Patents by Inventor Hea-do Hwang

Hea-do Hwang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7102096
    Abstract: A method and apparatus for electric-discharge machining a turbine blade are provided. The method includes the steps of: a) preparing a disc material divided into an first portion and a second portion on a basis of a symmetrical line, b) fixing the disc material, with the first portion facing upward, c) forming an initial profile of at least one of the plurality of blades at the first portion of the disc material using at least two roughing tool electrodes to concurrently form a roughing space at the first portion, d) leading at least two finishing tool electrodes into the roughing space to concurrently perform precise machining of the blade, e) turning over the disc material, fixing the disc material and repeating steps c) and d) on the second portion.
    Type: Grant
    Filed: July 26, 2005
    Date of Patent: September 5, 2006
    Assignee: Samsung Techwin Co., Ltd.
    Inventor: Hea-do Hwang
  • Publication number: 20060169675
    Abstract: A method and apparatus for electric-discharge machining a turbine blade are provided. The method includes the steps of: a) preparing a disc material divided into an first portion and a second portion on a basis of a symmetrical line, b) fixing the disc material, with the first portion facing upward, c) forming an initial profile of at least one of the plurality of blades at the first portion of the disc material using at least two roughing tool electrodes to concurrently form a roughing space at the first portion, d) leading at least two finishing tool electrodes into the roughing space to concurrently perform precise machining of the blade, e) turning over the disc material, fixing the disc material and repeating steps c) and d) on the second portion.
    Type: Application
    Filed: July 26, 2005
    Publication date: August 3, 2006
    Applicant: Samsung Techwin Co., Ltd.
    Inventor: Hea-do Hwang