Abstract: The present invention is a molded Hybrid Integrated Circuit package in which a carrier substrate with a various circuit elements including an integrated circuit is supported within a resilient cradle formed by down-set and compliant portions of leads arranged in a quad configuration around the periphery of the carrier substrate, with ends of the down-set portions being secured to pads arranged on the periphery of the carrier substrate. Prior to the assembly with carrier substrate and molding of the resultant subassembly, the leads form a part of a lead frame including elongated bar and dam-bar on each of the quad sides interconnecting end and central portions, respectively, of the leads, and an interconnecting array of connecting links and bridges at the ends of the dam-bars.

Abstract: An electronic oscillator wafer crystal (42, 54) mounting assembly (10, 48) includes an insulating thermoplastic mounting block (12) with top and bottom faces (16, 18). Three terminals (22, 50), radially spaced at 90 degrees with respect to each other around the center of the block have shank segments (24) pressed into receiving apertures (18) in the bottom face. Fingers (26) of the terminals extend around the edge of the block to hold the crystal spaced from, and closely adjacent to the top face by supporting it at a perimeter portion on a step-shaped crystal support segment (36) of the finger. A segment (30) of the fingers adjacent and parallel to the bottom face is adapted for conductive attachment to a circuit.

Abstract: A solder bearing hybrid integrated circuit terminal 16 is formed from a metal strip so that one finger 26 of the clip portion 18 is formed by the strip being folded back on itself. A second opposing finger 28 spaced from the first finger 26 includes in its end portion a slot 30 which extends around the free end of the finger 28 to form a solder preform clamp 34 by a reverse curving of the metal strip about the free end of the second finger 28. A stem 20 extends from the clip 18 opposite and parallel to the direction of the fingers 26, 28. This permits clearer access to the substrate 12 to which the terminal 16 is assembled and soldered. The stem 20 may later be bent at right angles to the substrate 12 for assembling the finished device 44 to a circuit board. Stop tab 36 are provided at the bottom of the recess between the fingers 26,28 for spacing the edge of the substrate 12 from the metal strip which forms the clip 18 of the terminal 16.

Abstract: A dual in-line package miniature electrical switch module has its active members, the contact members and sliding actuators, mounted on a unitary frame member to minimize misalignment problems. The cover serves primarily a protective function. The contacts have integral terminal pins and clamp to an edge of the frame to simplify assembly. A substrate having an electrical circuit pattern applied on one or both major surfaces can be contacted and clamped by the contact members against the bottom of the frame to form an integral switch and circuit module, such as an attenuator switch. Two or more sliding actuators may be rigidly interconnected to form a gang unit.

Abstract: An improved fuse cap (11) which grasps an end of an elongated fuse (13) and mates with a fuse block (12) is disclosed. The fuse cap comprises a spring-loaded electrical terminal structure (32) which can be readily assembled into the fuse cap housing (31). The terminal structure serially connects the fuse element between the terminals (24,28) in the fuse block and provides connection to an alarm terminal (25) in the block when the fuse overloads.

Abstract: Apparatus for winding a coil by feeding wire from a wire guide to a rotating bobbin and for terminating the coil by orbiting the wire guide about terminals projecting from the bobbin is made more versatile by mounting the wire guide so that it can be rotated from a position in which it feeds wire in a direction perpendicular to the bobbin axis to a position in which it feeds wire in a direction parallel to the bobbin axis. This construction permits termination of the coils upon terminals projecting from the bobbin in a direction parallel to the bobbin axis as well as those perpendicular to the bobbin axis. Introducing an offset portion to the spindle upon which the bobbin is rotated permits the wire guide to be brought into a position in which it can wrap a terminal projecting parallel to the coil axis on the inner or spindle side of the bobbin.