Patents by Inventor He Chu

He Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PRINTED CIRCUIT BOARD
    Publication number: 20180332699
    Abstract: A printed circuit board has a copper clad laminate and a plurality of holes. The copper clad laminate for dissipating heats generated from a chip when the chip operates has a plurality of solder paste disposed areas. The plurality of holes situate on the copper clad laminate and each of the holes does not communicate with others, wherein the plurality of holes are nonconductors. Each of the solder paste disposed areas is surrounded by the plurality of holes and each solder paste disposed areas is surrounded by at least two holes.
    Type: Application
    Filed: July 17, 2018
    Publication date: November 15, 2018
    Applicant: UNLIMITER MFA CO., LTD.
    Inventors: KUO-PING YANG, NEO BOB CHIH YUNG YANG, LIN-HE CHU, WEN-CHIANG WU, SHIH-KANG HUANG, YI-YEN CHIANG
  • PRINTED CIRCUIT BOARD MANUFACTURING METHOD AND PRINTED CIRCUIT BOARD THEREOF
    Publication number: 20180206346
    Abstract: A printed circuit board manufacturing method and a printed circuit board thereof are disclosed. The printed circuit board manufacturing method includes the steps of: providing a dielectric; performing a layout process on a surface of the dielectric; drilling the dielectric to form at least one plated through hole, wherein the at least one plated through hole has an annular ring disposed on the surface of the dielectric; and coating a solder resist on the surface of the dielectric to cover at least one part of the annular ring.
    Type: Application
    Filed: October 18, 2017
    Publication date: July 19, 2018
    Inventors: Kuo-Ping YANG, Yi-Yen CHIANG, Neo Bob Chih-Yung YOUNG, Lin-He CHU, Wen-Chiang WU
  • CIRCUIT BOARD MODULE AND CHIP MODULE
    Publication number: 20180007790
    Abstract: A circuit board module is disclosed. The circuit board module includes a circuit board and an adaption board. The adaption board is placed on the circuit board such that a chip can be placed thereon. The chip is electrically connected to the circuit board by the adaption board.
    Type: Application
    Filed: November 23, 2016
    Publication date: January 4, 2018
    Inventors: Kuo-Ping YANG, Neo Bob Chih-Yung YOUNG, Lin-He CHU, Wen-Chiang WU, Shih-Kang HUANG, Yi-Yen CHIANG
  • PRINTED CIRCUIT BOARD
    Publication number: 20170290138
    Abstract: A printed circuit board has a copper clad laminate and a plurality of holes. The copper clad laminate for dissipating heats generated from a chip when the chip operates has a plurality of solder paste disposed areas. The plurality of holes situate on the copper clad laminate and each of the holes does not communicate with others, wherein the plurality of holes are nonconductors. Each of the solder paste disposed areas is surrounded by the plurality of holes and each solder paste disposed areas is surrounded by at least two holes.
    Type: Application
    Filed: February 21, 2017
    Publication date: October 5, 2017
    Inventors: Kuo-Ping YANG, Neo Bob Chih-Yung YOUNG, Lin-He CHU, Wen-Chiang WU, Shih-Kang HUANG, Yi-Yen CHIANG
  • Method, apparatus and system for reverting FAT cluster number to file ID and offset of non-FAT flash file system
    Patent number: 8255612
    Abstract: A device includes a processor connected to a memory. The device further includes a module having a process. The module is integrated in a memory file manager (MFM). The process operates to allow an external computer access to MFM volumes in the memory. A method includes reverting a file allocating table (FAT) cluster number to a file ID and file offset of a non-FAT flash memory file system.
    Type: Grant
    Filed: August 12, 2008
    Date of Patent: August 28, 2012
    Assignee: Intel Corporation
    Inventor: He Chu
  • METHOD, APPARATUS AND SYSTEM FOR REVERTING FAT CLUSTER NUMBER TO FILE ID AND OFFSET OF NON-FAT FLASH FILE SYSTEM
    Publication number: 20080301195
    Abstract: A device includes a processor connected to a memory. The device further includes a module having a process. The module is integrated in a memory file manager (MFM). The process operates to allow an external computer access to MFM volumes in the memory. A method includes reverting a file allocating table (FAT) cluster number to a file ID and file offset of a non-FAT flash memory file system.
    Type: Application
    Filed: August 12, 2008
    Publication date: December 4, 2008
    Inventor: He Chu
  • Method, apparatus and system for reverting FAT cluster number to file ID and offset of non-FAT flash file system
    Patent number: 7426606
    Abstract: A device includes a processor connected to a memory. The device further includes a module having a process. The module is integrated in a Multimedia File Manager (MFM). The process operates to allow an external computer access to MFM volumes in the memory. A method includes reverting a file allocating table (FAT) cluster number to a file ID and file offset of a non-FAT flash memory file system.
    Type: Grant
    Filed: March 31, 2006
    Date of Patent: September 16, 2008
    Assignee: Intel Corporation
    Inventor: He Chu
  • Method, apparatus and system for reverting FAT cluster number to file ID and offset of non-FAT flash file system
    Publication number: 20070233936
    Abstract: A device includes a processor connected to a memory. The device further includes a module having a process. The module is integrated in a memory file manager (MFM). The process operates to allow an external computer access to MFM volumes in the memory. A method includes reverting a file allocating table (FAT) cluster number to a file ID and file offset of a non-FAT flash memory file system.
    Type: Application
    Filed: March 31, 2006
    Publication date: October 4, 2007
    Inventor: He Chu