Patents by Inventor Hazrul Aland Abd Hamid

Hazrul Aland Abd Hamid has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9704786
    Abstract: A lead frame strip having a plurality of unit lead frames is provided. Each of the unit lead frames includes a die paddle, a plurality of leads extending away from the die paddle, and a peripheral ring delineating interior portions of the leads from exterior portions of the leads. An adhesion promoter plating material is selectively plated within a package outline area of a first unit lead frame. The die paddle and the interior portions of the leads are disposed within the package outline area and the exterior portions of the leads are disposed outside of the package outline area. Wire bond sides are processed such that, after selectively plating the adhesion promoter plating material, the wire bond sites are substantially devoid of the adhesion promoter plating material. The wire bond sites are disposed within the package outline area and are spaced apart from the peripheral ring.
    Type: Grant
    Filed: September 25, 2015
    Date of Patent: July 11, 2017
    Assignee: Infineon Technologies AG
    Inventors: Jochen Dangelmaier, Kim Huat Hoa, Hazrul Aland Abd Hamid, Andreas Allmeier, Dietmar Lang