Patents by Inventor Haykel Ben Jamaa
Haykel Ben Jamaa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9915683Abstract: Electrical connection device comprising at least one substrate and one or several first electrical connection elements located on a front face of the electrical connection device such that they can be coupled to contact pads of an electronic device to which the electrical connection device is intended to be connected, each first electrical connection element comprising: at least one support, of which at least one first end is anchored to the substrate such that part of the support is suspended above the front face, the support comprising at least a portion of piezoelectric material located between two electrodes and capable of moving said part of the support in two directions approximately perpendicular to the front face depending on a value of an electrical voltage intended to be applied onto the electrodes; at least one electrical conducting element located on said part of the support.Type: GrantFiled: June 12, 2015Date of Patent: March 13, 2018Assignee: Commissariat à l'énergie atomique et aux énergies alternativesInventors: Haykel Ben Jamaa, Patrice Rey
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Patent number: 9784786Abstract: A simultaneous electrical testing device for TSV interconnection elements passing through a substrate and including one end connected to an integrated testing circuit and another end to a removable connection mechanism assembled to the substrate through an anisotropic conductive glue.Type: GrantFiled: July 11, 2013Date of Patent: October 10, 2017Assignee: Commissariat à l'énergie atomique et aux énergies alternativesInventor: Haykel Ben Jamaa
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Patent number: 9647161Abstract: According to one embodiment, the present invention relates to a method for manufacturing a photovoltaic device comprising a photovoltaic cell or a plurality of photovoltaic cells (PV cells) connected to an electronic integrated circuit having at least one electrical contact area. A stack comprising the PV cell(s) is produced separately from the electronic integrated circuit, the electronic integrated circuit is then transferred to said stack comprising the PV cell(s). During this transfer, connection areas carried by the PV cell(s) are brought into contact with matching connection areas carried by the electronic integrated circuit.Type: GrantFiled: October 28, 2014Date of Patent: May 9, 2017Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVESInventors: Julien Buckley, Haykel Ben Jamaa
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Patent number: 9240394Abstract: An integrated circuit comprises a heat sink devoid of electronic components and interposed between a back side of a bottom electronic chip and an upper exterior side of an encapsulation, the sink comprising a front side placed on the back side of the bottom electronic chip. The back side of the bottom electronic chip comprises pads and the front side of the sink comprises pads mechanically fastened to facing pads of the back side of the bottom electronic chip.Type: GrantFiled: June 23, 2015Date of Patent: January 19, 2016Assignee: Commissariat à l'energie atomique et aux énergies alternativesInventors: Haykel Ben Jamaa, Laurent Fulbert, Sylvie Menezo, Gilles Poupon
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Publication number: 20150380387Abstract: An integrated circuit comprises a heat sink devoid of electronic components and interposed between a back side of a bottom electronic chip and an upper exterior side of an encapsulation, the sink comprising a front side placed on the back side of the bottom electronic chip. The back side of the bottom electronic chip comprises pads and the front side of the sink comprises pads mechanically fastened to facing pads of the back side of the bottom electronic chip.Type: ApplicationFiled: June 23, 2015Publication date: December 31, 2015Inventors: Haykel Ben Jamaa, Laurent Fulbert, Sylvie Menezo, Gilles Poupon
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Publication number: 20150369843Abstract: Electrical connection device comprising at least one substrate and one or several first electrical connection elements located on a front face of the electrical connection device such that they can be coupled to contact pads of an electronic device to which the electrical connection device is intended to be connected, each first electrical connection element comprising: at least one support, of which at least one first end is anchored to the substrate such that part of the support is suspended above the front face, the support comprising at least a portion of piezoelectric material located between two electrodes and capable of moving said part of the support in two directions approximately perpendicular to the front face depending on a value of an electrical voltage intended to be applied onto the electrodes; at least one electrical conducting element located on said part of the support.Type: ApplicationFiled: June 12, 2015Publication date: December 24, 2015Applicant: Commissariat a L'Energie Atomique et aux Energies AlternativesInventors: Haykel BEN JAMAA, Patrice REY
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Publication number: 20150369899Abstract: Method for characterizing an electrical connection device intended to be hybridized to an electronic device and comprising electrical connection elements each intended to be in electrical contact with at least one of a plurality of contact pads of the electronic device which are electrically connected together, including at least one step of selection of a reference electrical connection element from among said electrical connection elements, then, for the or each of the electrical connection elements other than the reference electrical connection element, the implementation of the following steps: application of a reference electric voltage between the reference electrical connection element and said electrical connection element; measurement of an electric current flowing through the reference electrical connection element and said electrical connection element, or of an electrical resistance between the reference electrical connection element and said electrical connection element, by varying the positiType: ApplicationFiled: June 22, 2015Publication date: December 24, 2015Applicant: Commissariat a L'Energie Atomique et aux Energies AlternativesInventor: Haykel BEN JAMAA
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Patent number: 9112492Abstract: A logic module includes a device for implementing a logic function the device including at least one input and at least one output, the output at least partially representing the result of the logic function; at least one first element including at least one resistance state, at least one second element formed by a bipolar resistive memory; the first element and the second element having a common electrode connected to the output.Type: GrantFiled: August 1, 2013Date of Patent: August 18, 2015Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVESInventors: Julien Buckley, Haykel Ben Jamaa
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Patent number: 9028138Abstract: An electronic device includes a heat source, a heat-absorbing cold point, a thermally insulating material for insulating the heat source from the cold point with a conductivity at a use-temperature of electronic device, that is below a thermal-conductivity threshold, and a thermal bridge having first and second ends connected by pads to the heat source and the cold point, and a thermal switch. The thermal bridge extends between the two ends and switches reversibly between conductive and non-conductive states. It includes material of variable thermal conductivity capable of switching over, in response to an addition of energy, between a conductive phase and a resistive phase, and a control module for causing the thermal switch to switch between the conductive state and the resistive state.Type: GrantFiled: December 13, 2012Date of Patent: May 12, 2015Assignee: Commissariat á l'énergie atomique et aux énergies alternativesInventors: Haykel Ben Jamaa, Julien Buckley, Patrick Leduc
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Publication number: 20150115387Abstract: According to one embodiment, the present invention relates to a method for manufacturing a photovoltaic device comprising a photovoltaic cell or a plurality of photovoltaic cells (PV cells) connected to an electronic integrated circuit having at least one electrical contact area. A stack comprising the PV cell(s) is produced separately from the electronic integrated circuit, the electronic integrated circuit is then transferred to said stack comprising the PV cell(s). During this transfer, connection areas carried by the PV cell(s) are brought into contact with matching connection areas carried by the electronic integrated circuit.Type: ApplicationFiled: October 28, 2014Publication date: April 30, 2015Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE ALTInventors: Julien BUCKLEY, Haykel BEN JAMAA
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Publication number: 20150115973Abstract: A simultaneous electrical testing device for TSV interconnection elements passing through a substrate and including one end connected to an integrated testing circuit and another end to a removable connection mechanism assembled to the substrate through an anisotropic conductive glue.Type: ApplicationFiled: July 11, 2013Publication date: April 30, 2015Applicant: Commissariat a l'energie atomique et aux ene altInventor: Haykel Ben Jamaa
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Publication number: 20150035560Abstract: A logic module includes a device for implementing a logic function the device including at least one input and at least one output, the output at least partially representing the result of the logic function; at least one first element including at least one resistance state, at least one second element formed by a bipolar resistive memory; the first element and the second element having a common electrode connected to the output.Type: ApplicationFiled: August 1, 2013Publication date: February 5, 2015Inventors: Julien Buckley, Haykel Ben Jamaa
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Patent number: 8937385Abstract: An electronic component comprising a substrate extending in a plane, having electrical connections to connect the component to a circuit, and having an upper face; an electronic chip arranged on the upper face or inside the substrate and connected to the connections via the substrate, a thick insulating layer forming a package and covering the upper face or at least part of the chip, and having an outer face parallel to the plane; a cavity inside the thick layer, the cavity having a bottom parallel to the plane and a side extending from the bottom to the outer face, the cavity having heat-absorbing material inside that is different from the material forming the thick layer. The heat-absorbing material has a specific heat capacity greater than 1 kJKg?1K?1 at a 25° C. and at 100 kPa. Either a bottom or side of the cavity is covered with a interface layer.Type: GrantFiled: December 6, 2013Date of Patent: January 20, 2015Assignee: Commissariat a l'Energie Atomique et aux Energies AlernativesInventors: Haykel Ben Jamaa, Xavier Baillin, Emmanuel Ollier, Ulrich Soupremanien
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Publication number: 20140160682Abstract: An electronic component comprising a substrate extending in a plane, having electrical connections to connect the component to a circuit, and having an upper face; an electronic chip arranged on the upper face or inside the substrate and connected to the connections via the substrate, a thick insulating layer forming a package and covering the upper face or at least part of the chip, and having an outer face parallel to the plane; a cavity inside the thick layer, the cavity having a bottom parallel to the plane and a side extending from the bottom to the outer face, the cavity having heat-absorbing material inside that is different from the material forming the thick layer. The heat-absorbing material has a specific heat capacity greater than 1 kJKg?1K?1 at a 25° C. and at 100 kPa. Either a bottom or side of the cavity is covered with a interface layer.Type: ApplicationFiled: December 6, 2013Publication date: June 12, 2014Inventors: Haykel Ben Jamaa, Xavier Baillin, Emmanuel Ollier, Ulrich Soupremanien