Abstract: A conductive paste comprising a conductive powder, a glass frit substantially free of lead, and an organic vehicle, wherein the glass frit contains 25 to 50 mol % B in terms of B2O3, 25 to 50 mol % Si in terms of SiO2, 7 to 23 mol % Al in terms of Al2O3, 2 to 15 mol % Mg in terms of MgO, 2 to 5 mol % Ba in terms of BaO, one or two selected from the group consisting of 3 to 18 mol % Zn in terms of ZnO, and 3 to 8 mol % Ti in terms of TiO2, based on the total number of moles in terms of the above oxides. According to the present invention, it is possible to provide a lead-free conductive paste having excellent resistance to dissolution in solder and acid resistance as well as being capable of forming fired films having excellent adherence and adhesion to a substrate.

Abstract: A conductive paste comprising a conductive powder, a glass frit substantially free of lead, and an organic vehicle, wherein the glass frit contains 25 to 50 mol % B in terms of B2O3, 25 to 50 mol % Si in terms of SiO2, 7 to 23 mol % Al in terms of Al2O3, 2 to 15 mol % Mg in terms of MgO, 2 to 5 mol % Ba in terms of BaO, one or two selected from the group consisting of 3 to 18 mol % Zn in terms of ZnO, and 3 to 8 mol % Ti in terms of TiO2, based on the total number of moles in terms of the above oxides. According to the present invention, it is possible to provide a lead-free conductive paste having excellent resistance to dissolution in solder and acid resistance as well as being capable of forming fired films having excellent adherence and adhesion to a substrate.