Abstract: An organic electronic device structure, the structure comprising: a substrate; a base layer supported by said substrate and defining the base of a well for solvent-based deposition of organic electronic material; one or more spacer layers formed over said base layer; a bank layer formed over said spacer layer to define a side of said well; and wherein an edge of said well adjacent said base layer is undercut to define a shelf over said base layer, said shelf defining a recess to receive said organic electronic material.

Abstract: An organic electronic device structure, the structure comprising: a substrate; a base layer supported by said substrate and defining the base of a well for solvent-based deposition of organic electronic material; one or more spacer layers formed over said base layer; a bank layer formed over said spacer layer to define a side of said well; and wherein an edge of said well adjacent said base layer is undercut to define a shelf over said base layer, said shelf defining a recess to receive said organic electronic material.

Abstract: This invention generally relates to improved methods of fabricating molecular electronic devices, in particular organic electronic devices such as organic light emitting diodes (OLEDs) by droplet deposition techniques such as ink jet printing. The invention also relates to molecular device substrates fabricated by and/or use in such methods. We describe an optical or optoelectronic device comprising a substrate and a plurality of discrete bank structures disposed on the substrate, wherein: each bank structure defines the perimeter of at least one well; one or more of a charge transporting, charge injecting, light-filtering and light-emitting material is disposed in the well; and at least one bank structure defines the perimeter of at least one well and does not extend to the perimeter of any adjacent well. Thus in embodiments no part of said perimeter defines the bank of more than one well.

Abstract: A composition for ink jet printing an opto-electrical device, the composition comprising: an electroluminescent or charge transporting organic material; and a high boiling point solvent having a boiling point higher than water.

Abstract: An active matrix display comprises a display area of the matrix comprising drive circuitry including a control circuit comprising chiplets outside the display area. The output of the control circuit is distributed among the plurality of chiplets. This arrangement is advantageous in that the chiplets allow for a much smaller fan-in and fan-out structure, thus allowing a much larger percentage of the substrate to be devoted to display area.

Abstract: A display device comprises a plurality of electroluminescent display pixels and a plurality of semiconductor elements (“chiplets”), each pixel being electrically connected to the output of one or more of said semiconductor elements through a via hole in an electrically insulating layer for addressing the plurality of display pixels, and a plurality of colour filters and/or downconverters. The colour filters and/or downconverters and the semiconductor elements are provided on the same surface of the device.

Abstract: An optical sensor array comprises a photo-sensitive area formed by an array of chiplets having individual light-sensitive elements, each element configured to produce a signal or signals in response to incident light. The displacement of a chiplet from a predetermined position is derivable from the output signal or signals of the element or elements associated with the chiplet. The arrangement provides a method of measuring the displacement of at least one chiplet in an active display.

Abstract: An organic optoelectrical device comprising: a substrate; at least one first electrode disposed over the substrate; a layer of bank material disposed over the first electrode and defining a plurality of wells; a layer of organic semi-conductive material disposed in the wells; at least one second electrode disposed over the layer of organic semi-conductive material in the wells; an encapsulant disposed over the at least one second electrode; a layer of the bank material provided at a periphery of the device; and a metallic seal adhering the encapsulant to the layer of bank material at the periphery of the device, the bank material being an inorganic electrically insulating material whereby the substrate, the bank material, the metallic seal and the encapsulant form a seal at the periphery of the device.

Abstract: This invention generally relates to improved methods of fabricating molecular electronic devices, in particular organic electronic devices such as organic light emitting diodes (OLEDs) by droplet deposition techniques such as ink jet printing. The invention also relates to molecular device substrates fabricated by and/or use in such methods. We describe an optical or optoelectronic device comprising a substrate and a plurality of discrete bank structures disposed on the substrate, wherein: each bank structure defines the perimeter of at least one well; one or more of a charge transporting, charge injecting, light-filtering and light-emitting material is disposed in the well; and at least one bank structure defines the perimeter of at least one well and does not extend to the perimeter of any adjacent well. Thus in embodiments no part of said perimeter defines the bank of more than one well.

Abstract: A composition for ink jet printing an opto-electrical device, the composition comprising: an electroluminescent or charge transporting organic material; and a high boiling point solvent having a boiling point higher than water.

Abstract: An organic electronic device structure, the structure comprising: a substrate; a base layer supported by said substrate and defining the base of a well for solvent-based deposition of organic electronic material; one or more spacer layers formed over said base layer; a bank layer formed over said spacer layer to define a side of said well; and wherein an edge of said well adjacent said base layer is undercut to define a shelf over said base layer, said shelf defining a recess to receive said organic electronic material.

Abstract: A method of fabricating a molecular electronic device, the method comprising: fabricating a substrate having a plurality of banks defining wells for the deposition of molecular material; and depositing molecular electronic material into said wells, dissolved in a solvent, using a droplet deposition technique, to fabricate said device; wherein a said bank has a face, defining an edge of said well, at an angle to a base of the well of greater than a contact angle of said solvent with said bank face; and wherein a height of a said bank above a said base of a said well is less than 2 ?m, and more preferably less than 1.5 ?m.

Abstract: An organic optoelectrical device comprising: a substrate; at least one first electrode disposed over the substrate; a layer of bank material disposed over the first electrode and defining a plurality of wells; a layer of organic semi-conductive material disposed in the wells; at least one second electrode disposed over the layer of organic semi-conductive material in the wells; an encapsulant disposed over the at least one second electrode; a layer of the bank material provided at a periphery of the device; and a metallic seal adhering the encapsulant to the layer of bank material at the periphery of the device, the bank material being an inorganic electrically insulating material whereby the substrate, the bank material, the metallic seal and the encapsulant form a seal at the periphery of the device.

Abstract: A method for forming a thin-film resistor, which is composed of silicon, carbon, and chromium, is disclosed. The resistivity of the thin-film resistor, and therefore the resistance and temperature coefficient of resistance (TCR) of the resistor, are tailored to have specific values by varying the elemental composition of the silicon, carbon, and chromium used to form the resistor.

Abstract: A thin-film resistor is formed from silicon, carbon, and chromium. The resistivity of the thin-film resistor, and therefore the resistance and temperature coefficient of resistance (TCR) of the resistor, are tailored to have specific values by varying the elemental composition of the silicon, carbon, and chromium used to form the resistor.