Patents by Inventor Hazel D Schofield

Hazel D Schofield has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device packages with substrates for redistributing semiconductor device electrodes
    Patent number: 7745930
    Abstract: A semiconductor device package includes a substrate with one or more pads and at least one semiconductor device that has one or more of its electrodes electrically connected to the substrate pads. The package also includes one or more terminals in electrical connection with the substrate pads and that provide for external connection to the device.
    Type: Grant
    Filed: April 24, 2006
    Date of Patent: June 29, 2010
    Assignee: International Rectifier Corporation
    Inventors: Norman Glyn Connah, Mark Pavier, Phillip Adamson, Hazel D Schofield
  • Chip scale surface mounted device and process of manufacture
    Patent number: 7122887
    Abstract: A chip scale package has a semiconductor MOSFET die which has a top electrode surface covered with a layer of a photosensitive liquid epoxy which is photolithographically patterned to expose portions of the electrode surface and to act as a passivation layer and as a solder mask. A solderable contact layer is then formed over the passivation layer. The individual die are mounted drain side down in a metal clip or can with the drain electrode disposed coplanar with a flange extending from the can bottom.
    Type: Grant
    Filed: August 5, 2003
    Date of Patent: October 17, 2006
    Assignee: International Rectifier Corporation
    Inventors: Martin Standing, Hazel D Schofield