferential surface of the core (321). Preferably, the covering section (322) has a circumferential surface with a friction coefficient greater than a friction coefficient of the circumferential surface of the core (321).
    Type: Grant
    Filed: August 20, 2019
    Date of Patent: April 30, 2024
    Assignee: KYOCERA Document Solutions Inc.
    Inventors: Tomohiko Yamakawa, Koji Izumi, Masaru Takagi, Hayato Mori
  • PACKAGE FOR INSTALLING SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR DEVICE
    Publication number: 20210175399
    Abstract: A package for installing a semiconductor element includes: a lead frame; a resin frame disposed on the lead frame and including a housing portion formed by an opening that widens with the distance in the upward direction from the lead frame; and a metal reflector that fits in the housing portion and includes an opening portion corresponding to the housing portion of the resin frame. The opening area of the opening portion of the metal reflector increases with the distance in the upward direction from the lead frame, and the metal reflector includes a flange around the side of the metal reflector in which the opening area is large. The flange is placed on the top surface of the resin frame.
    Type: Application
    Filed: February 18, 2021
    Publication date: June 10, 2021
    Inventors: Ikuo NIWA, Yasutaka HASE, Shunsuke AKAI, Hayato TAKAGI, Tomoyuki YOKOTA, Hiroshi SANADA
  • Optical semiconductor package and method of manufacturing the same
    Patent number: 9018658
    Abstract: In an optical semiconductor package, a method of manufacturing the same, and an optical semiconductor device according to the present invention, a thermosetting resin such as an unsaturated polyester resin is used for a reflector 5 or resin 6 exposed around an optical semiconductor element, thereby suppressing deterioration of resin and a reduction in reflectivity.
    Type: Grant
    Filed: May 30, 2012
    Date of Patent: April 28, 2015
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Sumitaka Fukushima, Hiroyuki Sakamoto, Hayato Takagi
  • OPTICAL SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20130134468
    Abstract: In an optical semiconductor package, a method of manufacturing the same, and an optical semiconductor device according to the present invention, a thermosetting resin such as an unsaturated polyester resin is used for a reflector 5 or resin 5 exposed around an optical semiconductor element, thereby suppressing deterioration of resin and a reduction in reflectivity.
    Type: Application
    Filed: May 30, 2012
    Publication date: May 30, 2013
    Applicant: PANASONIC CORPORATION
    Inventors: Sumitaka Fukushima, Hiroyuki Sakamoto, Hayato Takagi
  • Portable heating and cooling control device
    Patent number: D962895
    Type: Grant
    Filed: February 1, 2021
    Date of Patent: September 6, 2022
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Hirofumi Yamakita, Hayato Takagi
  • Portable heating and cooling control device
    Patent number: D962896
    Type: Grant
    Filed: February 1, 2021
    Date of Patent: September 6, 2022
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Hirofumi Yamakita, Hayato Takagi