Patents by Inventor Hazelton P. Avery

Hazelton P. Avery has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250233365
    Abstract: High-speed connectors and connector assemblies that include structures for alignment and/or improved thermal performance.
    Type: Application
    Filed: February 20, 2025
    Publication date: July 17, 2025
    Inventors: Hazelton P. Avery, Li Zhuang, Pu Xie, Chia Hung Mou, Jerry Shubert, Andrew Kolak, Daniel Wenzel, Dominic Steier, Scott D. Sommers
  • Patent number: 12249795
    Abstract: High-speed connectors and connector assemblies that include structures for alignment and/or improved thermal performance. In one example, a connector assembly, comprising: a housing comprising a port; a wafer assembly with contacts positioned in the port of the housing, the wafer assembly comprising a row of conductors, the row of conductors comprising a plurality of communication signal conductors and a plurality of ground conductors arranged in the row of conductors, wherein each communication signal conductor is positioned next to a ground conductor among the plurality of ground conductors in the row of conductors; and a ground path assembly comprising the plurality of ground conductors, a conductive ground shield, and a metal ground shield insert that is stitch mated with the conductive ground shield.
    Type: Grant
    Filed: April 14, 2021
    Date of Patent: March 11, 2025
    Assignee: Molex, LLC
    Inventors: Hazelton P. Avery, Li Zhuang, Pu Xie, Chia Hung Mou, Jerry Shubert, Andrew Kolak, Daniel Wenzel, Dominic Steier, Scott D. Sommers
  • Patent number: 12184010
    Abstract: Examples of connectors, connector assemblies, and wafer assemblies for improved shielding and thermal performance are described. In one example, a wafer assembly includes a ground path assembly and a row of conductors. The ground path assembly includes a first ground shield and a second ground shield. The row of conductors includes a plurality of communication signal conductors and a plurality of ground conductors arranged in the row of conductors. The first ground shield extends along a first pair of communication signal conductors among the plurality of communication signal conductors and the second ground shield extends along a second pair of the communication signal conductors among the plurality of communication signal conductors.
    Type: Grant
    Filed: May 8, 2023
    Date of Patent: December 31, 2024
    Assignee: Molex, LLC
    Inventors: Andrew Kolak, Dominic Steier, Li Zhuang, Scott Sommers, Hazelton P. Avery, Pu Xie, Chia Hung Mou, Jerry Shubert, Daniel Wenzel
  • Patent number: 11088480
    Abstract: A connector is disclosed that includes a set of wafers formed of terminals supported by an insulative frame. The set of wafers can be positioned in a cage without a housing. Card slot members are aligned with contacts of the terminals. In an embodiment a connector can include a wafer that supports two rows of terminals on both sides of a card slot. At least some of the terminals (553) include a contact (553b) at one end which is over molded with an insulative material. These contacts are over molded except for the end (553a) of the terminal which is left exposed.
    Type: Grant
    Filed: June 12, 2018
    Date of Patent: August 10, 2021
    Assignee: Molex, LLC
    Inventor: Hazelton P. Avery
  • Patent number: 10522931
    Abstract: A connector assembly is provided, which includes a cage that defines a port and a card slot positioned in the port. Also included is a wafer set aligned with the card slot, the wafer set including a plurality of wafers that each support at least four terminals. The terminals are arranged so that two rows of contacts are provided, one row on a first side and one row on a second side of the card slot. Each wafer of the plurality of wafers includes an insulative frame, each terminal includes a beam portion cantilevered from the insulative frame supporting that terminal, and the cantilevered beam portion of at least one terminal of the at least four terminals has a molded material thereon.
    Type: Grant
    Filed: July 24, 2018
    Date of Patent: December 31, 2019
    Assignee: Molex, LLC
    Inventors: Hazelton P. Avery, Pu Xie, Philip J. Dambach, Li Zhuang
  • Publication number: 20190036263
    Abstract: A connector assembly is provided, which includes a cage that defines a port and a card slot positioned in the port. Also included is a wafer set aligned with the card slot, the wafer set including a plurality of wafers that each support at least four terminals. The terminals are arranged so that two rows of contacts are provided, one row on a first side and one row on a second side of the card slot. Each wafer of the plurality of wafers includes an insulative frame, each terminal includes a beam portion cantilevered from the insulative frame supporting that terminal, and the cantilevered beam portion of at least one terminal of the at least four terminals has a molded material thereon.
    Type: Application
    Filed: July 24, 2018
    Publication date: January 31, 2019
    Applicant: Molex, LLC
    Inventors: Hazelton P. Avery, Pu Xie, Philip J. Dambach, Li Zhuang
  • Patent number: 10027061
    Abstract: A socket includes a housing that supports terminal bricks that can contain one or more terminals. The terminal bricks are inserted into apertures in the housing. The location of the terminal bricks can be adjusted separate from a side of the housing, thus providing the potential to improve coplanarity of the terminals in the socket.
    Type: Grant
    Filed: March 2, 2012
    Date of Patent: July 17, 2018
    Assignee: Molex, LLC
    Inventors: Hazelton P. Avery, Jerry D. Kachlic, David L. Brunker
  • Publication number: 20130330969
    Abstract: A socket includes a housing that supports terminal bricks that can contain one or more terminals. The terminal bricks are inserted into apertures in the housing. The location of the terminal bricks can be adjusted separate from a side of the housing, thus providing the potential to improve coplanarity of the terminals in the socket.
    Type: Application
    Filed: March 2, 2012
    Publication date: December 12, 2013
    Inventors: Hazelton P. Avery, Jerry D. Kachlic, David L. Brunker
  • Patent number: 7649146
    Abstract: Stacked receptacles in a connector that each provide side-by-side differential signal contacts, are attached to a circuit board without additional width to accommodate multiple layers of differential signals by using connector wafer inserts that rotate the side-by-side positioned differential signal contacts to front-to-back contacts.
    Type: Grant
    Filed: September 14, 2007
    Date of Patent: January 19, 2010
    Assignee: Molex Incorporated
    Inventors: Hazelton P. Avery, Patrick R. Casher, Richard A. Nelson, Kent E. Regnier
  • Patent number: 7534142
    Abstract: Stacked receptacles in a connector that each provide side-by-side differential signal contacts, are attached to a circuit board without additional width to accommodate multiple layers of differential signals by using connector wafer inserts that rotate the side-by-side positioned differential signal contacts to front-to-back contacts.
    Type: Grant
    Filed: September 8, 2008
    Date of Patent: May 19, 2009
    Assignee: Molex Incorporated
    Inventors: Hazelton P. Avery, Patrick R. Casher, Richard A. Nelson, Kent E. Regnier
  • Patent number: 7513781
    Abstract: An improved heating element connector assembly includes an insulative, rectangular frame with a central opening, and a plurality of conductive terminals which are press fit into openings in the frame. The terminals are spaced apart from each other lengthwise of two opposing sidewalls of the frame, and pairs of terminals are aligned with each other between the two sidewalls. A plurality of conductive strips are held together in an assembly and the ends of the strips are interconnected along two spaced apart lines by carrier members that may be molded over the ends of the conductive strips. The carrier members extend down into cavities on the frame and terminals are pushed into the cavities to bear against the ends of the strips and effect an electrical connection between the terminals and the strips.
    Type: Grant
    Filed: December 27, 2006
    Date of Patent: April 7, 2009
    Assignees: Molex Incorporated, Alexza Pharmaceuticals, Inc.
    Inventors: Charles Galauner, Gregory Menn, Richard A. Nelson, Hazelton P. Avery, Timothy E. Purkis, Richard A. Faje, Ryan D. Timmons, Andrew J.G. Kelly, Martin J. Wensley
  • Patent number: 7494344
    Abstract: An improved heating element connector assembly includes an insulative, rectangular frame with a central opening and a plurality of conductive terminals which are press fit into openings in the frame. The terminals are spaced apart from each other lengthwise of two opposing sidewalls of the frame, and pairs of terminals are aligned with each other between the two sidewalls. A plurality of conductive strips extend across the frame opening to interconnect the pairs of terminals together. The terminals include compliant pin tail portions for receipt by corresponding holes formed in a circuit board of the assembly and deformable head portions for crimping onto the conductive strips.
    Type: Grant
    Filed: December 27, 2006
    Date of Patent: February 24, 2009
    Assignees: Molex Incorporated, Alexza Pharmaceuticals, Inc.
    Inventors: Charles Galauner, Gregory Menn, Richard A. Nelson, Hazelton P. Avery, Timothy E. Purkis, Richard A. Faje
  • Publication number: 20090011620
    Abstract: Stacked receptacles in a connector that each provide side-by-side differential signal contacts, are attached to a circuit board without additional width to accommodate multiple layers of differential signals by using connector wafer inserts that rotate the side-by-side positioned differential signal contacts to front-to-back contacts.
    Type: Application
    Filed: September 8, 2008
    Publication date: January 8, 2009
    Applicant: MOLEX INCORPORATED
    Inventors: Hazelton P. Avery, Patrick R. Casher, Richard A. Nelson, Kent E. Regnier
  • Patent number: 7422483
    Abstract: Stacked receptacles in a connector that each provide side-by-side differential signal contacts, are attached to a circuit board without additional width to accommodate multiple layers of differential signals by using connector wafer inserts that rotate the side-by-side positioned differential signal contacts to front-to-back contacts.
    Type: Grant
    Filed: February 22, 2006
    Date of Patent: September 9, 2008
    Assignee: Molex Incorproated
    Inventors: Hazelton P. Avery, Patrick R. Casher, Richard A. Nelson, Kent E. Regnier
  • Publication number: 20080156325
    Abstract: An improved heating element connector assembly includes an insulative, rectangular frame with a central opening, and a plurality of conductive terminals which are press fit into openings in the frame. The terminals are spaced apart from each other lengthwise of two opposing sidewalls of the frame, and pairs of terminals are aligned with each other between the two sidewalls. A plurality of conductive strips are held together in an assembly and the ends of the strips are interconnected along two spaced apart lines by carrier members that may be molded over the ends of the conductive strips. The carrier members extend down into cavities on the frame and terminals are pushed into the cavities to bear against the ends of the strips and effect an electrical connection between the terminals and the strips.
    Type: Application
    Filed: December 27, 2006
    Publication date: July 3, 2008
    Inventors: Charles Galauner, Gregory Menn, Richard A. Nelson, Hazelton P. Avery, Timothy E. Purkis, Richard A. Faje
  • Patent number: 6979215
    Abstract: A connector uses a plurality of individual terminal assemblies to form a high-density connector. The terminal assemblies all have insulative body portions that support arrays of signal terminals and ground terminals or ground members. The terminals all have their own associated body portions which are supported by the insulative body portions and contact portions that extend out from a front, or mating face, of the assemblies. The terminal contact portions and include flexing portions formed therewith which are disposed between the terminal body and contact portions. The terminals further include insulative support members that are applied to the terminals and which serve to define the contact and flexing portions of the terminals. The support members are fixed within a carrier, such as a shroud member, which is not attached to any one portion of the connector.
    Type: Grant
    Filed: November 27, 2002
    Date of Patent: December 27, 2005
    Assignee: Molex Incorporated
    Inventors: Hazelton P. Avery, Kathleen A. Sweeney, Daniel B. McGowen, Richard A. Nelson, Galen F. Fromm, Gary Humbert
  • Patent number: 6851980
    Abstract: A connector assembly is suitable for connecting circuit boards together. The connector assembly includes a series of ground and signal terminal sets assembled in composite wafers that may be held within a housing. The ground terminals include pairs of flat contact blades that are aligned together in abutting contact to form a column of ground contacts blades of double width, and the signal terminals are arranged in sets on opposite sides of the ground terminal blades and the signal terminals have general L-shapes that are arranged in sets of two pairs of contacts to form a cruciform pattern. One of the two connectors has solid L-shaped contacts, while the other of the two connectors has a pair of split contact arms that lie and extend in two different planes project from an associated terminal body in a manner so as to mate with the contact portions of the solid L-shaped contacts. The use of L-shaped contacts provides a redundant contact mating arrangement.
    Type: Grant
    Filed: November 29, 2002
    Date of Patent: February 8, 2005
    Assignee: Molex Incorporated
    Inventors: Richard A. Nelson, Kathleen A. Sweeney, Hazelton P. Avery, Galen F. Fromm, Daniel B. McGowan
  • Patent number: 6749468
    Abstract: Connector assemblies having terminal assemblies which are arranged in side-by-side order are maintained in a group with a desired spacing between the terminal assemblies. The terminals fixed in place at a first point within insulative connector body portions. The terminals assemblies are fixed together by a alignment bar along their lower edges, with the bar having engagement lugs that are received within slots formed in the housings of the terminal assemblies, and they are fixed along their upper edges by a hollow retainer that has a series of slots formed in an interior surface thereof. The slots and the alignment bar are aligned together so that the spacing between adjacent terminal assemblies is even.
    Type: Grant
    Filed: November 29, 2002
    Date of Patent: June 15, 2004
    Assignee: Molex Incorporated
    Inventor: Hazelton P. Avery
  • Patent number: 6746278
    Abstract: A high-density connector utilizes a plurality of terminal assemblies that are assembled together into a block, or single unit, to form a connector. Each terminal assembly of the connector utilizes a plurality of conductive terminals having contact portions for mating with an opposing connector, and body portions held within an insulative body portion of the assembly. The terminal assemblies support arrays of terminals arranged in a specific order of signal-ground-signal arrays. The terminal assemblies have at least two insulative housing portions that support the signal terminal arrays and an intervening ground terminal array, which may or may not be supported by an associated insulative housing. The ground members have a series of grounding tabs formed therewith with extend out from the plane of the ground members, on opposite sides thereof into contact with ground reference terminals of the signal terminal arrays.
    Type: Grant
    Filed: November 29, 2002
    Date of Patent: June 8, 2004
    Assignee: Molex Incorporated
    Inventors: Richard A. Nelson, Gary Humbert, Kathleen A. Sweeney, Hazelton P. Avery, Daniel B. McGowan, Galen F. Fromm
  • Patent number: RE43330
    Abstract: Stacked receptacles in a connector that each provide side-by-side differential signal contacts, are attached to a circuit board without additional width to accommodate multiple layers of differential signals by using connector wafer inserts that rotate the side-by-side positioned differential signal contacts to front-to-back contacts, the circuit board including a substrate having a plurality of openings to make electrical contact with conductive terminal tail portion inserted therein, the openings being divided into first and second groups of openings, the first group of openings receiving differential signal terminal tails therein and the second group of openings receiving ground terminal tail therein, when a connector is mounted to said circuit board.
    Type: Grant
    Filed: December 23, 2010
    Date of Patent: May 1, 2012
    Assignee: Molex Incorporated
    Inventors: Hazelton P. Avery, Patrick R. Casher, Richard A. Nelson, Kent E. Regnier