Abstract: A flat evaporator is provided. In the evaporator, a common chamber formed on a substrate with a predetermined diameter and depth for containing a coolant is divided into a vaporization cavity region, a capillary region surrounding the vaporization cavity region, and a manifold region surrounding the capillary region. The capillary region has a capillarity generator capable of generating capillary action, and a top plate is configured to include an exhaust unit including a gas collector to exhaust a gas coolant generated in the vaporization cavity region. The evaporator can be implemented as a small and thin cooling device for performing cooling without external power. Furthermore, the evaporator can effectively prevent degradation of fluid flow force due to coexistence of gas and liquid by isolating a liquid coolant from a vaporized coolant by a capillary region, thereby significantly improving heat exchange characteristics.

Abstract: A flat evaporator is provided. In the evaporator, a common chamber formed on a substrate with a predetermined diameter and depth for containing a coolant is divided into a vaporization cavity region, a capillary region surrounding the vaporization cavity region, and a manifold region surrounding the capillary region. The capillary region has a capillarity generator capable of generating capillary action, and a top plate is configured to include an exhaust unit including a gas collector to exhaust a gas coolant generated in the vaporization cavity region. The evaporator can be implemented as a small and thin cooling device for performing cooling without external power. Furthermore, the evaporator can effectively prevent degradation of fluid flow force due to coexistence of gas and liquid by isolating a liquid coolant from a vaporized coolant by a capillary region, thereby significantly improving heat exchange characteristics.

Abstract: A cooling device using a capillary pumped loop (CPL), including a lower board having a looped groove formed on the upper surface, an upper board combined with the upper surface of the lower board to cover the groove, so that the flow path of a working fluid is provided, an evaporator which is provided on the flow path, and has a plurality of fine evaporating fins incorporated into the upper or lower board, and a condenser which is provided on the flow path at a predetermined distance apart from the evaporator, and has a plurality of fine condensing fins incorporated into the upper or lower board. Accordingly, a thin and small cooling device capable of performing cooling without external power can be obtained.

Abstract: A cooling device with micro cooling fins is provided. The cooling device includes a substrate, a plurality of vibrating type cooling fins extending from the substrate, and a blast fan for ventilating the substrate to cool the substrate and the vibrating type cooling fins and for causing the vibrating type cooling fins to vibrate. Accordingly, micro cooling fins formed on the surface of a substrate change the flowing path of the air and improve the performance of heat transfer near the surface of the substrate due to their vibration. In other words, the resistance to heat transfer is decreased and the performance of heat transfer is improved by disturbing the formation of a heat boundary layer, which is formed on a smooth surface. Since the cooling device provides improved heat transfer performance compared to an existing cooling device, an area and volume for heat transfer can be decreased so that the cooling device can be miniaturized.

Abstract: A cooling device with micro cooling fins is provided. The cooling device includes a substrate, a plurality of vibrating type cooling fins extending from the substrate, and a blast fan for ventilating the substrate to cool the substrate and the vibrating type cooling fins and for causing the vibrating type cooling fins to vibrate. Accordingly, micro cooling fins formed on the surface of a substrate change the flowing path of the air and improve the performance of heat transfer near the surface of the substrate due to their vibration. In other words, the resistance to heat transfer is decreased and the performance of heat transfer is improved by disturbing the formation of a heat boundary layer, which is formed on a smooth surface. Since the cooling device provides improved heat transfer performance compared to an existing cooling device, an area and volume for heat transfer can be decreased so that the cooling device can be miniaturized.

Abstract: A cooling device with micro cooling fins is provided. The cooling device includes a substrate, a plurality of vibrating type cooling fins extending from the substrate, and a blast fan for ventilating the substrate to cool the substrate and the vibrating type cooling fins and for causing the vibrating type cooling fins to vibrate. Accordingly, micro cooling fins formed on the surface of a substrate change the flowing path of the air and improve the performance of heat transfer near the surface of the substrate due to their vibration. In other words, the resistance to heat transfer is decreased and the performance of heat transfer is improved by disturbing the formation of a heat boundary layer, which is formed on a smooth surface. Since the cooling device provides improved heat transfer performance compared to an existing cooling device, an area and volume for heat transfer can be decreased so that the cooling device can be miniaturized.