Abstract: A drive circuit module comprises a board formed of a hard base material having no flexibility, a circuit pattern formed on the board and having a plurality of input terminals and output terminals supported by a flexible insulation film, and a carrying section for carrying a drive LSI and the like on the circuit pattern; characterized in that the board is provided with at least one cutout on a surface opposite to the surface on which the circuit pattern of the board is formed, thereby making flexible the board in a direction in which the output terminal surface and the carrying section surface are different from each other.

Abstract: A serial sampling video signal driving apparatus receives a plurality of color video signals. A serial sampling video driver samples the color video signals one after the other in cyclic fashion, and provides the sampled values to drive a matrix-type color display. A delay circuit delays one or more of the color video signals at different phases before input to the serial sampling video driver, thereby compensating for differences in sampling times.

Abstract: In a liquid crystal display device with a drive circuit board connected to the peripheral portion of a liquid crystal display panel, the circuit board is disposed behind the liquid crystal display panel and also the circuit board is connected with the liquid crystal display panel by means of a connecting member in film form, whereby the liquid crystal display device is miniaturized and efficiency of the assembly work is improved. Further, the circuit board is made up of plural drive circuit modules of the same type whereby the efficiency in the assembly and inspection process is still improved.

Abstract: A method for separating bonded substrates which are prepared by facing a plurality of substrates and bonding the substrates by an adhesive features irradiating an energy beam on the bonding portions of the bonded substrates from above one of the bonded substrates to separate the one substrate and the other substrate. The energy beam has the property of being transmitted through the one substrate and of being absorbed into the adhesive.

Abstract: A circuit board includes a copper plate and an insulating layer of photosensitive polyimide resin formed on the copper plate, the insulating layer leaving an exposed portion of a surface of the copper plate where an LSI is to be mounted. After Au plating is applied to the exposed surface of the copper plate, the LSI is mounted fixedly. A connection pattern having bonding pads is formed by copper plating on the insulating layer. The bonding pads and the LSI are connected by Au wire bonding on the Au plating applied on the bonding pads.

Abstract: A matrix-type color liquid crystal display device comprises display units each comprising each one of red (R), green (G) and blue (B) color pixels arranged in such a manner that R and B pixels on opposite sides of each G pixel belong also to adjacent display units. The R and B signals for that display unit to which the G pixel between R and B pixels of interest belongs are appropriately modified before they are applied to the R and B pixels, whereby the number of required pixels can be reduced.

Abstract: A circuit board includes a copper plate and an insulating layer of photosensitive polyimide resin formed on the copper plate, the insulating layer leaving an exposed portion of a surface of the copper plate where an LSI is to be mounted. After Au plating is applied to the exposed surface of the copper plate, the LSI is mounted fixedly. A connection pattern having bonding pads is formed by copper plating on the insulating layer. The bonding pads and the LSI are connected by Au wire bonding on the Au plating applied on the bonding pads.

Abstract: A process for preparing a combined wiring substrate is carried out by bonding with an adhesive agent the end surfaces of the mutually opposing sides of a plurality of substrates each having a pattern of wiring on its major surface, and by connecting electrically parts of the pattern of wiring which oppose each other by interposing the bonding portion.

Abstract: A multilayer interconnection circuit board includes insulating layers and conductor wiring layers which are alternately laminated. The uppermost conductor wiring layer is electrically connected to an intermediate conductor wiring layer to a predetermined stage by irradiating laser beams in the direction of lamination of layers so that the conductor wiring layer or layers located above the intermediate conductor wiring layer are successively molten by the laser beams. The surface irradiated by the laser beams of the conductor wiring layer at the predetermined stage is treated to reflect laser energy, and the surface of the conductor wiring layer or layers which are molten by the laser beams is treated so as to be susceptive to absorb the laser beams.

Abstract: In a liquid crystal display device with a drive circuit board connected to the peripheral portion of a liquid crystal display panel, the circuit board is disposed behind the liquid crystal display panel and also the circuit board is connected with the liquid crystal display panel by means of a connecting member in film form, whereby the liquid crystal display device is miniaturized and efficiency of the assembly work is improved. Further, the circuit board is made up of plural drive circuit modules of the same type whereby the efficiency in the assembly and inspection process is still improved.

Abstract: A method is provided for forming a circuit board which comprises a copper plate and an insulating layer of photosensitive polyimide resin formed on the copper plate, the insulating layer leaving an exposed portion of a surface of the copper plate where an LSI is to be mounted. After Au plating is applied to the exposed surface of the copper plate, the LSI is mounted fixedly. A connection pattern having bonding pads is formed by copper plating on the insulating layer. The bonding pads and the LSI are connected by Au wire bonding on the Au plating applied on the bonding pads.

Abstract: A tape carrier for mounting and bonding an IC chip on substrate having an interconnection pattern is disclosed. The tape carrier comprises a peripheral and a central film portion made of an electrically insulating flexible material, and a set of leads carried at least one the peripheral film portion. The central portion covers the central area of the surface of the IC chip on which the bumps are formed. An aperture is formed between the peripheral and central film portion which has enough dimension to allow the leads to be bonded to the bumps of the IC chip therethrough. Some of the leads extend over the central film portion and, extending out of a side of the central film portion, reach the opposing area of the peripheral film portion across a strip of the aperture, thereby effecting electrical connection from the bumps to far-away portions of the circuitry on the substrate and between the bumps themselves.

Abstract: A method for producing a high density hybrid integrated circuit substrate capable of forming a very fine pattern of a conductor by means of the chemical plating and at the same time capable of applying the chemical plating, while protecting the resistor formed on the substrate in advance of the chemical plating step, the production method comprising steps of: forming a resistor on an electrically insulating substrate; forming an activating layer for depositing a chemical plating on the electrically insulating substrate in contact with the resistor; forming a stable resin layer, during the chemical plating step, by the photolithography process in a manner to cover the resistor, except for the portion of the activating layer where an electrically conductive layer is to be formed; and forming the electrically conductive layer by the chemical plating on the exposed portion of the activating layer.

Abstract: A method for fabricating a hybrid IC substrate comprises the steps of: preparing an insulating ceramic substrate having a major surface; baking one or more conductors of a first group formed of high melting point metal or alloy thereof on the major surface; covering the conductors of the first group with a first plated film formed by electroless plating; forming an insulating porous active including a glass component and a small amount of a metal component having a catalytic action for electroless plating on the first plated film; and forming one or more conductors of a second group by electroless plating on the active layer, whereby portions of the active layer sandwiched between the conductors of the first and second groups are rendered conductive.

Abstract: In a testing device for testing electric circuit board having test terminals on the board parallel to each other, conductor strips are arranged in conformity with the test terminals, and a pressing member is provided for pressing the conductor strips on the test terminals.

Abstract: In a method of packaging a semiconductor device, the semiconductor device and a mounting body are positioned in such a manner that electrodes of the semiconductor device and leads of the mounting body are brought into slidable mechanical contact with each other, the electrodes being not bonded to the leads. Next, an insulating resin that shrinks on setting is supplied in such a manner that the contacted portions of the electrodes and the leads are covered. Subsequently, the resin is set while keeping the electrodes and the leads in contact with each other to bond the electrodes to the leads whereby the resin, when set, applies a compressive force between the electrodes and the leads.

Abstract: In a method for manufacturing hybrid integrated circuits, a plurality of circuit patterns are formed on one surface of a board, and a connecting film is stuck onto the other surface of the board. Then, the board is divided into portions having the respective circuit patterns while leaving the connecting film intact and component parts are mounted on the portions. Finally, the individual portions are separated by cutting the connecting film. The circuit patterns may be formed over one surface of the board and covered with a connecting film. The connecting film may be a constituent element of each circuit pattern, such as an insulating layer disposed between conducting layers.

Abstract: A method for fabricating a hybrid IC substrate comprises the steps of baking a conductor of a first group on an insulating ceramic substrate, forming an insulating porous active layer including a glass component and a small amount of a metal component having a catalytic action for electroless plating, forming a resist pattern on the active layer by using a photomask, and forming a conductor of a second group by electroless plating on a portion of the active layer not covered with the resist, whereby a portion of the active layer sandwiched between the conductors of the first and second groups is rendered conductive and a portion of the active layer in direct contact with the insulating substrate is maintained as an insulator.

Abstract: In a testing device for testing electric circuit board having test terminals on the board parallel to each other, conductor strips are arranged in conformity with the test terminals, and a pressing member is provided for pressing the conductor strips on the test terminals.

Abstract: A screen printing apparatus comprising a screen having an opening or openings of a desired print pattern and having a lower surface being positioned adjacent to a substrate to be printed, and a nonflexible squeegee comprising a cavity for containing a material to be printed on the substrate. The cavity is defined by the interior surfaces of surrounding walls extending generally vertically from the lower extremities at which the squeegee directly contacts the upper surface of the screen. While the squeegee travels with respect to the screen the material to be printed flows from the cavity into the openings of the screen, and thereby onto the substrate. The squeegee may be formed of stainless steel, a ceramic material or a synthetic resin.